TW202330191A - Grinding device capable of discharging grinding debris from a holding surface and a porous member constituting the holding surface without increasing the size of the device - Google Patents

Abstract

To discharge grinding debris from a holding surface and a porous member constituting the holding surface without increasing the size of the device. In the state where the holding surface 22 is covered by the wafer 100, dual fluid 200 can flow from below the porous member 21 towards the holding surface 22, so that the grinding debris entering the porous member 21 from the holding surface 22 can be discharged from the porous member 21 and the holding surface 22. In addition, in order to discharge grinding debris from the porous member 21, a wafer 100 as a processed object and a carrying-out mechanism 172 as an existing structure are used. Therefore, in order to discharge grinding debris from the porous member 21 and the holding surface 22, the appended structures are less, and it is possible to implement the discharge of grinding debris without increasing the size of the grinding device 1.

Description

Grinding device

The invention relates to a grinding device.

In the grinding device, the plate-shaped object attracted and held by the holding surface of the porous member of the work holder is ground with a grinding stone, and the grinding chips are discharged. Therefore, the holding surface attracts grinding chips from the outer peripheral portion of the plate-like object to be held by suction. In addition, the suctioned grinding chips are attracted to the outer peripheral portion of the holding surface and stay on the outer peripheral portion of the holding surface, so that the suction force of the outer peripheral portion of the holding surface is reduced, and the thickness of the outer peripheral portion of the plate is reduced.

In order to prevent such a decrease in the attractive force of the holding surface, self-grinding for grinding the holding surface is periodically performed to remove grinding debris on the outer peripheral portion of the holding surface. However, the grinding debris generated when grinding the holding surface by self-grinding will enter the porous member, and after self-grinding, there will be grinding debris interposed between the lower surface of the plate-shaped object held by the holding surface and the holding surface. situation between faces. Therefore, there may be cases where the thickness of the plate becomes thinner locally, or cross cracks are formed on the plate.

Therefore, in the technology disclosed in Patent Document 1, a cover covering the area of the holding surface is provided, and in the state where the cover has covered the holding surface, a two-fluid of water and air is sprayed from the holding surface, and the two fluids are sprayed from the holding surface and the holding surface. The porous member constituting the retaining surface removes grinding debris. prior art literature patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2015-060922

The problem to be solved by the invention

However, in the technique of Patent Document 1, since a cover covering the holding surface and a moving mechanism for moving the cover are provided, the device becomes large.

Therefore, the object of the present invention is to suppress the interposition of grinding debris between the holding surface and the lower surface of the plate by discharging the grinding debris from the holding surface and the porous member constituting the holding surface without making the device larger. In between, the plate is ground to a uniform thickness. means to solve problems

The grinding device (this grinding device) of the present invention includes: a work clamping table, which attracts and holds a plate-shaped object through the holding surface of a porous member; Grinding the plate-shaped object; the moving-in mechanism holds the plate-shaped object and moves it into the holding surface; the unloading mechanism holds the plate-shaped object and moves it out from the holding surface; and the control part, The control section controls to perform the following controls: Make the plate attract and hold on the holding surface; holding the plate-shaped object being sucked and held by the holding surface by the carrying-out mechanism or the carrying-in mechanism; and A two-fluid mixed with water and air is ejected from the holding surface covered with the plate, The two fluids ejected from the holding surface flow between the holding surface and the plate-like object in the diameter direction of the holding surface and outward, thereby removing grinding debris from the porous member and the holding surface. The grinding device may also be further equipped with a lower surface cleaning mechanism, the aforementioned lower surface cleaning mechanism cleans the lower surface of the plate-shaped object held by the carrying-out mechanism or the carrying-in mechanism, and the control unit is used to make the After the two fluids are sprayed from the holding surface, the lower surface of the plate that has been separated from the holding surface is cleaned by the lower surface cleaning mechanism, and the holding surface is covered with the plate again, and the Two fluids are ejected from the holding surface to remove grinding debris from the porous member and the holding surface. Invention effect

In this grinding device, in the state where the holding surface has been covered by the plate, the two fluids can flow to the porous member, so that the grinding chips entering the porous member from the holding surface can be separated from the porous member and the holding surface. surface discharge. Therefore, since it is possible to suppress the interposition of grinding chips between the holding surface and the workpiece during grinding by the grinding mechanism, the workpiece can be ground to a uniform thickness.

In addition, in this grinding device, in order to discharge the grinding chips from the porous member and the holding surface, an existing structure, namely, a carrying-out mechanism or a carrying-in mechanism is used. Therefore, since it is possible to reduce the number of additional configurations for discharging the grinding chips, it is possible to discharge the grinding chips while avoiding an increase in the size of the grinding apparatus.

form for carrying out the invention

As shown in FIG. 1, the grinding apparatus 1 of this embodiment is an apparatus for grinding the wafer 100 which is an example of the to-be-processed object. Wafer 100 is, for example, a circular plate-shaped workpiece, and has a front side 101 and a back side 102 . The back surface 102 of the wafer 100 is a surface to be processed for grinding. In addition, the wafer 100 also functions as a plate-shaped object used when removing the grinding debris on the porous member 21 and the holding surface 22 .

