JP2020113670A - Cleaning unit - Google Patents

Cleaning unit Download PDF

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JP2020113670A
JP2020113670A JP2019004267A JP2019004267A JP2020113670A JP 2020113670 A JP2020113670 A JP 2020113670A JP 2019004267 A JP2019004267 A JP 2019004267A JP 2019004267 A JP2019004267 A JP 2019004267A JP 2020113670 A JP2020113670 A JP 2020113670A
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sponge
workpiece
suction
carrying
water
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JP7161412B2 (en
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聡 山中
Satoshi Yamanaka
聡 山中
石井 茂
Shigeru Ishii
茂 石井
弘樹 宮本
Hiroki Miyamoto
弘樹 宮本
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Disco Corp
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Disco Abrasive Systems Ltd
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Abstract

To provide a cleaning unit which cleans and dries a workpiece in a short time, while saving an installation space.SOLUTION: A cleaning unit 4 comprises support means 42 including a suction hole 420c supporting a sponge 41 in contact with a workpiece and interconnected with a suction source, means 43 for sucking water in the sponge 41 from the suction hole 420c, means 44 for interconnecting the suction hole 420c and a water supply source and overflowing the water from the sponge 41, means 164 for relatively displacing export means 16 and the support means 42 in parallel with the undersurface of the workpiece held by the export means 16, and means 184 for relatively displacing import means 18 and the support means 42 in parallel with the undersurface of the workpiece held by the import means 18. At the time of cleaning a workpiece, water is overflowed from the sponge 41, the sponge 41 is brought into contact with the workpiece, the export means 16 or the import means 18 and the support means 42 are displaced relatively, and at the time of drying the workpiece, the sponge 41 is brought into contact with the workpiece, water of the sponge 41 is drained, and the export means 16 and the support means 42 are displaced relatively.SELECTED DRAWING: Figure 3

Description

本発明は、半導体ウェーハ等の被加工物を洗浄する洗浄ユニットに関する。 The present invention relates to a cleaning unit for cleaning a workpiece such as a semiconductor wafer.

チャックテーブルに下面が保持された半導体ウェーハ等の被加工物の上面を加工具で加工する加工装置は、加工後に、被加工物の上面を吸引保持する搬出手段で被加工物をチャックテーブルから搬出している。 A processing device that processes the upper surface of a workpiece such as a semiconductor wafer whose lower surface is held on a chuck table with a processing tool, then unloads the workpiece from the chuck table by a carry-out means that suction-holds the upper surface of the workpiece. doing.

そして、搬出手段でチャックテーブルから被加工物を離間させ次工程の装置に搬送する間に、被加工物の下面に洗浄水を供給しつつスポンジを当接させて該下面を洗浄している(例えば、特許文献1参照)。洗浄後に被加工物の下面に水が付着するため、特許文献2に開示されている研削装置のように、エアノズルのエアが噴射されている噴射口の上方をゆっくりと被加工物を移動させ、被加工物の下面をエアによって乾燥させている。 Then, while the work piece is separated from the chuck table by the carry-out means and is conveyed to the apparatus of the next step, the lower surface of the work piece is cleaned by abutting the sponge while supplying cleaning water to the lower surface ( For example, see Patent Document 1). Since water adheres to the lower surface of the work piece after cleaning, the work piece is slowly moved above the injection port where the air of the air nozzle is ejected, as in the grinding device disclosed in Patent Document 2. The lower surface of the work piece is dried by air.

特開2013−094876号公報JP, 2013-094876, A 特開2010−167519号公報JP, 2010-167519, A

しかしエアで水滴を被加工物の下面から吹き飛ばすため、被加工物をエアノズルの上方で高速移動させると下面に水滴が残ってしまう問題がある。また、加工装置内に、洗浄用の洗浄機構と、乾燥用のエアノズルとを備える必要があるため、設置スペースを広くとられるという問題がある。 However, since the water droplets are blown off from the lower surface of the workpiece by air, there is a problem that when the workpiece is moved at a high speed above the air nozzle, the water droplets remain on the lower surface. In addition, since it is necessary to provide a cleaning mechanism for cleaning and an air nozzle for drying in the processing device, there is a problem that a large installation space can be taken.

よって、半導体ウェーハ等の被加工物を洗浄する洗浄ユニットにおいては、短時間で被加工物を十分に洗浄又は乾燥させ、また、洗浄ユニットの設置スペースの省スペース化を図るという課題がある。 Therefore, in a cleaning unit for cleaning an object to be processed such as a semiconductor wafer, there is a problem that the object to be processed is sufficiently cleaned or dried in a short time, and the installation space of the cleaning unit is reduced.

上記課題を解決するための本発明は、被加工物の下面を保持するチャックテーブルと、加工具を回転可能に支持し該チャックテーブルに保持された被加工物の上面を加工する加工手段と、被加工物の上面を保持し該チャックテーブルに搬入する搬入手段と、被加工物の上面を保持し該チャックテーブルから搬出する搬出手段と、を備える加工装置に配設され、該搬入手段または該搬出手段に保持された被加工物の下面を洗浄する洗浄ユニットであって、該洗浄ユニットは、被加工物に接触するスポンジと、該スポンジの被加工物に接触する部分以外の部分で該スポンジを支持するとともに該スポンジを吸引源に連通する吸引孔を備える支持手段と、該スポンジに含まれる水を該吸引孔から吸引し排水する排水手段と、該吸引孔を水供給源に連通させ該スポンジの被加工物に接触する部分から水を溢れ出させる水供給手段と、該搬出手段に保持された被加工物の下面に平行に該搬出手段と該支持手段とを相対的に移動させる、または該搬入手段に保持された被加工物の下面に平行に該搬入手段と該支持手段とを相対的に移動させる移動手段と、を備え、被加工物を洗浄するときは、該水供給手段により該スポンジの被加工物に接触する部分から水を溢れ出させ、該スポンジを被加工物に接触させ、該移動手段で該搬出手段と該支持手段とを、または該移動手段で該搬入手段と該支持手段とを相対的に移動させ、被加工物を乾燥させるときは、該スポンジを被加工物に接触させ、該排水手段により該スポンジに含まれた水を排水しながら、該移動手段で該搬出手段と該支持手段とを相対的に移動させる洗浄ユニットである。 The present invention for solving the above problems, a chuck table for holding a lower surface of a workpiece, a processing means for rotatably supporting a processing tool and processing an upper surface of the workpiece held by the chuck table, The carrying-in means, which is provided with a carrying-in means for holding the upper surface of the workpiece and carrying it into the chuck table, and a carrying-out means for carrying the upper surface of the workpiece and carrying it out of the chuck table, are provided. A cleaning unit for cleaning a lower surface of a workpiece held by a carry-out means, the cleaning unit including a sponge that contacts the workpiece and the sponge at a portion other than a portion of the sponge that contacts the workpiece. Supporting means having a suction hole for supporting the sponge and communicating with the suction source, drainage means for sucking and draining water contained in the sponge from the suction hole, and communicating the suction hole with a water supply source. A water supply means for causing water to overflow from a portion of the sponge which comes into contact with the work piece, and a relative movement of the carry-out means and the support means parallel to the lower surface of the work piece held by the carry-out means, Alternatively, the water supply means is provided when the workpiece is washed, including a moving means for relatively moving the loading means and the supporting means in parallel to the lower surface of the workpiece held by the loading means. Water is made to overflow from the portion of the sponge that comes into contact with the work piece, the sponge is brought into contact with the work piece, and the transfer means and the support means are provided by the moving means, or the carry-in means is provided by the moving means. And the supporting means are relatively moved to dry the work piece, the sponge is brought into contact with the work piece, and the water contained in the sponge is drained by the draining means while moving the moving means. Is a cleaning unit that relatively moves the carry-out means and the support means.

