JP2002036079A - Method and device for polishing polished object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for polishing a polished object capable of preventing a trace by a chuck from being formed only on one surface of the polished object. SOLUTION: One surface of the polished object 25 is held on a polished object holding member 17 and moved between the polished object holding member 17 and one of polishing members 1 to allow the lower surface side chamfered part of the polished object 25 to abut on the polishing pad of the polishing member 1. The polished object holding member 17 and the polishing member 1 are rotated to polish the lower surface side chamfered part 26 of the polished object 25. Then, the polished object holding member 17 and the other polishing member 10 are moved to allow the chamfered part 27 of the polished object 25 on the upper surface side to abut on the polishing pad 15 of the other polishing member 10. The polished object holding member 17 and the other polishing member 10 are rotated to polish the upper surface side chamfered part 27 of the polished object 25.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for polishing an object to be polished, and more particularly, to an object to be polished which is effective for polishing a chamfered portion of a disk-shaped object to be polished such as a silicon wafer. And a polishing apparatus.

[0002]

2. Description of the Related Art Japanese Patent Application Laid-Open No. Hei 10-29142 discloses an example of a polishing method for polishing a chamfered portion of an outer peripheral portion of a disk-shaped object such as a silicon wafer. In this polishing method, a chamfered portion of an outer peripheral portion of a disc-shaped semiconductor wafer, which is an object to be polished, is fixed to a concave polishing surface of a polishing table by suction, sticking, or the like, and pressed. In this state, the polishing table and the chuck are relatively rotated to polish the chamfered portion on the outer peripheral portion of the semiconductor wafer.

However, in the polishing method having such a structure, when polishing the chamfers on the upper and lower surfaces of the outer peripheral portion of the semiconductor wafer, first, the upper surface of the semiconductor wafer is fixed to the chuck and the lower surface of the outer peripheral portion is fixed. After that, the chamfer on the upper surface side of the outer peripheral portion must be polished by turning the semiconductor wafer upside down and fixing the lower surface to the chuck. For this reason, traces such as chucking traces and sticking traces by the chuck remain on the upper and lower surfaces of the semiconductor wafer, which affect subsequent processes, and the production efficiency is significantly reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and is intended to provide a structure in which traces such as suction traces and sticking traces are left on only one surface of an object to be polished. Accordingly, it is an object of the present invention to provide a polishing method and a polishing apparatus for an object to be polished, which can significantly increase production efficiency without affecting subsequent steps.

[0005]

In order to achieve the above object, a method for polishing an object to be polished according to the present invention comprises the steps of: In this method, a chamfered portion on one side is polished by one polishing member, and thereafter, a chamfered portion on the other surface side of the object to be polished is polished by the other polishing member. Further, one surface of the object to be polished is held by the object to be polished holding member, and in this state, one chamfered portion of the object to be polished is polished by one of the polishing members. A means for moving between the polishing member and the other polishing member so as to polish the other chamfered portion of the object to be polished with the other polishing member is employed. Furthermore, means for adjusting the inclination of one of the polishing member holding members with respect to the other polishing member is adopted. Furthermore, one surface of the object to be polished is held by one member to be polished object holding member, and in this state, one chamfered portion of the object to be polished is polished by one polishing member,
Thereafter, the object to be polished is removed from the one member to be polished, and one surface of the object to be polished is again held by the other member to be polished, and in this state, the other chamfered portion of the object to be polished is removed. A means for polishing with the other polishing member is employed.
Further, a means for adjusting the inclination of the one polished work holding member with respect to one polishing member and the inclination of the other polished work holding member with respect to the other polishing member is adopted. Also, the polishing apparatus according to the present invention is provided so as to be movable and rotatable between one polishing member having at least a part of the inner surface formed on the polishing surface and the one polishing member, and is provided with a tip end portion. A polished object holding member capable of holding one surface of the polished object, the other being provided so as to be movable and rotatable between the polished object holding member and at least a part of the inner surface formed on the polished surface Means having the above polishing member. Furthermore, at least a part of the inner surface is formed on the polishing surface, and one of the polishing members is provided so as to be movable and rotatable between the one polishing member, and one end of the object to be polished is provided at the tip. The polished object holding member that can be held and the one polished member and the polished object holding member are provided so as to be movable and rotatable between the polished object holding member, and the other of which at least a part of the inner surface is formed on the polished surface. A means having a polishing member is employed. Further, means for adjusting the inclination of the object-to-be-polished holding member with respect to the one polishing member and the other polishing member is adopted. Further, at least a part of the inner surface is formed on the polishing surface, and one of the polishing members is provided so as to be movable and rotatable between the one polishing member, and one end of the object to be polished is provided at the tip. One of the polished object holding members that can be held, and the other polishing member, at least a part of the inner surface of which is formed on the polishing surface, are provided so as to be movable and rotatable between the other polishing member,
Means is provided in which the tip has a member to be polished that can hold one surface of the object to be polished and another member to be polished. Further, means for adjusting the inclination of the one polished work holding member with respect to the one polishing member and the inclination of the other polished work holding member with respect to the other polishing member are adopted.