The grinding apparatus 1 has the 1st apparatus base 10, and the 2nd apparatus base 11 arrange|positioned behind the 1st apparatus base 10 (+Y direction side).

A first cassette stage 160 and a second cassette stage 162 are provided on the −Y direction side of the first device base 10 . A first cassette 161 capable of accommodating unprocessed wafers 100 is placed on the first cassette stage 160 . A second cassette 163 capable of accommodating processed wafers 100 is placed on the second cassette stage 162 .

The first cassette 161 and the second cassette 163 are provided with a plurality of shelves inside, and the wafers 100 are accommodated one by one in each shelf. That is, the first cassette 161 and the second cassette 163 accommodate a plurality of wafers 100 in the form of shelves.

Openings (not shown) of the first cassette 161 and the second cassette 163 face the +Y direction side. The robot 155 is arranged on the +Y direction side of these openings. The robot 155 has a holding surface for holding the wafer 100 . The robot 155 carries (accommodates) the processed wafer 100 into the second cassette 163 . Furthermore, the robot 155 takes out the unprocessed wafer 100 from the first cassette 161 and places it on the temporary placement table 154 of the temporary placement mechanism 152 .

The temporary placement mechanism 152 is used for temporary placement of the wafers 100 taken out from the first cassette 161 and is provided at a position adjacent to the robot 155 . The temporary mechanism 152 has a temporary table 154 and an alignment member 153 . The alignment member 153 includes: a plurality of alignment pins arranged outside so as to surround the temporary table 154 ; and a slider for moving the alignment pins in the radial direction of the temporary table 154 . In the alignment member 153 , the diameter of the circle connecting the plurality of alignment pins is reduced by moving the alignment pins toward the center in the radial direction of the temporary table 154 . Thereby, the wafer 100 placed on the temporary table 154 can be aligned (centered) to a predetermined position where the center of the temporary table 154 coincides with the center of the wafer 100 .

A carry-in mechanism 170 is provided adjacent to the temporary storage mechanism 152 . The carrying-in mechanism 170 holds and carries the wafer 100 temporarily placed in the temporary placing mechanism 152 onto the holding surface 22 of the work chuck 20 for loading.

The chuck table 20 is an example of a holding member that holds the wafer 100 , and has a holding surface 22 that attracts and holds the wafer 100 . The holding surface 22 communicates with the suction source 47 (see FIG. 2 ), and can suck and hold the wafer 100 . The chuck table 20 is rotatable around a central axis extending in the Z-axis direction passing through the center of the holding surface 22 in a state where the wafer 100 is attracted and held by the holding surface 22 .

In this embodiment, two work chucks 20 are arranged on the upper surface of the turntable 6 already arranged on the second device base 11 on a circle centered on the center of the turntable 6 . At the center of the turntable 6, an unshown rotation shaft for rotating the turntable 6 is arranged. The turntable 6 can self-rotate around an axis extending in the Z-axis direction by this rotating shaft. With the rotation of the turntable 6, the two work clamps 20 will revolve. Thereby, the work chuck 20 can be positioned near the temporary mechanism 152 and below the grinding mechanism 70 .

In addition, a pillar 15 is erected on the +Y direction side of the second device base 11 . A grinding mechanism 70 for grinding the wafer 100 and a grinding feed mechanism 60 are provided on the front surface of the pillar 15 .

The grinding feeding mechanism 60 relatively moves the table 20 and the grinding stone 77 of the grinding mechanism 70 in the Z-axis direction (grinding feeding direction) perpendicular to the holding surface 22 . In the present embodiment, the grinding feed mechanism 60 is configured to move the grinding stone 77 in the Z-axis direction relative to the chuck 20 .

The grinding feeding mechanism 60 is provided with: a pair of Z-axis guide rails 61 parallel to the Z-axis direction, a Z-axis moving table 63 sliding on the Z-axis guide rails 61, and a Z-axis ball screw 62 parallel to the Z-axis guide rails 61. , a Z-axis motor 64, and a supporter 66 installed on the Z-axis moving table 63. The holder 66 supports a grinding mechanism 70 .

The Z-axis movable table 63 is provided in such a manner that it can slide on the Z-axis guide rail 61 . A nut portion (not shown) is fixed to the Z-axis movable table 63 . The Z-axis ball screw 62 is screwed to the nut portion. The Z-axis motor 64 is connected to one end of the Z-axis ball screw 62 .