前記スポンジは、ロールスポンジであって、前記支持手段は、該ロールスポンジの筒内に挿入され外側面に前記吸引孔が配設されたシャフトと、該シャフトを回転自在に支持する支持部と、を備えると好ましい。 The sponge is a roll sponge, and the supporting means includes a shaft that is inserted into a cylinder of the roll sponge and has the suction hole on the outer surface thereof, and a support portion that rotatably supports the shaft. Is preferred.

前記スポンジは、矩形スポンジであって、前記支持手段は、該矩形スポンジの被加工物に接する部分を露出させ該矩形スポンジの被加工物に接する部分以外を収容する凹部を有し、該凹部の内面に該吸引孔が形成された基台と、を備えると好ましい。 The sponge is a rectangular sponge, and the supporting means has a concave portion that exposes a portion of the rectangular sponge that contacts the workpiece, and that accommodates a portion other than the portion of the rectangular sponge that contacts the workpiece. It is preferable to provide a base having the suction hole formed on the inner surface.

チャックテーブルと、加工手段と、搬入手段と、搬出手段と、を備える加工装置に配設され、搬入手段または搬出手段に保持された被加工物の下面を洗浄する本発明に係る洗浄ユニットは、被加工物に接触するスポンジと、スポンジの被加工物に接触する部分以外の部分でスポンジを支持するとともにスポンジを吸引源に連通する吸引孔を備える支持手段と、スポンジに含まれる水を吸引孔から吸引し排水する排水手段と、吸引孔を水供給源に連通させスポンジの被加工物に接触する部分から水を溢れ出させる水供給手段と、搬出手段に保持された被加工物の下面に平行に搬出手段と支持手段とを相対的に移動させる、または搬入手段に保持された被加工物の下面に平行に搬入手段と支持手段とを相対的に移動させる移動手段と、を備えているため、被加工物を洗浄するときは、水供給手段によりスポンジの被加工物に接触する部分から水を溢れ出させ、スポンジを被加工物に接触させ、移動手段で搬出手段と支持手段とを、または移動手段で搬入手段と支持手段とを相対的に移動させて洗浄を行うことができる。
また、被加工物を乾燥させるときは、スポンジを被加工物に接触させ、排水手段によりスポンジに含まれた水を排水しながら、移動手段で搬出手段と支持手段とを相対的に移動させることで、スポンジを水で飽和させることなく被加工物を継続的に十分に乾燥させることができる。被加工物乾燥時に、スポンジを乾燥させつつ被加工物に接触させることで、洗浄時に洗浄しきれず被加工物に付着している細かな加工屑を拭き取ることも可能となる。さらに、水供給手段から水をスポンジに供給して、スポンジの被加工物に接触する部分から水を溢れ出させることで、被加工物の洗浄時又は乾燥時に拭き取られスポンジの該接触する部分に付着した細かな加工屑を除去することができ、次の被加工物に対して綺麗なスポンジで洗浄又は乾燥を行うことが可能となる。
そして、本発明に係る洗浄ユニットは、スポンジで被加工物の洗浄と乾燥とが可能となるので、加工装置内における洗浄ユニットの設置スペースの省スペース化をなし得る。
A cleaning unit according to the present invention, which is disposed in a processing apparatus including a chuck table, a processing unit, a loading unit, and an unloading unit, and which cleans a lower surface of a workpiece held by the loading unit or the unloading unit, A sponge that comes into contact with the workpiece, a support means that supports the sponge at a portion other than the portion of the sponge that comes into contact with the workpiece, and a suction hole that communicates the sponge with a suction source, and a suction hole for sucking water contained in the sponge. On the lower surface of the workpiece held by the unloading means, the water discharging means for sucking and draining from the water, the water supplying means for communicating the suction hole to the water supply source and overflowing the water from the portion of the sponge that comes into contact with the workpiece. And a moving means for relatively moving the carry-out means and the supporting means in parallel to each other, or a moving means for relatively moving the carry-in means and the supporting means in parallel to the lower surface of the workpiece held by the carry-in means. Therefore, when cleaning the work piece, water is made to overflow from the portion of the sponge that comes into contact with the work piece by the water supply means, the sponge is brought into contact with the work piece, and the transfer means and the support means are moved by the moving means. Alternatively, the carrying-in means and the supporting means may be relatively moved by the moving means for cleaning.
Further, when the work piece is dried, the sponge is brought into contact with the work piece, and while the water contained in the sponge is being drained by the draining means, the discharging means and the supporting means are relatively moved by the moving means. Thus, the work piece can be continuously and sufficiently dried without saturating the sponge with water. When the workpiece is dried, the sponge is dried and brought into contact with the workpiece, so that it is possible to wipe off fine processing scraps attached to the workpiece that cannot be washed during cleaning. Further, by supplying water from the water supply means to the sponge and causing the water to overflow from the portion of the sponge that comes into contact with the workpiece, the portion of the sponge that is wiped off during cleaning or drying of the workpiece. It is possible to remove the fine processing scraps attached to, and it is possible to wash or dry the next workpiece with a clean sponge.
Since the cleaning unit according to the present invention can clean and dry the work piece with the sponge, the installation space of the cleaning unit in the processing apparatus can be saved.