[0006]

According to the present invention, by employing the above-described means, one surface of the object to be polished is held by the member to be polished, and in this state, one of the polishing members is held against the member to be polished. One chamfered portion of the object to be polished is moved by bringing one chamfered portion of the object to be polished into contact with the polishing surface of one polishing member, and rotating one of the polishing members with respect to the member to be polished held. Will be polished. Then, the other polishing member is moved with respect to the polishing object holding member, or the other polishing member is moved with respect to the polishing object holding member and one polishing member integrally, and the other polishing member is moved. The other chamfered portion of the workpiece is polished by bringing the chamfered portion into contact with the polishing surface of the other polishing member and rotating the other polishing member relative to the workpiece holding member.
Further, one surface of the object to be polished is held by one member to be polished to be held, and in this state, one polishing member is moved with respect to the one member to be polished and one chamfered portion of the object to be polished is held. Is brought into contact with the polishing surface of one of the polishing members, and one of the polishing members is rotated with respect to the one of the workpiece holding members, whereby one chamfered portion of the polishing object is polished. Then, the object to be polished is removed from one of the objects to be polished, and one surface of the object to be polished is held on the other object to be polished by vacuum suction or the like. The other polishing member is moved, the other chamfered portion of the object to be polished is brought into contact with the polishing surface of the other polishing member, and the other polishing member is rotated with respect to the other member to be polished. As a result, the other chamfered portion of the object to be polished is polished.

[0007]

Embodiments of the present invention shown in the drawings will be described below. FIGS. 1 and 2 show a first embodiment of a polishing apparatus according to the present invention. The polishing apparatus shown in this embodiment is a polishing object holding member 17 for holding a disk-shaped polishing object 25 such as a silicon wafer.
9 and chamfered portions 26 and 27 on the outer peripheral portion of the workpiece 25 (FIG. 9).
Polishing member 1 and the other polishing member 1 for polishing
It has zero.

The polishing member 1 is provided integrally with the polishing portion 2 at the center of the lower surface of the polishing portion 2 and has a base 22.
And a support portion 8 inserted into the hole 23 through a bearing 24.

[0009] A concave portion 3 is provided on the upper surface side of the polishing portion 2.
The inner surface of the concave portion 3 is formed as a tapered surface 5 having a predetermined angle from the opening to the bottom surface, and the bottom surface is formed with an upper end portion of a through hole 9 penetrating the center of the support portion 8.

A polishing pad 6 made of a nonwoven fabric or the like is attached to the tapered surface 5 of the concave portion 3 of the polishing section 2 by an attaching means such as an adhesive.

The polishing pad 6 may be formed in the shape of a strip and may be attached to the entire tapered surface 5 of the polishing portion 2 without leaving any space. (Not shown) may be attached. In a case where a gap is formed between adjacent ones, the gap can function as a flow passage for the abrasive or the like.

The object-to-be-polished holding member 17 has a rotating shaft 18 inserted through a through hole 9 provided in the support portion 8 of one of the polishing members 1.
And, provided integrally with the upper end of the rotating shaft 18,
And a disk-shaped holding plate 21 located in the concave portion 3 of the polishing member 1.

The rotating shaft 18 has a bearing case 19 and a bearing 20.
So that it is rotatably inserted through the connector. In this case, the bearing case 19 is connected to an angle adjusting member (not shown), and the inclination can be adjusted by operating the angle adjusting member. Therefore, by adjusting the inclination of the bearing case 19, the inclination of the rotating shaft 18 and the holding plate 21 can be adjusted integrally with the bearing case 19.

The rotating shaft 18 is connected to a driving source (not shown) via power transmission means (not shown) such as a pulley and a belt, and is driven to rotate by the operation of the driving source. Therefore, the holding plate 21 can be driven to rotate integrally with the rotating shaft 18 by rotating the rotating shaft 18.

The rotary shaft 18 is connected to a vertically moving member (not shown) such as a cylinder, and is moved vertically by operating the vertically moving member. Therefore, by moving the rotating shaft 18 in the vertical direction, the holding plate 21 can be moved in the vertical direction integrally with the rotating shaft 18.

A fluid passage (not shown) is provided inside the rotary shaft 18 and a fluid passage (not shown) is also provided inside the holding plate 21. It is designed to communicate with The through hole of the holding plate 21 is opened on the upper surface side of the holding plate 21, and the through hole of the rotating shaft 18 is through a tube member (not shown) such as a tube and a vacuum generating source (not shown) such as a vacuum pump. It is to be connected to. Therefore, when the vacuum source is operated with the object 25 to be polished positioned on the upper surface of the holding plate 21, one surface of the object 25 to be polished can be held on the upper surface of the holding plate 21 by vacuum suction. Things.

Above one polishing member 1, another polishing member 10 is provided to face the other. The other polishing member 10
Is composed of a support portion 11 and a polishing portion 12 integrally provided at a lower end of the support portion 11.

A concave portion 13 is provided on the lower surface side of the polishing portion 12, and an inner surface of the concave portion 13 is formed as a tapered surface 14 having a predetermined angle from the opening to the bottom surface.

A polishing pad 15 made of a nonwoven fabric or the like is attached to the tapered surface 14 of the polishing section 12 in the same manner as the polishing section 2 of one of the polishing members 1 by an attaching means such as an adhesive.

As in the case of the one polishing member 1, the polishing pad 15 is formed by removing a strip-shaped one from the tapered surface 14 of the recess 13.
Or may be attached so that a gap in an inclined direction is formed between adjacent ones. In a case where a gap is formed between adjacent ones, the gap can function as a flow passage for the abrasive or the like.

The supporting portion 11 of the other polishing member 10 is connected to a driving source (not shown) via a power transmission member (not shown) such as a pulley, a belt, and the like. The polishing unit 12 is driven to rotate integrally with the polishing unit 12. The support portion 11 is connected to a vertically moving member (not shown) such as a cylinder, and the polishing portion 12 is vertically moved integrally with the support portion 11 by operating the vertically moving member. Further, a supply hole (not shown) is provided inside the support portion 11 so that slurry or the like can be supplied to the concave portion 13 side through the supply hole.