In the grinding feed mechanism 60 , the Z-axis ball screw 62 is rotated by the Z-axis motor 64 to move the Z-axis moving table 63 in the Z-axis direction along the Z-axis guide rail 61 . Thereby, the holder 66 mounted on the Z-axis movable table 63 and the grinding mechanism 70 supported on the holder 66 also move in the Z-axis direction together with the Z-axis movable table 63 .

The grinding mechanism 70 grinds the wafer 100 sucked and held by the holding surface 22 of the work chuck 20 by grinding the grinding stone 77 . The grinding mechanism 70 is provided with: a main shaft housing 71 fixed to the holder 66, a main shaft 72 rotatably held on the main shaft housing 71, a main shaft motor 73 for rotating the main shaft 72, and a wheel seat 74 mounted on the lower end of the main shaft 72. , and the grinding wheel 75 supported by the wheel seat 74.

The spindle housing 71 is held by the holder 66 so as to extend in the Z-axis direction. The main shaft 72 extends in the Z-axis direction so as to be perpendicular to the holding surface 22 of the work chuck 20 , and is rotatably supported by the main shaft housing 71 .

The spindle motor 73 is connected to the upper end side of the spindle 72 . The main shaft 72 is rotated around a rotation shaft extending in the Z-axis direction by the main shaft motor 73 .

The wheel base 74 is formed in a disk shape, and is fixed to the lower end (front end) of the main shaft 72 . Wheel base 74 supports a grinding wheel 75 .

The grinding wheel 75 is formed to have an outer diameter substantially the same as that of the wheel seat 74 . The grinding wheel 75 includes an annular wheel base 76 formed of a metal material. On the lower surface of the wheel base 76, a plurality of grinding stones 77 arranged in a ring shape are fixed covering the entire circumference. The grinding stone 77 is rotated around its center by the spindle motor 73 and the spindle 72 together, and grinds the back surface 102 of the wafer 100 held on the work chuck 20 .

The wafer 100 after grinding can be carried out by the carrying out mechanism 172 . The carry-out mechanism 172 holds the wafer 100 held on the holding surface 22 of the work chuck 20 and carries it out from the holding surface 22 . The unloading mechanism 172 transports the wafer 100 unloaded from the holding surface 22 to the rotary table 157 of the single-wafer rotary cleaning mechanism 156 . In addition, the structure of the carrying-out mechanism 172 is mentioned later.

The spin cleaning mechanism 156 is a spin cleaning unit for cleaning the wafer 100 . The spin cleaning mechanism 156 includes a spin table 157 that holds the wafer 100 , and a nozzle 158 that sprays washing water and drying air toward the spin table 157 .

In the spin cleaning mechanism 156 , the spin table 157 holding the wafer 100 is rotated, and washing water is sprayed toward the wafer 100 to spin clean the wafer 100 . After that, dry air is sprayed on the wafer 100 to dry the wafer 100 .

The wafer 100 cleaned by the spin cleaning mechanism 156 can be carried into the second cassette 163 on the second cassette stage 162 by the robot 155 .

Furthermore, a lower surface cleaning mechanism 180 is disposed between the turntable 6 and the rotary cleaning mechanism 156 . The lower surface cleaning mechanism 180 is used to clean the lower surface of the wafer 100 , that is, the front surface 101 , which is transferred from the work chuck 20 to the spin cleaning mechanism 156 by the carry-out mechanism 172 . That is, the lower surface cleaning mechanism 180 cleans the front surface 101 of the wafer 100 held by the carry-out mechanism 172 .

Here, the configuration of the work chuck 20 will be described. As shown in FIG. 2 , the chuck table 20 is a circular plate-shaped table for holding the wafer 100 . The work chuck 20 includes a circular plate-shaped porous member 21 and a frame 23 supporting the porous member 21 . The porous member 21 may communicate with a suction source 47 . The chuck 20 can attract and hold the wafer 100 through the holding surface 22 of the porous member 21 by the suction force from the suction source 47 being transmitted to the upper surface of the porous member 21 , that is, the holding surface 22 .

In addition, the work chuck 20 is formed to be rotatable by a rotation mechanism 30 . The rotation mechanism 30 may be, for example, a pulley mechanism, and includes a motor 31 as a driving source, a driving pulley 32 mounted on the shaft of the motor 31, and a driven pulley connected to the driving pulley 32 through an endless belt 33. 34, and the rotating shaft 35 supporting driven pulley 34.

The rotation shaft 35 is connected directly below the center of the holding surface 22 on the lower surface of the work chuck 20 , and extends vertically with respect to the holding surface 22 of the work chuck 20 . The motor 31 rotates and drives the driving pulley 32 , and the endless belt 33 rotates along with the rotation of the driving pulley 32 . The driven pulley 34 and the rotating shaft 35 are rotated by the rotation of the endless belt 33 . Thereby, the chuck table 20 rotates about the center of the holding surface 22 as an axis.

In addition, the grinding apparatus 1 is provided with a fluid circulation mechanism 40 . The fluid circulation mechanism 40 is a mechanism for supplying fluid, that is, air or water, to the holding surface 22 of the chuck 20 or for applying suction to the holding surface 22 .