スポンジは、ロールスポンジであって、支持手段は、ロールスポンジの筒内に挿入され外側面に吸引孔が配設されたシャフトと、シャフトを回転自在に支持する支持部と、を備えることで、被加工物の洗浄中又は乾燥中において、ロールスポンジの被加工物の下面に接触する外周面が回転できるため、外周面の全面で満遍なく洗浄又は乾燥を行えるようになる。 The sponge is a roll sponge, and the supporting means includes a shaft that is inserted into the cylinder of the roll sponge and has a suction hole on the outer surface thereof, and a supporting portion that rotatably supports the shaft. During cleaning or drying of the workpiece, the outer peripheral surface of the roll sponge that contacts the lower surface of the workpiece can rotate, so that the entire outer peripheral surface can be uniformly cleaned or dried.

スポンジは、矩形スポンジであって、支持手段は、矩形スポンジの被加工物に接する部分を露出させ矩形スポンジの被加工物に接する部分以外を収容する凹部を有し、凹部の内面に吸引孔が形成された基台と、を備えることで、矩形スポンジの交換時等において作業者が容易に交換を行うことが可能となる。 The sponge is a rectangular sponge, and the supporting means has a concave portion that exposes a portion of the rectangular sponge that contacts the workpiece and accommodates a portion other than the portion of the rectangular sponge that contacts the workpiece, and the suction hole is formed on the inner surface of the concave portion. By including the formed base, it becomes possible for an operator to easily replace the rectangular sponge, for example.

本発明に係る洗浄ユニットが配設された加工装置の一例を示す斜視図である。It is a perspective view showing an example of a processing device in which a cleaning unit concerning the present invention was arranged. ロールスポンジを備える洗浄ユニットの一例を示す斜視図である。It is a perspective view showing an example of a cleaning unit provided with roll sponge. ロールスポンジを備える洗浄ユニットの分解斜視図である。It is an exploded perspective view of a cleaning unit provided with roll sponge. ロールスポンジを備える洗浄ユニットによって被加工物の下面に貼着された保護テープの洗浄を開始した状態を説明する断面図である。It is sectional drawing explaining the state which started washing|cleaning of the protective tape stuck on the lower surface of a to-be-processed object by the washing unit provided with roll sponge. ロールスポンジを備える洗浄ユニットによって被加工物の下面に貼着された保護テープの洗浄を行っている状態を説明する断面図である。It is sectional drawing explaining the state which is cleaning the protective tape stuck on the lower surface of the to-be-processed object by the cleaning unit provided with roll sponge. ロールスポンジを備える洗浄ユニットによって被加工物の下面に貼着された保護テープの乾燥を開始した状態を説明する断面図である。It is sectional drawing explaining the state which started the drying of the protective tape stuck on the lower surface of a to-be-processed object by the washing unit provided with a roll sponge. ロールスポンジを備える洗浄ユニットによって被加工物の下面に貼着された保護テープの乾燥を行っている状態を説明する断面図である。It is sectional drawing explaining the state which is drying the protective tape stuck on the lower surface of a to-be-processed object by the washing unit provided with roll sponge. ロールスポンジの外周面の洗浄を行っている状態を説明する断面図である。It is sectional drawing explaining the state which is wash|cleaning the outer peripheral surface of roll sponge. 矩形スポンジを備える洗浄ユニットの一例を示す斜視図である。It is a perspective view showing an example of a cleaning unit provided with a rectangular sponge. 矩形スポンジを備える洗浄ユニットの分解斜視図である。It is a disassembled perspective view of the washing unit provided with a rectangular sponge. 矩形スポンジを備える洗浄ユニットによって被加工物の下面に貼着された保護テープの洗浄を開始した状態を説明する断面図である。It is sectional drawing explaining the state which started washing|cleaning of the protective tape stuck on the lower surface of a to-be-processed object by the washing unit provided with a rectangular sponge. 矩形スポンジを備える洗浄ユニットによって被加工物の下面に貼着された保護テープの乾燥を開始した状態を説明する断面図である。It is sectional drawing explaining the state which started the drying of the protective tape stuck on the lower surface of the to-be-processed object by the washing unit provided with a rectangular sponge. 矩形スポンジの上面の洗浄を行っている状態を説明する断面図である。It is sectional drawing explaining the state which is cleaning the upper surface of a rectangular sponge.

図1に示す加工装置1は、例えば、チャックテーブル30に保持された被加工物W(例えば、円形の半導体ウェーハ)に対して加工手段6によって研削加工を施す研削装置である。なお、加工装置1は、研削手段が粗研削手段と仕上げ研削手段との2軸である研削装置であってもよいし、回転する切削ブレードで被加工物Wを切削する切削装置、又は研磨パッドで被加工物Wを研磨する研磨装置等であってもよい。 The processing apparatus 1 shown in FIG. 1 is, for example, a grinding apparatus that performs a grinding process on a workpiece W (for example, a circular semiconductor wafer) held on a chuck table 30 by a processing unit 6. The processing device 1 may be a grinding device in which the grinding means is biaxial of rough grinding means and finish grinding means, or a cutting device that cuts the workpiece W with a rotating cutting blade, or a polishing pad. A polishing device or the like for polishing the workpiece W may be used.

図1に示すように、加工装置1の装置ベース10上には、筐体11が配設されており、筐体11内には加工室が画成されている。例えば筐体11の−Y方向側の側面には、作業者が加工装置1に対して被加工物Wの加工条件を入力するためのタッチパネル19が配設されている。 As shown in FIG. 1, a housing 11 is arranged on the apparatus base 10 of the processing apparatus 1, and a processing chamber is defined in the housing 11. For example, a touch panel 19 is provided on the side surface of the housing 11 on the −Y direction side for the operator to input the processing conditions of the workpiece W to the processing apparatus 1.

加工装置1の装置ベース10上の前方(−Y方向側)は、チャックテーブル30に対して被加工物Wの着脱が行われる領域であり、装置ベース10上の後方(+Y方向側)は、加工手段6によってチャックテーブル30上に保持された被加工物Wの研削が行われる領域である。 The front (−Y direction side) of the processing device 1 on the device base 10 is a region where the workpiece W is attached to and detached from the chuck table 30, and the rear (+Y direction side) of the device base 10 is This is a region where the workpiece W held on the chuck table 30 by the processing means 6 is ground.

装置ベース10の−Y方向側の正面には、第1のカセット載置部150及び第2のカセット載置部151が設けられており、第1のカセット載置部150には加工前の被加工物Wが収容される第1のカセット150aが載置され、第2のカセット載置部151には加工後の被加工物Wが収容される第2のカセット151aが載置される。 A first cassette mounting portion 150 and a second cassette mounting portion 151 are provided on the front surface of the device base 10 on the −Y direction side, and the first cassette mounting portion 150 is provided with a workpiece before processing. The first cassette 150a in which the workpiece W is accommodated is placed, and the second cassette 151a in which the processed workpiece W is accommodated is placed on the second cassette placing portion 151.