Next, the operation of the above-described device will be described. First, the vertically movable member is operated to raise the workpiece holding member 17, the holding plate 21 is positioned at a predetermined position in the vertical direction, the workpiece 25 is placed on the holding plate 21, and a vacuum is generated. The source is operated to vacuum-hold the workpiece 25 on the upper part of the holding plate 21, and the angle adjusting member is operated to adjust the inclination of the holding plate 21 and the workpiece 25 to set a predetermined angle.

Then, the vertically movable member is operated to lower the polished work holding member 17, and the lower chamfered portion 26 of the outer peripheral portion of the polished work 25 is polished by the polishing section 2 of one polishing member 1. It is pressed against the pad 6.

Then, the drive source is operated to rotate the rotating shaft 18 of the workpiece holding member 17, and the holding plate 21 and the workpiece 25 are rotated integrally with the rotating shaft 18, and the workpiece 2 is rotated.
Polishing of the chamfered portion 26 on the lower surface side of the outer peripheral portion of 5 is performed.

After the polishing of the chamfered portion 26 on the lower surface side of the outer peripheral portion of the polished object 25 is completed, the vertical moving member is operated to raise the polished object holding member 17, and the polished object 25 is moved up and down. And the vertical moving member is operated to lower the other polishing member 10, and the polishing pad 15 of the polishing section 12 of the other polishing member 10 is placed on the upper surface side of the outer peripheral portion of the workpiece 25. The chamfer 27 is brought into contact with and pressed.

Then, the driving source is operated to rotate the rotating shaft 18 of the workpiece holding member 17 to rotate the holding plate 21 and the workpiece 25 integrally with the rotating shaft 18.
The driving source is operated to rotate the other polishing member 10, and the chamfered portion 27 on the upper surface side of the outer peripheral portion of the workpiece 25 is polished.

In this manner, the chamfered portion 26 on the lower surface side and the chamfered portion 27 on the upper surface side of the outer peripheral portion of the workpiece 25 can be polished.

In the polishing apparatus according to this embodiment constructed as described above, only the lower surface of the object to be polished 25 is held on the holding plate 21 of the holder 17 for the object to be polished by vacuum suction. Since the chamfered portion 26 on the lower surface side and the chamfered portion 27 on the upper surface side of the outer peripheral portion of the object 25 can be polished, no trace due to vacuum suction is formed only on the lower surface of the object 25 to be polished.

Therefore, no trace is formed on the upper and lower surfaces of the object 25 by vacuum suction, so that the subsequent steps are not affected, and the production efficiency can be greatly improved.

FIGS. 3 and 4 show a polishing apparatus according to a second embodiment of the present invention. In the polishing apparatus shown in this embodiment, another polishing member 10 is provided on the opposite side of one polishing member 1, and the other polishing member 10 can be moved in the horizontal direction by a horizontal moving member (not shown); It is vertically movable by a vertically moving member (not shown), and the other configuration is the same as that shown in the first embodiment.

In order to polish the object 25 using the polishing apparatus according to this embodiment, first, similarly to the first embodiment, the vertical moving member is operated to operate the object to be polished. The abrasive holding member 17 is raised, and the holding plate 21
Is positioned at a predetermined position in the up-down direction, the object to be polished 25 is placed on the upper part of the holding plate 21, the vacuum source is operated, and the object to be polished 25 is vacuum-adsorbed on the upper part of the holding plate 21 to adjust the angle. The members are operated to adjust the inclination of the holding plate 21 and the object 25 to be polished, and set to a predetermined angle.

Then, the workpiece holding member 17 is lowered by operating the vertical moving member, and the chamfered portion 26 (see FIG. 10) on the lower surface side of the outer peripheral portion of the workpiece 25 is moved to one of the polishing members 1.
Is pressed against the polishing pad 6 of the polishing section 2.

Then, the driving source is operated to rotate the rotating shaft 18 of the workpiece holding member 17, and the holding plate 21 and the workpiece 25 are rotated integrally with the rotating shaft 18, and the workpiece 2 is rotated.
Polishing of the chamfered portion 26 on the lower surface side of the outer peripheral portion of 5 is performed.

After the polishing of the chamfered portion 26 on the lower surface side of the outer peripheral portion of the polished object 25 is completed, the vertical moving member is operated to raise the polished object holding member 17 and move the polished object 25 up and down. While positioning at a predetermined position in the direction,
The other polishing member 10 located on one side of the one polishing member 1 is moved in the horizontal direction by the horizontal moving member to be positioned above the one polishing member 1. Thereafter, the vertically moving member is operated to be lowered, and the polishing pad
The chamfered portion 27 on the upper surface side of the outer peripheral portion of the polishing object 25 (FIG. 1)
0) and pressed.

Then, the driving source is operated to rotate the rotating shaft 18 of the workpiece holding member 17 to rotate the holding plate 21 and the workpiece 25 integrally with the rotating shaft 18.
The driving source is operated to rotate the other polishing member 10, and the chamfered portion 27 on the upper surface side of the outer peripheral portion of the workpiece 25 is polished.

In this manner, the chamfered portion 26 on the lower surface side and the chamfered portion 27 on the upper surface side of the outer peripheral portion of the workpiece 25 can be polished.

In the polishing apparatus according to this embodiment having the above-described structure, only the lower surface of the object 25 to be polished is held by the holding member 17 as in the first embodiment. Since the lower chamfer 26 and the upper chamfer 27 on the outer peripheral portion of the workpiece 25 can be polished while being held on the holding plate 21 by vacuum suction,
Traces due to vacuum suction are formed only on the lower surface of the object 25 to be polished.

Therefore, no traces are formed on the upper and lower surfaces of the object 25 by vacuum suction, so that the subsequent steps are not affected and the production efficiency can be greatly improved. .