The fluid circulation mechanism 40 includes a suction groove 403 , a suction flow path 470 connected to the suction groove 403 , a rotary joint 460 connected to the rotating shaft 35 , and a suction pipe 471 connected to the suction flow path 470 .

The suction groove 403 is provided on the bottom surface of the concave portion of the frame body 23 in the chuck 20 so as to be in contact with the lower surface of the porous member 21 . The suction groove 403 is formed concentrically around the center of the work chuck 20 .

The suction flow path 470 extends from the bottom surface of the suction groove 403 to pass through the housing 23 , the rotation shaft 35 , and the rotary joint 460 .

The suction channel 470 is connected to a suction pipe 471 outside the rotary joint 460 . One end side of the suction pipe 471 communicates with the suction flow path 470 . The suction source 47 is connected to the other end side of the suction pipe 471 . The suction source 47 is provided with, for example, an ejector mechanism, a vacuum generator, etc., and is used to impart suction to the upper surface of the porous member 21 of the chuck 20 , that is, the holding surface 22 .

Moreover, in the suction piping 471 , a suction on-off valve 475 and a suction flow rate regulator 473 are disposed in this order from the suction source 47 toward the suction flow path 470 side. The suction switch valve 475 switches the communication state between the suction pipe 471 and the suction source 47 . The suction flow adjustment unit 473 is, for example, a proportional control valve, and is used to change the diameter of the internal orifice when the suction on-off valve 475 is opened, and to adjust the suction force transmitted from the suction source 47 to the holding surface 22 of the porous member 21. . Furthermore, the suction flow adjustment part 473 can also be a needle valve or a gate valve for manually adjusting the diameter of the orifice.

In addition, an air pipe 481 communicates with the suction pipe 471 . The air pipe 481 is a pipe for connecting the holding surface 22 of the work chuck 20 and the air supply source 48 .

One end side of the air pipe 481 communicates with the suction flow path 470 through the suction pipe 471 . The air supply source 48 is connected to the other end side of the air pipe 481 . The air supply source 48 includes a compressor and the like, and is used to supply air to the holding surface 22 of the work chuck 20 .

Moreover, in the air piping 481 , an air supply on-off valve 485 and an air regulator 483 are disposed in this order from the air supply source 48 toward the suction flow path 470 side. The air supply switch valve 485 switches the communication state between the air pipe 481 and the air supply source 48 . The air adjustment unit 483 is, for example, a proportional control valve, and is used to adjust the flow rate of air sent from the air supply source 48 to the holding surface 22 by changing the diameter of the internal orifice when the air supply on-off valve 485 is opened. Furthermore, the air adjustment part 483 can also be a needle valve or a gate valve for manually adjusting the diameter of the orifice.

In addition, a pressure sensor 487 is provided on the air pipe 481 . The pressure sensor 487 detects the suction force of the holding surface 22 by detecting the pressure value of the air pipe 481 .

Moreover, a water pipe 491 communicates with the air pipe 481 . The water pipe 491 is a pipe for connecting the holding surface 22 of the work chuck 20 and the water supply source 49 .

One end side of the water pipe 491 communicates with the suction flow path 470 through the air pipe 481 and the suction pipe 471 . The water supply source 49 is connected to the other end side of the water pipe 491 . The water supply source 49 includes a pump and the like, and is used to supply water to the holding surface 22 of the work chuck 20 .

Moreover, in the water pipe 491 , a water supply on-off valve 495 and a water regulator 493 are arranged in this order from the water supply source 49 toward the suction flow path 470 side. The water supply switch valve 495 switches the communication state between the water pipe 491 and the water supply source 49 . The water adjustment unit 493 is, for example, a proportional control valve, and is used to adjust the flow rate of water sent from the water supply source 49 to the holding surface 22 by changing the diameter of the internal orifice when the water supply on-off valve 495 is opened. Furthermore, the water adjusting part 493 can also be a needle valve or a gate valve for manually adjusting the diameter of the orifice.

Next, configurations of the carrying-in mechanism 170 and the carrying-out mechanism 172 will be described. In addition, in this embodiment, the carrying-in mechanism 170 and the carrying-out mechanism 172 have mutually the same structure. Therefore, below, the structure of the carrying-out mechanism 172 is demonstrated.

As shown in FIG. 2 , the carry-out mechanism 172 is provided with a disc-shaped pad 80 and an arm 81 that vertically suspends and supports the pad 80 . One end of the arm 81 is connected to the upper end of a swivel column 82 extending in the Z-axis direction from the first device base 10 (see FIG. 1 ). Furthermore, the rotating column part 82 is connected to a motor 94 that rotates the rotating column part 82 and the arm 81 together, and a vertical movement mechanism 95 that moves the rotating column part 82 and the arm 81 in the vertical direction.