第1のカセット150aに複数枚棚状に収容されている被加工物Wは、例えば、シリコンを母材とする外形が円形の半導体ウェーハであり、図1における下面Waは、図示しないデバイスが形成されており、被加工物Wと略同径の円形の保護テープTが貼着されて保護されている。なお、被加工物Wはシリコン以外にガリウムヒ素、サファイア、窒化ガリウム又はシリコンカーバイド等で構成されていてもよい。 The workpieces W housed in the first cassette 150a in the shape of a plurality of shelves are, for example, semiconductor wafers having silicon as a base material and having a circular outer shape, and the lower surface Wa in FIG. A circular protective tape T having a diameter substantially the same as that of the workpiece W is attached and protected. The workpiece W may be made of gallium arsenide, sapphire, gallium nitride, silicon carbide, or the like, other than silicon.

第1のカセット150aの+Y方向側の開口の後方には、第1のカセット150aから加工前の被加工物Wを搬出するとともに加工後の被加工物Wを第2のカセット151aに搬入するロボット155が配設されている。ロボット155に隣接する位置には、仮置き領域152が設けられており、仮置き領域152には位置合わせ手段153が配設されている。位置合わせ手段153は、第1のカセット150aから搬出され仮置き領域152に載置された被加工物Wを、縮径する位置合わせピンで所定の位置にセンタリングする。 A robot that carries out the unprocessed workpiece W from the first cassette 150a and carries the processed workpiece W into the second cassette 151a behind the opening on the +Y direction side of the first cassette 150a. 155 is provided. A temporary placement area 152 is provided at a position adjacent to the robot 155, and a positioning means 153 is provided in the temporary placement area 152. The positioning means 153 centers the workpiece W, which has been unloaded from the first cassette 150a and placed in the temporary placement area 152, at a predetermined position with a positioning pin that reduces its diameter.

位置合わせ手段153と隣接する位置には、被加工物Wを保持した状態で旋回する搬入手段18が配置されている。搬入手段18は、位置合わせ手段153において位置合わせされた被加工物Wを保持し、加工領域内に配設されているチャックテーブル30へ搬送する。搬入手段18は、水平に延在するアーム部180の一端の下面側に円形の吸引パッド181を備えている。アーム部180には回転軸等からなる搬入移動手段184及びシリンダー機構等からなる搬入昇降手段185が接続されており、搬入移動手段184は、アーム部180を水平面(X軸Y軸平面)上において旋回移動可能にし、搬入昇降手段185はアーム部180を鉛直方向(Z軸方向)に昇降可能にしている。 At a position adjacent to the position aligning unit 153, a carrying-in unit 18 that rotates while holding the workpiece W is disposed. The carry-in means 18 holds the workpiece W aligned by the aligning means 153, and conveys the workpiece W to the chuck table 30 arranged in the processing area. The carry-in means 18 is provided with a circular suction pad 181 on the lower surface side of one end of the horizontally extending arm portion 180. The arm section 180 is connected to a carry-in moving means 184 including a rotating shaft and a carry-in raising/lowering means 185 including a cylinder mechanism. The carry-in moving means 184 places the arm section 180 on a horizontal plane (X-axis Y-axis plane). The arm 180 can be swung and moved, and the loading/lowering means 185 can vertically move the arm 180 in the vertical direction (Z-axis direction).

搬入手段18の隣には、加工後の被加工物Wの上面Wbを保持しチャックテーブル30から搬出する搬出手段16が配設されている。搬出手段16は、水平に延在するアーム部160の一端の下面側に吸引パッド161を備えている。アーム部160には回転軸等からなる搬出移動手段164及びシリンダー機構等からなる搬出昇降手段165が接続されており、搬出移動手段164は、アーム部160を水平面(X軸Y軸平面)上において旋回移動可能にし、搬出昇降手段165はアーム部160を鉛直方向(Z軸方向)に昇降可能にしている。
本実施形態においては、搬出移動手段164及び搬入移動手段184によって、搬出手段16に保持された被加工物Wの下面Waに平行に搬出手段16と支持手段42とを相対的に移動させる、または搬入手段18に保持された被加工物Wの下面Waに平行に搬入手段18と支持手段42とを相対的に移動させる移動手段が形成される。
Next to the carry-in means 18, a carry-out means 16 for holding the upper surface Wb of the processed workpiece W and carrying it out from the chuck table 30 is provided. The carry-out means 16 includes a suction pad 161 on the lower surface side of one end of the horizontally extending arm portion 160. The arm portion 160 is connected to a carry-out moving means 164 composed of a rotating shaft and the like and a carry-out lifting means 165 composed of a cylinder mechanism and the like, and the carry-out moving means 164 places the arm portion 160 on a horizontal plane (X-axis Y-axis plane). It can be swung, and the carry-out lifting means 165 can move the arm 160 up and down in the vertical direction (Z-axis direction).
In the present embodiment, the carry-out moving means 164 and the carry-in moving means 184 relatively move the carry-out means 16 and the support means 42 in parallel to the lower surface Wa of the workpiece W held by the carry-out means 16, or A moving means for relatively moving the carry-in means 18 and the support means 42 is formed in parallel with the lower surface Wa of the workpiece W held by the carry-in means 18.

搬出手段16の吸引パッド161(図4参照)は、例えば、その外形が円形状であり、ポーラス部材等からなり被加工物Wを吸着する吸着部161aと、吸着部161aを支持する枠体161bとを備える。吸着部161aは真空発生装置等の吸引源169に連通し、吸引源169が吸引することで生み出された吸引力が、吸着部161aの露出面である平坦な吸着面161cに伝達されることで、吸引パッド161は吸着面161cで被加工物Wを吸引保持する。 The suction pad 161 (see FIG. 4) of the carry-out means 16 has, for example, a circular outer shape, is made of a porous member or the like, and has a suction portion 161a that sucks the workpiece W, and a frame body 161b that supports the suction portion 161a. With. The suction unit 161a communicates with a suction source 169 such as a vacuum generator, and the suction force generated by suction by the suction source 169 is transmitted to the flat suction surface 161c that is the exposed surface of the suction unit 161a. The suction pad 161 sucks and holds the workpiece W by the suction surface 161c.