FIGS. 5 and 6 show a polishing apparatus according to a third embodiment of the present invention. In the polishing apparatus shown in this embodiment, the other polishing member 10 is provided beside the one polishing member 1 so as to be vertically movable by a vertically moving member, and the one polishing member 1 and the object to be polished are provided. The holding member 17 can be integrally moved in a horizontal direction by a horizontal moving member (not shown), and the other configuration is the same as that shown in the first embodiment.

In order to polish the object 25 using the polishing apparatus according to this embodiment, first, as in the first embodiment, the vertical moving member is operated to operate the object. The polishing object holding member 17 is raised, the holding plate 21 is positioned at a predetermined position in the vertical direction, the work 25 is placed on the upper portion of the holding plate 21, and the vacuum source is operated to activate the upper portion of the holding plate 21. The workpiece 25 is vacuum-sucked, and the angle adjusting member is operated to adjust the inclination of the holding plate 21 and the workpiece 25 to set a predetermined angle.

Then, the workpiece holding member 17 is lowered by operating the vertical moving member, and the chamfered portion 26 (see FIG. 10) on the lower surface side of the outer peripheral portion of the workpiece 25 is moved to one of the polishing members 1.
Is pressed against the polishing pad 6 of the polishing section 2.

Then, the drive source is operated to rotate the rotating shaft 18 of the workpiece holding member 17, and the holding plate 21 and the workpiece 25 are rotated integrally with the rotating shaft 18, and the workpiece 2 is rotated.
Polishing of the chamfered portion 26 on the lower surface side of the outer peripheral portion of 5 is performed.

After the polishing of the chamfered portion 26 on the lower surface side of the outer peripheral portion of the workpiece 25 is completed, the horizontal moving member is operated to move one of the polishing member 1 and the workpiece holding member 17 horizontally. , And positioned below the other polishing member 10.

Then, the vertical moving member is operated to raise the workpiece holding member 17, to position the workpiece 25 at a predetermined position in the vertical direction, and the vertical moving member is operated to operate the other polishing member 10. Is lowered, and the chamfered portion 27 (see FIG. 10) on the upper surface side of the outer peripheral portion of the workpiece 25 is brought into contact with the polishing pad 15 of the polishing section 12 and pressed.

Then, the driving source is operated to rotate the rotating shaft 18 of the workpiece holding member 17 to rotate the holding plate 21 and the workpiece 25 integrally with the rotating shaft 18.
The driving source is operated to rotate the other polishing member 10, and the chamfered portion 27 on the upper surface side of the outer peripheral portion of the workpiece 25 is polished.

In this manner, the chamfered portion 26 on the lower surface side and the chamfered portion 27 on the upper surface side of the outer peripheral portion of the workpiece 25 can be polished.

In the polishing apparatus according to this embodiment configured as described above, only the lower surface of the workpiece 25 is fixed to the workpiece holding member 17 in the same manner as in the first embodiment. The object to be polished 2 is vacuum-adsorbed to the holding plate 21.
Since the chamfered portion 26 on the lower surface side and the chamfered portion 27 on the upper surface side of the outer peripheral portion of 5 can be polished, traces due to vacuum suction are formed only on the lower surface of the object 25 to be polished.

Therefore, no trace is formed on the upper and lower surfaces of the object 25 by vacuum suction, so that the subsequent steps are not affected, and the production efficiency can be greatly improved. .

In the first to third embodiments, the object to be polished 2
5 is held, but the present invention is not limited to this. Needless to say, the same effect can be obtained even if the holding mechanism is held by another holding means. In addition, the polishing target holding member 17 and the other polishing member 10 are configured to be rotationally driven by the driving source. However, at least one of the polishing member 1 and the polishing target holding member 17 is rotationally driven by the driving source. In addition, at least one of the other polishing member 10 and the object-to-be-polished holding member 17 may be configured to be rotationally driven by a driving source. Further, the inner surface of the concave portion 3 of the polishing portion 2 of the one polishing member 1 and the inner surface of the concave portion 13 of the other polishing member 10 are not limited to the tapered surfaces 5 and 14, but may be formed into spherical surfaces or the like. is there.

FIGS. 7 and 8 show a polishing apparatus according to a fourth embodiment of the present invention. The polishing apparatus according to this embodiment includes a polishing object holding member 31 for holding a disk-shaped polishing object 25 such as a silicon wafer, a polishing object holding member 36 for holding the polishing object 25, and a polishing object 25. The conveying member (not shown) for conveying from the polished work holding member 31 to the other polished work holding member 36, and the first embodiment for polishing the chamfered portion of the outer peripheral portion of the polished work 25 are shown. It has one polishing member 1 and the other polishing member 10 having the same configuration as the above.

The polishing member 1 has a disk-shaped polishing section 2 and a polishing section 2 as in the first embodiment.
And a support portion 8 which is integrally provided at a central portion of the lower surface of the base 22 and is inserted into a hole 23 of the base 22 via a bearing 24.

One polished work holding member 31 has a rotating shaft 32 inserted through the through hole 9 of the support portion 8 of the one polishing member 1.
And is provided integrally with the upper end of the rotating shaft 32,
And a holding plate 35 located in the concave portion 3 of the polishing member 1.

The rotating shaft 32 is provided with a bearing 34 in a bearing case 33.
So that it is rotatably inserted through the connector. In this case, the bearing case 33 is connected to an angle adjusting member (not shown), and the inclination can be adjusted by operating the angle adjusting member. Therefore,
By adjusting the inclination of the bearing case 33, the inclination of the rotating shaft 32 and the holding plate 35 can be adjusted integrally with the bearing case 33.

The rotating shaft 32 is connected to a drive source (not shown) through a power transmission means (not shown) such as a pulley, a belt, and the like. It is supposed to. Therefore, by rotating the rotating shaft 32, the holding plate 35 can be driven to rotate integrally with the rotating shaft 32.