A disc member 84 is connected to the other end of the arm 81 via a support 83 . A plurality of (for example, three) through-holes 85 are formed through the circular plate member 84 at equal intervals on the circumference. Furthermore, bolts 86 connected to the pad 80 are inserted into the through holes 85 .

The bolt 86 has a shaft portion 87 having a slightly smaller diameter than the through hole 85 and a head portion 88 formed on the upper end of the shaft portion 87 . The shaft portion 87 penetrates through the through hole 85 and is loosely fitted. The lower end of the shaft portion 87 is connected to the upper surface of the frame body 91 of the pad 80 . The head portion 88 is formed to have a larger diameter than the through hole 85 to limit the descending range of the bolt 86 . Also, the bolt 86 has a spring 860 as a shock absorbing member around the shaft portion 87 . The upper end of the spring 860 is in contact with the lower surface of the disc member 84 , while the lower end of the spring 860 is in contact with the upper surface of the frame 91 of the pad 80 . The spring 860 imparts potential energy to the disc member 84 and the pad 80 in a direction away from each other.

The arm 81 is formed so as to suspend and support the pad 80 while absorbing the shock applied to the pad 80 through the disk member 84 and the bolt 86 configured in this way.

The disk-shaped pad 80 is provided with, for example, a pad holding portion 90 and a frame 91. The pad holding portion 90 has an area slightly larger than that of the wafer 100 and is made of a porous material. The frame 91 supports the pad holding portion. Part 90. The lower surface of the pad holding portion 90 becomes the pad holding surface 92 that attracts and holds the back surface 102 which is the upper surface of the wafer 100 .

In addition, the carry-out mechanism 172 is provided with a suction path 89 . The suction path 89 extends through the arm 81 , the support column 83 , the disc member 84 , and the frame 91 of the pad 80 , and its lower end is connected to the upper surface of the pad holding portion 90 . In addition, the upper end of the suction path 89 is connected to a suction source 99 .

Therefore, in the carry-out mechanism 172, the suction source 99 is communicated with the suction path 89 in a state where the pad holding surface 92 is in contact with the wafer 100 held on the holding surface 22 of the chuck table 20, thereby becoming The suction force of the suction source 99 can be transmitted to the pad holding surface 92 , and the wafer 100 can be sucked and held by the pad holding surface 92 .

In addition, the rotating post 82 and the arm 81 can be rotated and lifted by the motor 94 and the vertical movement mechanism 95, so that the pad 80 holding the wafer 100 can be rotated and lifted, and the wafer 100 can be lifted from the work chuck. 20 to move out.

Moreover, as shown in FIG. 1, the grinding machine 1 has the control part 7 for controlling the grinding machine 1. As shown in FIG. The control unit 7 is provided with a CPU for performing arithmetic processing in accordance with a control program, a storage medium such as a memory, and the like. The control unit 7 executes various processes and collectively controls each component of the grinding device 1 .

For example, the control unit 7 controls the above-mentioned components of the grinding apparatus 1 to perform grinding processing on the wafer 100 .

In addition, the control unit 7 periodically grinds the holding surface 22 with the grinding stone 77 of the grinding mechanism 70 in order to prevent the reduction of the suction force of the holding surface 22 which is the surface of the porous member 21 in the work holder 20. The self-grinding is used to remove the grinding debris on the outer peripheral portion of the holding surface 22. In addition, when the holding surface 22 is ground, it does not matter whether the fluid is sprayed from the holding surface 22 or not.

Furthermore, in this self-grinding, there is a case where grinding debris enters the inside of the porous member 21. The aforementioned grinding debris includes: the debris generated by grinding the porous member 21 due to the grinding of the holding surface 22, the Grinding debris remaining on the outer peripheral portion of the holding surface 22 during grinding of the wafer 100 and abrasive grains falling off from the grinding stone 77 for grinding the holding surface 22 . Then, the control unit 7 performs cleaning processing for removing the grinding debris on the porous member 21 and the holding surface 22 . Hereinafter, the washing process in this embodiment will be described.

[1st holding step] In the cleaning process, the control unit 7 first takes out the unprocessed wafer 100 from the first cassette 161 by the robot 155, and places it on the temporary table 154 of the temporary mechanism 152, and the wafer 100 in the predetermined position.

In addition, the control unit 7 controls the carry-in mechanism 170 to hold the wafer 100 on the temporary storage mechanism 152 . That is, the control unit 7 rotates and lifts the pad 80 by the motor 94 and the vertical movement mechanism 95 of the loading mechanism 170 shown in FIG. In this state, by connecting the suction source 99 to the suction path 89 , the carry-in mechanism 170 sucks and holds the wafer 100 through the pad holding surface 92 of the pad 80 .

Afterwards, the control unit 7 places the wafer 100 on the holding surface 22 of the work chuck 20 already located near the temporary placement mechanism 152 by rotating and lifting the pad 80 of the carrying-in mechanism 170, and moves the pad 80 from the working position. The clamping table 20 retreats. Thereby, as shown in FIG. 2 , the holding surface 22 is covered with the wafer 100 .