図1に示すように、搬出手段16と近接する位置には、搬出手段16により搬送された加工後の被加工物Wを洗浄する枚葉式のスピンナー洗浄機構156が配置されている。スピンナー洗浄機構156により洗浄された被加工物Wは、ロボット155により第2のカセット151aに搬入される。 As shown in FIG. 1, a single-wafer spinner cleaning mechanism 156 for cleaning the processed workpiece W conveyed by the carry-out means 16 is arranged at a position close to the carry-out means 16. The workpiece W cleaned by the spinner cleaning mechanism 156 is carried into the second cassette 151a by the robot 155.

加工装置1の装置ベース10上に配設され被加工物Wの下面Waを保護テープTを介して保持するチャックテーブル30は、例えば、その外形が円形状であり、ポーラス部材等からなり被加工物Wを吸引保持する保持面300を備えている。チャックテーブル30は、Z軸方向の軸心周りに回転可能であると共に、カバー39によって周囲から囲まれており、カバー39及びカバー39に連結されY軸方向に伸縮する蛇腹カバー39aの下に配設された図示しないY軸方向移動手段によって、装置ベース10上をY軸方向に往復移動可能となっている。 The chuck table 30 which is disposed on the device base 10 of the processing device 1 and holds the lower surface Wa of the workpiece W via the protective tape T has, for example, a circular outer shape and is made of a porous member or the like to be processed. A holding surface 300 for sucking and holding the object W is provided. The chuck table 30 is rotatable about an axis in the Z-axis direction, is surrounded by a cover 39, and is arranged under the bellows cover 39a that is connected to the cover 39 and expands and contracts in the Y-axis direction. The Y-axis direction moving means (not shown) provided can reciprocate on the device base 10 in the Y-axis direction.

装置ベース10上の後方側(+Y方向側)には、コラム17が立設されており、コラム17の前面には、加工手段6をZ軸方向に加工送りする加工送り手段7が配設されている。加工送り手段7は、Z軸方向の軸心を有するボールネジ70と、ボールネジ70と平行に配設された一対のガイドレール71と、ボールネジ70に連結しボールネジ70を回動させるモータ72と、内部のナットがボールネジ70に螺合し側部がガイドレール71に摺接する昇降板73と、昇降板73に連結され加工手段6を保持するホルダ74とから構成され、モータ72がボールネジ70を回動させると、これに伴い昇降板73がガイドレール71にガイドされてZ軸方向に往復移動し、ホルダ74に支持された加工手段6もZ軸方向に往復移動する。 A column 17 is provided upright on the rear side (+Y direction side) on the device base 10, and a machining feed means 7 for feeding the machining means 6 in the Z-axis direction is arranged on the front surface of the column 17. ing. The machining feed means 7 includes a ball screw 70 having an axis in the Z-axis direction, a pair of guide rails 71 arranged in parallel with the ball screw 70, a motor 72 connected to the ball screw 70 to rotate the ball screw 70, and an internal portion. The nut 72 is screwed onto the ball screw 70 and the side portion is in sliding contact with the guide rail 71, and is composed of an elevator plate 73 and a holder 74 which is connected to the elevator plate 73 and holds the processing means 6. The motor 72 rotates the ball screw 70. As a result, the lifting plate 73 is guided by the guide rails 71 to reciprocate in the Z-axis direction, and the processing means 6 supported by the holder 74 also reciprocates in the Z-axis direction.

加工手段6は、軸方向がチャックテーブル30の保持面300に直交する鉛直方向(Z軸方向)である回転軸60と、回転軸60を回転可能に支持するハウジング61と、回転軸60を回転駆動するモータ62と、回転軸60の下端に取り付けられたマウント63と、マウント63に着脱可能に接続された図2に示す加工具64とを備える。加工具64は、本実施形態においては研削ホイールであり、ホイール基台640と、略直方体形状の外形を備えホイール基台640の下面に複数環状に配設された研削砥石641とを備えている。研削砥石641は、適宜のボンド剤でダイヤモンド砥粒等が固着されて成形されている。 The processing means 6 rotates the rotating shaft 60 whose axial direction is the vertical direction (Z-axis direction) orthogonal to the holding surface 300 of the chuck table 30, the housing 61 which rotatably supports the rotating shaft 60, and the rotating shaft 60. The motor 62 to drive, the mount 63 attached to the lower end of the rotating shaft 60, and the processing tool 64 shown in FIG. The processing tool 64 is a grinding wheel in the present embodiment, and includes a wheel base 640 and a plurality of grinding wheels 641 provided in a ring shape on the lower surface of the wheel base 640 and having a substantially rectangular parallelepiped outer shape. .. The grinding wheel 641 is formed by fixing diamond abrasive grains and the like with an appropriate bonding agent.

例えば、回転軸60の内部には、研削水供給源に連通し研削水の通り道となる図示しない流路が、回転軸60の軸方向(Z軸方向)に貫通して形成されており、流路はホイール基台640の底面において研削砥石641に向かって研削水を噴出できるように開口している。 For example, a flow path (not shown) that is in communication with the grinding water supply source and serves as a passage for the grinding water is formed inside the rotation shaft 60 so as to penetrate in the axial direction (Z-axis direction) of the rotation shaft 60. The passage is opened on the bottom surface of the wheel base 640 so that the grinding water can be ejected toward the grinding wheel 641.

研削位置まで降下した状態の加工手段6に隣接する位置には、例えば、研削中において被加工物Wの厚みを接触式にて測定する厚み測定手段38が配設されている。 At a position adjacent to the processing means 6 in the state of being lowered to the grinding position, for example, a thickness measuring means 38 for measuring the thickness of the workpiece W by a contact method during grinding is provided.