The rotating shaft 32 is connected to a vertically moving member (not shown) such as a cylinder, and is moved up and down by operating the vertically moving member. Therefore, the holding plate 35 can be vertically moved integrally with the rotating shaft 32 by moving the rotating shaft 32 vertically.

A fluid passage (not shown) is provided inside the rotating shaft 32, and a fluid passage (not shown) is also provided inside the holding plate 35. It is designed to communicate with In this case, the through-hole of the holding plate 35 is opened on the upper surface side of the holding plate 35, and the through-hole of the rotating shaft 32 is connected to a vacuum source (not shown) such as a vacuum pump through a tube member (not shown) such as a tube. )). Therefore, by activating the vacuum source,
One surface of the workpiece 25 can be held on the upper surface side of the holding plate 35 by vacuum suction.

The other polishing member 10 is provided beside one polishing member 1. The other polishing member 10 includes a support portion 11 and a support member 11 in the same manner as in the first embodiment.
The polishing part 12 is provided integrally with the lower end of the support part 11.

The support portion 11 of the other polishing member 10 is connected to a drive source (not shown) via a power transmission member (not shown) such as a pulley, a belt, and the like. The polishing unit 12 is driven to rotate integrally with the polishing unit 12. The support portion 11 is connected to a vertically moving member (not shown) such as a cylinder, and the polishing portion 12 is vertically moved integrally with the support portion 11 by operating the vertically moving member. Further, a supply hole (not shown) is provided inside the support portion 11 so that slurry or the like can be supplied to the concave portion 13 side through the supply hole.

The other polished object holding member 36 is provided below the other polished member 10, and, like the one polished object holding member 31, has the rotating shaft 37 and the rotating shaft 3.
7 and a holding plate 40 provided integrally with the upper end portion.

The rotating shaft 37 is provided with a bearing 39 in a bearing case 38.
So that it is rotatably inserted through the connector. The bearing case 38 is connected to an angle adjusting member (not shown), and the inclination can be adjusted by operating the angle adjusting member. Therefore, by adjusting the inclination of the bearing case 38, the inclination of the rotating shaft 37 and the holding plate 40 can be adjusted integrally with the bearing case 38.

The rotating shaft 37 is connected to a drive source (not shown) through a power transmission means (not shown) such as a pulley, a belt, and the like, and is driven to rotate by driving the drive source. It is supposed to. Therefore, the holding plate 40 can be driven to rotate integrally with the rotating shaft 37 by rotating the rotating shaft 37.

The rotating shaft 37 is connected to a vertically moving member (not shown) such as a cylinder via a connecting member (not shown), and is moved up and down by operating the vertically moving member. I have. Therefore, the holding plate 40 can be vertically moved integrally with the rotating shaft 37 by moving the rotating shaft 37 vertically.

A fluid passage (not shown) is provided inside the rotary shaft 37, and a fluid passage (not shown) is also provided inside the holding plate 40. It is designed to communicate with In this case, the through-hole of the holding plate 40 is opened on the upper surface side of the holding plate 40, and the through-hole of the rotating shaft 37 is connected to a vacuum source (not shown) such as a vacuum pump through a tube member (not shown) such as a tube. )). Therefore, one of the surfaces of the object 25 to be polished can be vacuum-adsorbed to the upper surface side of the holding plate 40 by operating the vacuum source while the object 25 to be polished is positioned on the upper surface side of the holding plate 40. It is.

A transfer member (not shown) is provided between one of the polishing members 1 and the other of the polishing members 10. By operating this transfer member, one of the polishing object holding members 3 is provided.
The object 25 to be polished can be transported from one holding plate 35 to the holding plate 40 of the other object holding member 36.

Next, the operation of the above will be described. First, the vertical moving member is operated to raise one of the polished work holding members 31, the holding plate 35 is positioned at a predetermined position in the vertical direction, and the vacuum generating source is operated to hold the holding plate 3.
The object 25 to be polished is vacuum-adsorbed on the upper portion 5 and the inclination of the holding plate 35 and the object 25 to be polished is adjusted by operating the angle adjusting member to set a predetermined angle.

Then, the vertically movable member is operated to lower one of the polished work holding members 31, and the chamfered portion 26 (see FIG. The polishing section 2 is pressed against the polishing pad 6 of the polishing section 2.

Then, the driving source is operated to rotate the rotating shaft 32, and the holding plate 35 and the workpiece 25 are rotated integrally with the rotating shaft 32, and the chamfered portion on the lower surface side of the outer peripheral portion of the workpiece 25 is rotated. 26 is polished.

After the polishing of the chamfered portion 26 on the lower surface side of the outer peripheral portion of the polished object 25 is completed, the up-down moving member is operated to raise one of the polished object holding members 31 so that the polished object 25 is moved. Is positioned at a predetermined position in the vertical direction, the vacuum generating source is stopped, and the conveying member is operated, and the polishing target 25 is removed from the holding plate 35 of the polishing target holding member 31.
Is transported to the holding plate 40 of the other object-to-be-polished holding member 36.

Then, the vacuum generating source is operated to operate the holding plate 4.
The object 25 to be polished is vacuum-sucked on the upper part of the cylinder 0, and the inclination of the holding plate 40 and the object 25 to be polished is adjusted by operating the angle adjusting member to set the angle to a predetermined angle.

Then, the vertical moving member is operated to raise the other polished object holding member 36 to position the polished object 25 at a predetermined position in the vertical direction, and the vertical moving member is operated to operate the other polished object. The member 10 is lowered, and the chamfered portion 27 (see FIG. 10) on the upper surface side of the outer peripheral portion of the workpiece 25 is pressed against the polishing pad 15 of the polishing portion 12 of the other polishing member 10.