Afterwards, the control unit 7 opens the suction switching valve 475 shown in FIG. 2 , and adjusts the orifice diameter of the suction flow adjustment unit 473 , so that the porous member 21 of the chuck 20 communicates with the suction source 47 . Thereby, the holding surface 22 of the chuck table 20 attracts and holds the wafer 100 . Furthermore, the diameter of the orifice of the suction flow adjustment part 473 may also be fully open.

[2nd holding step] Next, the control unit 7 uses the carry-out mechanism 172 to hold the wafer 100 being sucked and held by the holding surface 22 . That is, the control unit 7 rotates and lifts the pad 80 by the motor 94 of the unloading mechanism 172 and the vertical movement mechanism 95, so that the pad holding surface 92 contacts the wafer 100 held on the holding surface 22 of the work chuck 20. . In this state, by connecting the suction source 99 to the suction path 89 , the carry-out mechanism 172 can suck and hold the wafer 100 through the pad holding surface 92 of the pad 80 .

Thereby, as shown in FIG. 2 , the wafer 100 is held by the carry-out mechanism 172 while covering the holding surface 22 of the work chuck 20 . Thereafter, the control unit 7 closes the suction switch valve 475 to stop the suction holding of the wafer 100 by the holding surface 22 of the chuck 20 .

[Fluid ejection procedure] Next, the control unit 7 ejects a two-fluid that is a mixed fluid of water and air from the holding surface 22 covered with the wafer 100 . Thereby, the two-fluid ejected from the holding surface 22 flows between the holding surface 22 and the wafer 100 toward the diameter direction of the holding surface 22 and toward the outside, thereby removing the abrasive from the porous member 21 and the holding surface 22 of the work clamp 20 . crumbs.

That is, the control part 7 will open the air supply switch valve 485 and the water supply switch valve 495, and adjust the orifice diameter of the air adjustment part 483 and the orifice diameter of the water adjustment part 493, so that the porous member 21 of the work chuck 20 It communicates with the air supply source 48 and the water supply source 49 . Thereby, the control unit 7 supplies a predetermined amount of two fluids of air and water to the porous member 21 as indicated by the arrow 501 in FIG. 3 . Furthermore, the orifice diameter of the air adjustment part 483 and the orifice diameter of the water adjustment part 493 may also be fully open.

The two fluids supplied to the porous member 21 flow from bottom to top in the porous member 21 , and are ejected from the holding surface 22 to the outside together with the grinding chips in the porous member 21 . Thereby, as shown in FIG. 3 , the wafer 100 held by the carry-out mechanism 172 in the state where the holding surface 22 has been covered will resist the potential force of the spring 860 as shown by the arrow 503 due to the two-fluid 200 , and Together with the pad 80, it floats from the holding surface 22. In addition, the two-fluid 200 containing grinding chips flows out from the gap between the holding surface 22 and the wafer 100 toward the outside in the radial direction of the holding surface 22 . Furthermore, at this time, as shown in FIG. 3 , the spring 860 contracts as the pad 80 rises, and the head 88 of the bolt 86 floats from the upper surface of the circular plate member 84 .

After a predetermined time elapses from the start of ejection of the two-fluid 200 , the controller 7 closes the air supply on-off valve 485 and the water supply on-off valve 495 to stop the ejection of the two-fluid 200 . Thereafter, the control unit 7 separates the wafer 100 from the holding surface 22 by rotating and lifting the pad 80 of the carry-out mechanism 172 holding the wafer 100 .

As described above, in the present embodiment, by flowing the dual fluid 200 from below the porous member 21 toward the holding surface 22 in a state where the holding surface 22 has been covered with the wafer 100 , the fluid that enters the porous surface 22 from the holding surface 22 can be The grinding chips of the member 21 are discharged from the porous member 21 and the holding surface 22 . Therefore, when the wafer 100 is ground by the grinding mechanism 70 , it is possible to prevent grinding debris from being interposed between the holding surface 22 and the wafer 100 , so that the wafer 100 can be ground to a uniform thickness.

In addition, in this embodiment, in order to discharge the grinding chips from the porous member 21, the wafer 100 which is the workpiece and the carrying-out mechanism 172 which is an existing configuration are used. Therefore, since the number of additional configurations for discharging the grinding chips from the porous member 21 and the holding surface 22 can be reduced, the removal of the grinding chips can be performed while avoiding an increase in the size of the grinding device 1 .

Furthermore, in the fluid ejection step, if the dual fluid 200 is supplied to the porous member 21 in a state where the holding surface 22 is not covered by the wafer 100, the dual fluid 200 will only pass through the easily passed portion of the porous member 21 from the The retaining surface 22 is ejected. Therefore, it is difficult to discharge the grinding dust from the entire area of the porous member 21 .