例えば、搬入手段18に上面Wbが保持された研削前の被加工物Wの下面Wa(本実施形態においては下面Waに貼着されている保護テープT)または搬出手段16に上面Wbが保持された研削後の被加工物Wの下面Wa(本実施形態においては下面Waに貼着されている保護テープT)を洗浄する本発明に係る洗浄ユニット4は、図1に示すように、例えば装置ベース10上の搬出手段16とスピンナー洗浄機構156との間に配設されている。なお、洗浄ユニット4の配設箇所は図1に示す例に限定されるのもではなく、例えば、仮置き領域152と搬入手段18との間であってもよく、搬入手段18の吸引パッド181又は搬出手段16の吸引パッド161の可動範囲内の下方に位置していればよい。
図2、3に示す洗浄ユニット4は、例えば、被加工物Wに接触するスポンジ41と、スポンジ41の被加工物Wに接触する部分以外の部分でスポンジ41を支持するとともにスポンジ41をエジェクター又は真空発生装置等の吸引源439に連通する吸引孔420cを備える支持手段42と、スポンジ41に含まれる水を吸引孔420cから吸引し排水する排水手段43と、吸引孔420cを水供給源449に連通させスポンジ41の被加工物Wに接触する部分から水を溢れ出させる水供給手段44と、搬出手段16(図1参照)に保持された被加工物Wの下面Waに平行に搬出手段16と支持手段42とを相対的に移動させる先に説明した搬出移動手段164と、搬入手段18(図1参照)に保持された被加工物Wの下面Waに平行に搬入手段18と支持手段42とを相対的に移動させる先に説明した搬入移動手段184と、搬出手段16の吸引パッド161をZ軸方向に昇降させる搬出昇降手段165と、搬入手段18の吸引パッド181をZ軸方向に昇降させる搬入昇降手段185と、を備えている。
For example, the lower surface Wa of the workpiece W before grinding whose upper surface Wb is held by the carry-in means 18 (the protective tape T adhered to the lower surface Wa in this embodiment) or the upper surface Wb is held by the carry-out means 16. The cleaning unit 4 according to the present invention for cleaning the lower surface Wa of the workpiece W after grinding (in this embodiment, the protective tape T adhered to the lower surface Wa) is, for example, an apparatus as shown in FIG. It is arranged between the carry-out means 16 on the base 10 and the spinner cleaning mechanism 156. The disposing location of the cleaning unit 4 is not limited to the example shown in FIG. 1, and may be, for example, between the temporary placement area 152 and the carry-in means 18, and the suction pad 181 of the carry-in means 18 may be provided. Alternatively, it may be located below the movable range of the suction pad 161 of the carry-out means 16.
The cleaning unit 4 shown in FIGS. 2 and 3 supports, for example, a sponge 41 that comes into contact with the workpiece W and a portion of the sponge 41 other than the portion that comes into contact with the workpiece W, and the sponge 41 is ejected or ejected. A supporting means 42 having a suction hole 420c communicating with a suction source 439 such as a vacuum generator, a draining means 43 for sucking and draining water contained in the sponge 41 from the suction hole 420c, and a suction hole 420c for a water supply source 449. A water supply means 44 for communicating and allowing water to overflow from a portion of the sponge 41 in contact with the workpiece W, and a discharge means 16 parallel to the lower surface Wa of the workpiece W held by the discharge means 16 (see FIG. 1). And the supporting means 42 are moved relative to each other, and the carrying-in means 18 and the supporting means 42 are parallel to the lower surface Wa of the workpiece W held by the carrying-in moving means 164 (see FIG. 1). And the carrying-out moving means 184 that moves the suction pad 161 of the carrying-out means 16 in the Z-axis direction, and the suction pad 181 of the carrying-in means 18 in the Z-axis direction. And a loading and unloading means 185 for loading.

スポンジ41は、例えば、所定の厚みを備えるスポンジを円筒形状に形成したロールスポンジ(以下、ロールスポンジ41とする)であり、被加工物Wの直径以上の長さを備えている。ロールスポンジ41は、例えば、気泡が互いに連通している構造を有する連泡スポンジであり、ポリウレタンを発泡成形して作られるスポンジ、PVAスポンジ、又はゴムに発泡剤等を練り込み成形されるスポンジ等を用いる。ロールスポンジ41の外周面410が、図1に示す被加工物Wの下面Waの保護テープTに接触し洗浄する洗浄面となる。 The sponge 41 is, for example, a roll sponge in which a sponge having a predetermined thickness is formed into a cylindrical shape (hereinafter referred to as the roll sponge 41), and has a length equal to or larger than the diameter of the workpiece W. The roll sponge 41 is, for example, an open-cell sponge having a structure in which air bubbles communicate with each other, and is a sponge formed by foaming polyurethane, a PVA sponge, or a sponge formed by kneading a foaming agent into rubber. To use. The outer peripheral surface 410 of the roll sponge 41 serves as a cleaning surface for contacting and cleaning the protective tape T on the lower surface Wa of the workpiece W shown in FIG.

図2、3に示す支持手段42は、例えば、ロールスポンジ41の筒内411に挿入され外側面420aに吸引孔420cが配設されたシャフト420と、シャフト420を回転自在に支持する支持部421と、を備える。支持部421は、例えば、側面視略コの字状の外形を備えており、図1に示す装置ベース10上にその底面が固定されている。
円柱状のシャフト420は内部にY軸方向に延びる流路420dが形成されており、該流路420dは各吸引孔420cと連通している。支持部421の凹み部分に収容されたシャフト420は、図示しないベアリングを介して支持部421により支持されている。
流路420dの一端は、支持部421の側面に取り付けられた継手422を介して、排水手段43を構成し金属配管や可撓性を有する樹脂チューブ等からなる吸引流路438に連通している。
The support means 42 shown in FIGS. 2 and 3 is, for example, a shaft 420 that is inserted into the cylinder 411 of the roll sponge 41 and has a suction hole 420c on the outer surface 420a, and a support portion 421 that rotatably supports the shaft 420. And The support portion 421 has, for example, a substantially U-shaped outer shape in a side view, and its bottom surface is fixed on the device base 10 shown in FIG. 1.
A channel 420d extending in the Y-axis direction is formed inside the cylindrical shaft 420, and the channel 420d communicates with each suction hole 420c. The shaft 420 housed in the recessed portion of the support portion 421 is supported by the support portion 421 via a bearing (not shown).
One end of the flow path 420d is in communication with a suction flow path 438 that constitutes the drainage means 43 and is made of a metal pipe, a flexible resin tube, or the like via a joint 422 attached to the side surface of the support portion 421. ..

吸引流路438上には、例えば、ソレノイドバルブ437が配設されており、ソレノイドバルブ437は、電磁石に電流を流して磁力を発生させ、この磁力を利用しバルブ内のスプールを引き付け移動させることで、吸引流路438を排水手段43の吸引源439又は水供給手段44のポンプ等からなる水供給源449のいずれかと連通するように切り換えることができる。 A solenoid valve 437, for example, is disposed on the suction flow path 438. The solenoid valve 437 causes an electric current to flow through an electromagnet to generate a magnetic force, and the magnetic force is used to attract and move the spool in the valve. Thus, the suction flow path 438 can be switched to communicate with either the suction source 439 of the drainage means 43 or the water supply source 449 including a pump of the water supply means 44.