Then, the driving source is operated to rotate the rotating shaft 37, thereby rotating the holding plate 40 and the workpiece 25 integrally with the rotating shaft 37, and forming a chamfer on the upper surface side of the outer peripheral portion of the workpiece 25. Polishing of 27 is performed.

In this manner, the chamfered portion 26 on the lower surface side and the chamfered portion 27 on the upper surface side of the outer peripheral portion of the workpiece 25 can be polished.

In the polishing apparatus according to this embodiment configured as described above, the lower surface of the workpiece 25 is held on the holding plate 35 of one of the workpiece holding members 31 by vacuum suction. The chamfered portion 26 on the lower surface side of the outer peripheral portion of the object 25 is polished, and the lower surface of the object 25 is held on the holding plate 40 of the other object holding member 36 by vacuum suction. The chamfered portion 27 on the upper surface side of the outer peripheral portion of the polishing object 25 is polished. For this reason, a trace due to vacuum suction is formed only on the lower surface of the object 25 to be polished.

Therefore, no trace is formed on the upper and lower surfaces of the object 25 by vacuum suction, so that the subsequent steps are not affected and the production efficiency can be greatly improved. .

In the fourth embodiment,
The polished object 25 is configured to be held by vacuum suction on the upper part of the holding plate 35 of the one polished object holding member 31 and the upper part of the holding plate 40 of the other polished object holding member 36. It is needless to say that a similar effect can be obtained even if the holding means is configured to be held by another holding means without performing. In addition, one of the polishing member holding members 31, the other polishing member holding member 36, and the other polishing member 10 are configured to be rotationally driven by a driving source. At least one of the members 31 is rotationally driven by a drive source, and the other polishing member 10 or the other object-to-be-polished holding member 3
6 may be configured to be rotationally driven by a drive source. Further, the inner surface of the concave portion 3 of the polishing portion 2 of the one polishing member 1 and the inner surface of the concave portion 13 of the polishing portion 12 of the other polishing member 10 have tapered surfaces 5.
Without being limited to 14, it may be formed in a spherical surface or the like.

FIG. 9 shows a fifth embodiment of the polishing apparatus according to the present invention.
Is shown. The polishing apparatus shown in this embodiment includes a workpiece holding member 65 for holding a disk-shaped workpiece 25 such as a silicon wafer, and chamfered portions 26 and 27 on the outer periphery of the workpiece 25 (see FIG. 10). ) Is provided with one polishing member 41 and the other polishing member 50 for polishing.

The polishing member 41 includes a polishing portion 42 and a support portion 48 which is provided integrally with a central portion of the lower surface of the polishing portion 42 and which is inserted into a hole 60 of a base 59 via a bearing 61. It is composed of

A concave portion 43 is provided on the upper surface side of the polishing portion 42, an inner surface of the concave portion 43 is formed as a tapered surface 45 having a predetermined angle, and a bottom surface of a through hole 49 penetrating through the center of the support portion 48. The upper end is open.

A polishing pad 46 made of a nonwoven fabric or the like is attached to the tapered surface 45 of the concave portion 43 of the polishing section 42 by an attaching means such as an adhesive.

The polishing pad 46 may be formed in the shape of a strip and may be attached to the entire tapered surface 45 of the polishing portion 42 without leaving any space. (Not shown). In the case where a gap is formed between adjacent objects, the gap can function as a flow path for an abrasive or the like.

A pulley 62 is attached to the lower end of the support portion 48, and a belt 63 is wound between the pulley 62 and a driving source (not shown). One of the polishing members 41 and the other of the polishing members 50 described later are integrally rotated via a belt 63 and a pulley 62.

An upper portion of one polishing member 41 is integrally connected with another polishing member 50. The other polishing member 50 has a polishing portion 52 at a portion connected to one polishing member 41, and a concave portion 5 is provided on the bottom surface side of the polishing portion 52.
3 is provided, and the inner surface of the concave portion 53 is formed as a tapered surface 54 having a predetermined angle.

A polishing pad 55 made of a nonwoven fabric or the like is attached to the tapered surface 54 of the polishing section 52 in the same manner as the polishing section 42 of the one polishing member 41 by an attaching means such as an adhesive.

As in the case of the polishing member 41, the polishing pad 55 may have a strip shape attached to the entire tapered surface 54 of the concave portion 53, or may be inclined between adjacent ones. It may be attached so that a gap is formed. In a case where a gap is formed between adjacent ones, the gap can function as a flow passage for the abrasive or the like.

Then, as described above, one of the polishing members 41
By integrally connecting the other polishing member 50 to the upper part of
The concave portions 43 of the polishing portions 42, 52 of both polishing members 41, 50,
A disk-shaped polishing chamber 58 is formed between the holes 53.

A supply hole 57 is provided above the polishing section 52 of the other polishing member 50, and the slurry is supplied into the polishing chamber 58 through the supply hole 57. Reference numeral 64 denotes a slurry receiver for collecting the slurry flowing out of the polishing chamber 58.

The object-to-be-polished holding member 65 is provided integrally with the rotating shaft 66 inserted through the through hole 49 provided in the support portion 48 of the one polishing member 41 and at the upper end of the rotating shaft 66. And a disc-shaped holding plate 69 located in the inside.

The rotating shaft 66 has a bearing 68 mounted on a bearing case 67.
So that it is rotatably inserted through the connector. In this case, the bearing case 67 is connected to the up-down movement member 72, and moves up or down by operating the up-down movement member 72.