Regarding this, in the present embodiment, the two-fluid 200 is supplied to the porous member 21 in a state where the holding surface 22 is covered with the wafer 100 being held by the carry-out mechanism 172 . Thereby, since the two-fluid 200 can be ejected from the holding surface 22 while pressure is applied to the holding surface 22 , the two-fluid 200 can be ejected from the entire surface of the holding surface 22 . Thereby, it becomes possible to discharge the grinding dust from substantially the entire area inside the porous member 21 .

Moreover, the control unit 7 can also clean the lower surface of the wafer 100 that has been separated from the holding surface 22 by using the lower surface cleaning mechanism 180 shown in FIG. The front surface 101 is covered with the wafer 100 again, and the dual fluid 200 is sprayed from the holding surface 22 to remove grinding debris from the porous member 21 and the holding surface 22 .

In this case, the control unit 7 performs the following lower surface cleaning step after the fluid ejection step.

[Bottom surface cleaning procedure] The control unit 7 separates the wafer 100 from the holding surface 22 by rotating and lifting the pad 80 of the carry-out mechanism 172 holding the wafer 100, and arranges the wafer 100 directly above the lower surface cleaning mechanism 180 as shown in FIG. 4 . .

The lower surface cleaning mechanism 180 is provided with a sponge roller 181, a hollow shaft 182, and a base member 183. The shaft 182 is inserted into the sponge roller 181 to hold the sponge roller 181. The base member 183 supports the shaft 182. to rotate freely. The shaft 182 is connected to the water source 185 through the joint 184 , so that the water supplied from the water source 185 can be supplied to the sponge roller 181 through the hole provided on the surface of the shaft 182 .

Then, as shown in FIG. 4 , the controller 7 adjusts the position of the pad 80 holding the unloading mechanism 172 of the wafer 100 so that the front surface 101 of the wafer 100 contacts the sponge roller 181 in the lower surface cleaning mechanism 180 . In addition, while the control unit 7 supplies water to the sponge roller 181 of the lower surface cleaning mechanism 180, as shown by arrow 505 in FIG. Orbital movement in the direction. Thereby, the sponge roller 181 containing water contacts the front surface 101 of the wafer 100 while rotating, and cleans the front surface 101 .

After the entire surface of the front surface 101 of the wafer 100 has been cleaned, the control unit 7 ends the lower surface cleaning step, and makes the pad 80 of the unloading mechanism 172 rotate and lift, and the work chuck is covered by the wafer 100 20 retaining surface 22 . Then, the control unit 7 performs the above-mentioned fluid ejection step again to remove the grinding debris from the porous member 21 and the holding surface 22 .

In this configuration, the removal of grinding debris from the porous member 21 and the holding surface 22 can be repeated while cleaning the front surface 101 which is the lower surface of the wafer 100 . Thus, it becomes possible to satisfactorily remove the grinding dust from the porous member 21 and the holding surface 22 .

Also, in the above-mentioned embodiment, as shown in FIG. 2 , the area of the pad 80 in the carry-out mechanism 172 is slightly larger than the area of the wafer 100 . Alternatively, the pad 80 may have an area smaller than that of the wafer 100 as shown in FIG. 5 .

In this configuration, the pad 80 does not hold the outer peripheral portion of the wafer 100 . Therefore, in the fluid ejection step, when the dual fluid 200 is ejected from the holding surface 22 of the chuck 20 , a gap tends to be generated between the holding surface 22 and the outer peripheral portion of the wafer 100 . Thereby, since it becomes easy to discharge the two-fluid 200 containing the grinding debris toward the radial direction outside of the holding surface 22 from the gap between the holding surface 22 and the wafer 100, it becomes possible to satisfactorily discharge the fluid from the porous member 21 and the holding surface. 22 Remove the grinding swarf.

In addition, in the above-mentioned embodiment, the wafer 100 is used as the plate-shaped object covering the holding surface 22 of the chuck 20 during the fluid ejection step. In this connection, a pseudo-wafer or a plate-shaped plate may be used as the plate-shaped object covering the holding surface 22 . The dummy wafer may be, for example, a wafer not to be ground by the grinding apparatus 1 . Also, the plate-shaped plate may be, for example, a plate used for washing the porous member 21 . In this case, the dummy wafer or the plate-shaped plate is previously accommodated in the first cassette 161 , and can be taken out by the robot 155 in the first holding step and sucked and held on the holding surface 22 of the chuck table 20 .

In addition, in the above-mentioned embodiment, the control unit 7 executes the fluid ejection step in a state where the holding surface 22 of the chuck table 20 is covered with the wafer 100 being held by the carry-out mechanism 172 . Instead of this, the control unit 7 may execute the fluid ejection step in a state where the wafer 100 being held by the carry-in mechanism 170 covers the holding surface 22 of the chuck table 20 . In this case, in the second holding step, the carry-in mechanism 170 holds the wafer 100 sucked and held on the holding surface 22 . In addition, in this case, the lower surface cleaning mechanism 180 may be arranged near the carrying-in mechanism 170 .