以下に、上記図1に示す加工装置1を用いて被加工物Wの上面Wbを研削した後に、下面Waを洗浄して乾燥させる場合の洗浄ユニット4の動作について説明する。
被加工物Wの上面Wbを研削するには、まず、ロボット155が第1のカセット150aから一枚の被加工物Wを引き出し、被加工物Wを仮置き領域152に移動させる。次いで、位置合わせ手段153により被加工物Wがセンタリングされた後、搬入移動手段184によって搬入手段18の吸引パッド181が、センタリングされた被加工物Wを吸引保持してからチャックテーブル30上に移動させる。なお、吸引パッド181が被加工物Wをチャックテーブル30上に移動させる前に、保持した被加工物W(本実施形態においては、下面Waに貼着された保護テープT)を洗浄ユニット4によって洗浄するとよい。被加工物Wに貼着された保護テープTを洗浄するときは、図2に示す水供給手段44によりロールスポンジ41の被加工物Wの保護テープTに接触する部分である外周面410から水を溢れ出させ、ロールスポンジ41を被加工物Wの保護テープTに接触させ、搬入移動手段184で搬入手段18の吸引パッド181と支持手段42とを相対的に被加工物Wの下面Waに平行移動させて行う。具体的には、後述する搬出移動手段164で研削後の被加工物Wの上面Wbを保持した搬出手段16の吸引パッド161と支持手段42とを相対的に被加工物Wの下面Waに平行移動させる場合と略同様に行っていくため、ここでは省略する。
The operation of the cleaning unit 4 when the upper surface Wb of the workpiece W is ground and then the lower surface Wa is cleaned and dried using the processing apparatus 1 shown in FIG. 1 will be described below.
To grind the upper surface Wb of the work W, first, the robot 155 pulls out one work W from the first cassette 150a and moves the work W to the temporary placement area 152. Next, after the workpiece W is centered by the alignment means 153, the suction pad 181 of the carry-in moving means 184 suction-holds the centered workpiece W and then moves it onto the chuck table 30. Let Before the suction pad 181 moves the workpiece W onto the chuck table 30, the held workpiece W (in the present embodiment, the protective tape T attached to the lower surface Wa) is cleaned by the cleaning unit 4. It is good to wash. When cleaning the protective tape T attached to the workpiece W, the water is supplied from the outer peripheral surface 410 of the roll sponge 41 which is in contact with the protective tape T of the workpiece W by the water supply means 44 shown in FIG. And the roll sponge 41 is brought into contact with the protection tape T of the workpiece W, and the suction pad 181 of the loading means 18 and the supporting means 42 are relatively moved to the lower surface Wa of the workpiece W by the loading/moving means 184. Move in parallel. Specifically, the suction pad 161 of the carry-out means 16 holding the upper surface Wb of the workpiece W after grinding by the carry-out moving means 164, which will be described later, and the support means 42 are relatively parallel to the lower surface Wa of the work piece W. Since the procedure is substantially the same as the case of moving, it is omitted here.

その後、搬入手段18によって、チャックテーブル30の中心と被加工物Wの中心とが略合致するように、被加工物Wが上面Wbを上に向けた状態で保持面300上に載置され、保持面300によって吸引保持される。次いで、被加工物Wを保持したチャックテーブル30が、加工手段6の下まで+Y方向へ移動する。加工手段6のモータ62が回転軸60を回転駆動し、これに伴って加工具64も回転する。加工手段6が加工送り手段7により−Z方向へと送られ、回転する研削砥石641が被加工物Wの上面Wbに当接することで研削が行われる。研削中は、チャックテーブル30が回転するのに伴って、保持面300上に保持された被加工物Wも回転するので、研削砥石641が被加工物Wの上面Wbの全面の研削加工を行う。また、研削水が研削砥石641と被加工物Wとの接触部位に対して供給され、接触部位が冷却・洗浄される。 After that, the work-in means 18 places the workpiece W on the holding surface 300 with the upper surface Wb facing upward so that the center of the chuck table 30 and the center of the workpiece W substantially coincide with each other. It is sucked and held by the holding surface 300. Next, the chuck table 30 holding the workpiece W moves in the +Y direction to below the processing means 6. The motor 62 of the processing means 6 rotationally drives the rotary shaft 60, and the processing tool 64 also rotates accordingly. The processing means 6 is fed in the -Z direction by the processing feed means 7, and the rotating grinding wheel 641 comes into contact with the upper surface Wb of the workpiece W to perform grinding. During grinding, as the chuck table 30 rotates, the workpiece W held on the holding surface 300 also rotates, so the grinding wheel 641 grinds the entire upper surface Wb of the workpiece W. .. Further, the grinding water is supplied to the contact portion between the grinding wheel 641 and the workpiece W, and the contact portion is cooled and washed.

被加工物Wを所望の厚さになるまで研削した後、加工送り手段7により加工手段6を+Z方向へと移動させて被加工物Wから離間させ、さらにチャックテーブル30を−Y方向に移動させて搬出手段16の近傍に位置付ける。 After grinding the workpiece W to a desired thickness, the machining feeding means 7 moves the machining means 6 in the +Z direction to separate it from the workpiece W, and further moves the chuck table 30 in the −Y direction. Then, it is positioned near the carry-out means 16.

搬出移動手段164が、吸引パッド161を水平方向に旋回移動させて、チャックテーブル30上の被加工物Wの上面Wbと吸引パッド161の図4に示す吸着面161cとが対向し、かつ、被加工物Wの上面Wbの中心と吸引パッド161の中心とが略合致するように、吸引パッド161を被加工物Wの上方に位置付ける。 The carry-out moving means 164 pivotally moves the suction pad 161 in the horizontal direction so that the upper surface Wb of the workpiece W on the chuck table 30 and the suction surface 161c of the suction pad 161 shown in FIG. The suction pad 161 is positioned above the workpiece W so that the center of the upper surface Wb of the workpiece W and the center of the suction pad 161 substantially coincide with each other.

次いで、搬出昇降手段165が吸引パッド161を降下させて、吸着面161cを被加工物Wの上面Wbに接触させる。この状態で、図4に示す吸引源169が吸引力を生み出し、吸引パッド161が吸着面161cで被加工物Wを吸引保持する。
次いで、チャックテーブル30による被加工物Wの吸引保持が解除され、搬出昇降手段165によって被加工物Wの上面Wbを保持した吸引パッド161が上昇して、チャックテーブル30から被加工物Wが搬出手段16によって搬出される。
Next, the carry-out lifting/lowering means 165 lowers the suction pad 161 to bring the suction surface 161c into contact with the upper surface Wb of the workpiece W. In this state, the suction source 169 shown in FIG. 4 generates a suction force, and the suction pad 161 sucks and holds the workpiece W by the suction surface 161c.
Next, the suction holding of the workpiece W by the chuck table 30 is released, the suction pad 161 holding the upper surface Wb of the workpiece W is lifted by the unloading elevating means 165, and the workpiece W is unloaded from the chuck table 30. It is carried out by the means 16.