The vertical moving member 72 is mounted on a base 70 having a slope 71 having a predetermined angle.
A linear guide 73 comprising a rail 74 provided on the inclined surface 71 of the base 70, a bearing 75 slidable on the rail 74, and a bearing 7 of the linear guide 73;
, A cylinder 77 attached to a base 70, and a rod 7 of the cylinder 77.
8 and a connecting plate 79 for connecting the moving table 76, and the bearing case 67 of the workpiece holding member 65 is integrally connected to the moving table 76 via bolts or the like. ing.

Then, by operating the cylinder 77, the workpiece holding member 65 moves up or down along the inclined surface 71 integrally with the moving table 76.

The rotating shaft 66 of the workpiece holding member 65 is connected to a driving source 82 via a pulley 80, a belt 81 and the like, and is rotated by the operation of the driving source 82. Therefore, by rotating the rotating shaft 66, the holding plate 69 can be driven to rotate integrally with the rotating shaft 66.

A fluid passage (not shown) is provided inside the rotary shaft 66, and a fluid passage (not shown) is also provided inside the holding plate 69. It is designed to communicate with The through hole of the holding plate 69 is opened on the upper surface side of the holding plate 69, and the through hole of the rotating shaft 66 is connected to a vacuum generating source (not shown) such as a vacuum pump through a tube member (not shown) such as a tube. It is to be connected. Therefore, by operating the vacuum source with the workpiece 25 positioned on the upper surface side of the holding plate 69, it is possible to hold one surface of the workpiece 25 on the upper surface side of the holding plate 69 by vacuum suction. You can do it.

Next, the operation of the above-described device will be described. First, the vertical moving member 72 is operated to raise the workpiece holding member 65, the holding plate 69 is positioned at a predetermined position in the vertical direction, and the workpiece 25 is placed on the holding plate 69, and the vacuum is applied. The source is operated to vacuum-suck the workpiece 25 on the holding plate 69.

Then, the vertically movable member 66 is operated to lower the polished work holding member 65, and the chamfered portion 26 on the lower surface side of the outer peripheral portion of the polished work 25 is removed from the polishing portion 42 of the one polishing member 41. It is pressed against the polishing pad 46.

Then, the driving source is operated to rotate the rotating shaft 66 of the workpiece holding member 65, thereby rotating the holding plate 69 and the workpiece 25 integrally with the rotating shaft 66.
The driving source is operated to rotate the one polishing member 41 and the other polishing member 50 integrally, thereby polishing the chamfered portion 26 on the lower surface side of the outer peripheral portion of the workpiece 25.

After the polishing of the chamfered portion 26 on the lower surface side of the outer peripheral portion of the workpiece 25 is finished, the vertical moving member 72
Is operated to raise the workpiece holding member 65, and the chamfered portion 27 on the upper surface side of the outer peripheral portion of the workpiece 25 is pressed against the polishing pad 55 of the polishing section 52 of the other polishing member 50. .

Then, the driving source is operated to rotate the rotating shaft 66 of the workpiece holding member 65, thereby rotating the holding plate 69 and the workpiece 25 integrally with the rotating shaft 66, and operating the driving source. Then, the one polishing member 41 and the other polishing member 50 are rotated integrally, and the chamfered portion 27 on the upper surface side of the outer peripheral portion of the workpiece 25 is polished.

Thus, the chamfered portion 26 on the lower surface side and the chamfered portion 27 on the upper surface side of the outer peripheral portion of the object 25 can be polished.

In the polishing apparatus according to this embodiment configured as described above, only the lower surface of the workpiece 25 is held on the holding plate 69 of the workpiece holding member 65 by vacuum suction. Since the chamfered portion 26 on the lower surface side and the chamfered portion 27 on the upper surface side of the outer peripheral portion of the object 25 can be polished, no trace due to vacuum suction is formed only on the lower surface of the object 25 to be polished.

Therefore, no trace is formed on the upper and lower surfaces of the object 25 by vacuum suction, so that the subsequent steps are not affected and the production efficiency can be greatly increased.

Further, one polishing member 41 and the other polishing member 50 are integrally connected, and a polishing chamber 58 is formed between the concave portions 43 and 53 of the polishing portions 42 and 52 of the two polishing members 41 and 50. Therefore, the slurry supplied into the polishing chamber 58 is not scattered, and the recovery rate of the slurry can be greatly improved.

Further, after polishing, pure water is supplied from the supply hole 57 instead of the slurry into the polishing chamber 58,
The inside of the polishing chamber 58 can be cleaned.

Further, since the polishing can be performed at one position, the size of the entire apparatus can be reduced.

Further, since there is no need to change the object 25 to be polished, the time for the processing step can be greatly reduced, and the production efficiency can be greatly increased.

[0105]

According to the present invention, one surface of the object to be polished is held on the object to be polished by vacuum suction or the like. The polishing of one chamfered portion and the other chamfered portion on the outer peripheral portion of the polished object can be performed. Therefore, since traces due to vacuum suction are formed only on one surface of the object to be polished, traces due to vacuum suction or the like are formed on both surfaces of the object to be polished, which may affect subsequent processes. This means that production efficiency can be greatly increased.

According to the fourth and ninth aspects of the present invention, one surface of the object to be polished is held on one of the polishing object holding members by vacuum suction or the like. One of the chamfered portions can be polished, and one surface of the object to be polished is held by the other object holding member by vacuum suction or the like, and in this state, the other chamfered portion of the outer peripheral portion of the object to be polished is polished. Can be performed. Therefore,
Since traces due to vacuum suction etc. will be formed only on one surface of the polished object, traces due to vacuum suction etc. will be formed on both surfaces of the polished object and affect the subsequent process Instead, production efficiency can be greatly increased.