1: Grinding device 6: turntable 7: Control Department 10: The first device base 11: The second device base 15: Pillar 20: Work clamp table 21: Porous components 22: keep the surface 23: frame 30: Rotating mechanism 31: motor 32: Driving pulley 33: endless belt 34: driven pulley 35: axis of rotation 40: Fluid circulation mechanism 47: Source of Attraction 48: Air supply source 49: Water supply source 60: Grinding feed mechanism 61: Z-axis guide rail 62: Z-axis ball screw 63: Z-axis mobile table 64: Z axis motor 66: Supporter 70: Grinding mechanism 71: Spindle housing 72:Spindle 73: Spindle motor 74: wheel seat 75: Grinding wheel 76: wheel abutment 77: grinding stone 80: Pad 81: arm 82: rotating column 83: Pillar 84: Circular plate member 85: Through hole 86: Bolt 87: Shaft 88: head 89: attract road 90: Pad holding part 91: frame 92: Pad holding surface 94: motor 95: up and down moving mechanism 99: source of attraction 100: Wafer 101: Front 102: back 152: Temporary institutions 153: Alignment member 154: Temporary workbench 155: Robot 156: Rotary cleaning mechanism 157:Rotary table 158: Nozzle 160: The first cassette carrier 161: 1st cassette 162: The second cassette carrier 163: The second cassette 170: Moved into institution 172: Move out of the institution 180: lower surface cleaning mechanism 181: sponge roller 182: shaft 183: Base member 184: Connector 185: water source 200: two-fluid 403: attraction groove 460: Rotary joint 470: Attract flow path 471: Suction piping 473: Attract traffic adjustment department 475: suction switch valve 481: Air piping 483: Air Conditioning Department 485: Air supply switching valve 487:Pressure sensor 491: Water piping 493: Water Adjustment Department 495: water supply switch valve 501, 503, 505: Arrows 860: spring +X,-X,+Y,-Y,+Z,-Z: direction

Fig. 1 is a perspective view showing the construction of a grinding device. FIG. 2 is an explanatory diagram showing a first holding step and a second holding step. Fig. 3 is an explanatory view showing a fluid ejection step. Fig. 4 is an explanatory view showing a lower surface cleaning step. Fig. 5 is an explanatory diagram showing a modified example of the pad of the carry-out mechanism.

20: Work clamp table

21: Porous components

22: keep the surface

23: frame

30: Rotating mechanism

31: motor

32: Driving pulley

33: endless belt

34: driven pulley

35: axis of rotation

40: Fluid circulation mechanism

47: Source of Attraction

48: Air supply source

49: Water supply source

80: Pad

81: arm

82: rotating column

83: Pillar

84: Circular plate member

85: Through hole

86: Bolt

87: Shaft

88: head

89: attract road

90: Pad holding part

91: frame

92: Pad holding surface

94: motor

95: up and down moving mechanism

99: source of attraction

100: Wafer

101: Front

102: back

170: Moved into institution

172: Move out of the institution

200: two-fluid

403: attraction groove

460: Rotary joint

470: Attract flow path

471: Suction piping

473: Attract traffic adjustment department

475: suction switch valve

481: Air piping

483: Air Conditioning Department

485: Air supply switch valve

487:Pressure sensor

491: Water piping

493: Water Adjustment Department

495: water supply switch valve

501,503: Arrows

860: spring

+Z, -Z: direction

Claims (2)

A grinding device comprising: The work clamping platform attracts and holds the plate-shaped objects through the holding surface of the porous member; The grinding mechanism is used to grind the plate-shaped object attracted and held by the holding surface with the grinding stone; Move into the mechanism, hold the plate and move into the holding surface; The unloading mechanism holds the plate and unloads it from the holding surface; and Control Department, The control unit performs the following controls: Make the plate attract and hold on the holding surface; holding the plate-shaped object being sucked and held by the holding surface by the carrying-out mechanism or the carrying-in mechanism; and A two-fluid mixed with water and air is ejected from the holding surface covered with the plate, The two fluids jetted from the holding surface flow between the holding surface and the plate-shaped object in the diameter direction of the holding surface and outward, thereby removing grinding debris from the porous member and the holding surface. As in the grinding device of claim 1, it is further equipped with a lower surface cleaning mechanism, and the aforementioned lower surface cleaning mechanism cleans the lower surface of the plate-shaped object held by the carrying-out mechanism or the carrying-in mechanism, The control unit cleans the lower surface of the plate that has been separated from the holding surface by the lower surface cleaning mechanism after the two-fluid is ejected from the holding surface, and covers the plate with the plate again. the holding surface, and the two fluids are ejected from the holding surface to remove grinding debris from the porous member and the holding surface.