[0107] Further, with the configuration as claimed in claims 3, 5, 8, and 10, the entire polishing surface of one polishing member can be reduced.
And since the chamfered portion of the outer peripheral portion of the object to be polished can be polished using the entire polished surface of the other polished member, the polished surfaces of the one polished member and the other polished member can be uniformly formed over the whole. It can be worn. Therefore, the polishing accuracy of the chamfered portion on the outer peripheral portion of the object to be polished can be greatly improved.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing a first embodiment of a polishing apparatus according to the present invention, and is an explanatory view showing a state in which a chamfered portion on a lower surface side of an outer peripheral portion of a workpiece is polished. .

FIG. 2 is an explanatory view showing a state in which a chamfered portion on the upper surface side of an outer peripheral portion of a workpiece is polished.

FIG. 3 is a schematic cross-sectional view showing a polishing apparatus according to a second embodiment of the present invention, and is an explanatory view showing a state in which a chamfered portion on a lower surface side of an outer peripheral portion of an object to be polished is polished; .

FIG. 4 is an explanatory view showing a state at the time of polishing of a chamfered portion on an upper surface side of an outer peripheral portion of a workpiece.

FIG. 5 is a schematic cross-sectional view showing a polishing apparatus according to a third embodiment of the present invention, and is an explanatory view showing a state in which a chamfered portion on the lower surface side of the outer peripheral portion of the workpiece is polished. .

FIG. 6 is an explanatory diagram showing a state in which a chamfered portion on the upper surface side of the outer peripheral portion of the workpiece is polished.

FIG. 7 is a schematic cross-sectional view showing a polishing apparatus according to a fourth embodiment of the present invention, and is an explanatory view showing a state in which a chamfered portion on the lower surface side of the outer peripheral portion of the object to be polished is polished. .

FIG. 8 is an explanatory view showing a state in which a chamfered portion on an upper surface side of an outer peripheral portion of a workpiece is polished.

FIG. 9 is a schematic cross-sectional view showing a fifth embodiment of the polishing apparatus according to the present invention, and is an explanatory view showing a state in which a chamfered portion on the lower surface side of the outer peripheral portion of the object to be polished is being polished. .

FIG. 10 is an enlarged cross-sectional view of an outer peripheral portion of an object to be polished.

[Explanation of symbols]

 1, 41 one polishing member 2, 12, 42, 52 polishing part 3, 13, 43, 53 concave part 5, 14, 45, 54 tapered surface 6, 15, 46, 55 Polishing pad 8, 11, 48 ... Support part 9, 49 ... Through hole 10, 50 ... The other polishing member 17, 65 ... Polished object holding member 18, 32, 37, 66 ... Rotating shaft 19, 33, 38, 67 bearing case 20, 24, 34, 39, 61, 68 bearing 21, 35, 40, 69 holding plate 22, 59, 70 base 23, 60 hole 25 ... Polished objects 26 and 27... Chamfered part 31... One polished object holding member 36... The other polished object holding member 57. 81 Belt 64 Slurry receiver 71 Slope 72 Vertical movement Member 73 Linear guide 74 Rail 75 Bearing 76 Moving table 77 Cylinder 78 Rod 79 Connecting plate 82 Drive source

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Noriaki Mizuno 2647 Hayakawa, Ayase-shi, Kanagawa F-term (reference) 3F0-term AA04 AA18 AB01 CA05 CB01

Claims (10)

[Claims] 1. A chamfered portion on one surface side is polished by one polishing member while one surface of the object to be polished is held by a member to be polished, and thereafter, the other surface of the polished object is polished. A polishing method wherein the chamfered portion is polished with the other polishing member. 2. An object to be polished is held on one surface by a member to be polished, and in this state, one chamfered portion of the object to be polished is polished by one member to be polished. And a polishing method characterized by moving between one polishing member and the other polishing member to polish the other chamfered portion of the object to be polished with the other polishing member. 3. The polishing method according to claim 1, wherein an inclination of one of the polishing member holding members with respect to the other polishing member is adjustable. 4. One surface of the object to be polished is held by one of the object holding members, and in this state, one chamfered portion of the object to be polished is polished by the one polishing member. Is removed from one of the workpiece holding members, and one surface of the workpiece is again held by the other workpiece holding member. In this state, the other chamfered portion of the workpiece is ground by the other polishing member. Polishing method characterized by performing. 5. The polishing method according to claim 4, wherein the inclination of said one workpiece holding member with respect to one polishing member and the inclination of said other workpiece holding member with respect to the other polishing member are adjustable. 6. A polishing member having at least a portion of an inner surface formed on a polishing surface is provided so as to be movable and rotatable between the one polishing member and the one polishing member. The polished object holding member capable of holding the surface, and provided movably and rotatable between the polished object holding member, and the other polishing member having at least a part of the inner surface formed on the polished surface. A polishing apparatus characterized by comprising: 7. A polishing member having at least a part of an inner surface formed on a polishing surface is provided so as to be movable and rotatable between the one polishing member and the one polishing member. A polished object holding member capable of holding the surface, and provided so as to be movable and rotatable between the one polishing member and the polished object holding member, and at least a part of the inner surface is formed on the polished surface. And a polishing member comprising the other polishing member. 8. The polishing apparatus according to claim 6, wherein the inclination of the workpiece holding member with respect to the one polishing member and the other polishing member is adjustable. 9. A polished member having at least a portion of an inner surface formed on a polished surface is provided so as to be movable and rotatable between the one polished member and the one polished member. Is provided so as to be movable and rotatable between the one polishing object holding member capable of holding the surface, the other polishing member having at least a part of the inner surface formed on the polishing surface, and the other polishing member. A polishing apparatus, further comprising a polished object holding member capable of holding one surface of the polished object at a tip portion. 10. The polishing method according to claim 9, wherein an inclination of said one workpiece holding member with respect to said one polishing member and an inclination of said other workpiece holding member with respect to said other polishing member are adjustable. apparatus.