搬出移動手段164が、被加工物Wを保持した吸引パッド161を水平方向に旋回移動させて、図4に示すように洗浄ユニット4のロールスポンジ41の上方に被加工物Wを位置付ける。
被加工物Wの下面Waを保護する保護テープTには、研削により生じた図示しない加工屑が付着している。したがって、洗浄ユニット4によって被加工物Wの下面Waを保護する保護テープTの洗浄が行われる。
The carry-out moving means 164 horizontally moves the suction pad 161 holding the work W to position the work W above the roll sponge 41 of the cleaning unit 4 as shown in FIG.
On the protective tape T that protects the lower surface Wa of the workpiece W, processing waste (not shown) generated by grinding adheres. Therefore, the cleaning unit 4 cleans the protective tape T that protects the lower surface Wa of the workpiece W.

搬出昇降手段165が、ロールスポンジ41の上側の外周面410が被加工物Wの下面Waに貼着された保護テープTに接する所定の高さまで、吸引パッド161を降下させる。
次いで、ソレノイドバルブ437が吸引流路438を水供給手段44の水供給源449に連通させる。水供給源449から洗浄水が供給され、洗浄水が吸引流路438からシャフト420の流路420dへ流入し、さらに複数の吸引孔420cから噴出して、ロールスポンジ41へと到達する。そして、ロールスポンジ41の内部から、保護テープTに接触する部分である外周面410に広範囲にわたって洗浄水が染み出していく。この状態で、搬出移動手段164が吸引パッド161を水平方向に旋回移動させることで、固定されている支持手段42によって支持されているロールスポンジ41の外周面410が洗浄水を溢れ出させつつ、相対的に移動する搬出手段16により保持される被加工物Wの下面Waに貼着された保護テープTを洗浄していく。その結果、保護テープTに付着していた加工屑が洗浄除去されていく。
The carry-out lifting/lowering means 165 lowers the suction pad 161 to a predetermined height at which the outer peripheral surface 410 on the upper side of the roll sponge 41 contacts the protective tape T attached to the lower surface Wa of the workpiece W.
Then, the solenoid valve 437 connects the suction flow path 438 to the water supply source 449 of the water supply means 44. The cleaning water is supplied from the water supply source 449, the cleaning water flows from the suction flow path 438 into the flow path 420d of the shaft 420, is further ejected from the plurality of suction holes 420c, and reaches the roll sponge 41. Then, from the inside of the roll sponge 41, the cleaning water oozes out over a wide area to the outer peripheral surface 410, which is the portion in contact with the protective tape T. In this state, the carry-out moving means 164 pivotally moves the suction pad 161 in the horizontal direction, whereby the outer peripheral surface 410 of the roll sponge 41 supported by the fixed supporting means 42 overflows the cleaning water, The protective tape T attached to the lower surface Wa of the workpiece W held by the relatively moving carrying-out means 16 is washed. As a result, the processing scraps attached to the protective tape T are washed away.

ロールスポンジ41の筒内411に挿入されたシャフト420は、支持部421によって回転自在に支持されているため、ロールスポンジ41は被加工物Wに貼着された保護テープTとの間の摩擦力によって回転し洗浄水を溢れ出させる外周面410も回転していく。 Since the shaft 420 inserted into the cylinder 411 of the roll sponge 41 is rotatably supported by the support portion 421, the roll sponge 41 has a friction force with the protective tape T attached to the workpiece W. The outer peripheral surface 410 that rotates by causing the cleaning water to overflow is also rotated.

図5に示すように、ロールスポンジ41によって被加工物Wの下面Waに貼着された保護テープTの洗浄を行っていき、ロールスポンジ41が保護テープTの一方の外周縁から中心を挟んで対称となる他方の外周縁を越えるまで吸引パッド161が旋回移動することで、ロールスポンジ41による被加工物Wの下面Waに貼着された保護テープTの洗浄が完了する。なお、吸引パッド161をロールスポンジ41上において所定の角度で往復移動させることで、更に保護テープTの洗浄を行ってもよい。 As shown in FIG. 5, the roll sponge 41 cleans the protective tape T attached to the lower surface Wa of the workpiece W, and the roll sponge 41 sandwiches the center from one outer peripheral edge of the protective tape T. The suction pad 161 is swung until it passes over the other symmetrical outer peripheral edge, whereby the cleaning of the protective tape T attached to the lower surface Wa of the workpiece W by the roll sponge 41 is completed. The protective tape T may be further washed by reciprocating the suction pad 161 on the roll sponge 41 at a predetermined angle.

被加工物Wの下面Waに貼着された保護テープTの洗浄が完了した後、保護テープTには洗浄水が付着しているので、例えば、図6に示すように洗浄ユニット4によって保護テープTの乾燥を行う。即ち、ソレノイドバルブ437が吸引流路438を吸引源439に連通させ、吸引源439が作動することで、吸引源439が生み出す吸引力が、吸引流路438、及びシャフト420の流路420dを通り各吸引孔420cに伝達される。この状態で、吸引パッド161で吸引保持された被加工物Wの下面Waに貼着された保護テープTが、搬出昇降手段165によってロールスポンジ41の上側の外周面410に当接される。さらに、搬出移動手段164が、被加工物Wを保持した吸引パッド161を水平方向に旋回移動させていくことで、被加工物Wに接触するロールスポンジ41の外周面410で保護テープTに付着していた水が吸収される。 After the cleaning of the protective tape T attached to the lower surface Wa of the workpiece W is completed, cleaning water adheres to the protective tape T. For example, as shown in FIG. Dry T. That is, the solenoid valve 437 causes the suction flow path 438 to communicate with the suction source 439, and the suction source 439 operates so that the suction force generated by the suction source 439 passes through the suction flow path 438 and the flow path 420d of the shaft 420. It is transmitted to each suction hole 420c. In this state, the protective tape T adhered to the lower surface Wa of the workpiece W suction-held by the suction pad 161 is brought into contact with the outer peripheral surface 410 on the upper side of the roll sponge 41 by the carry-out lifting/lowering means 165. Further, the carry-out moving means 164 horizontally moves the suction pad 161 holding the workpiece W in a horizontal direction, so that the outer peripheral surface 410 of the roll sponge 41 contacting the workpiece W adheres to the protective tape T. The water you were doing is absorbed.

吸収されロールスポンジ41に含まれた水は、吸引孔420cから流路420d及び吸引流路438を通り排水手段43の吸引源439によって吸引される。したがって、ロールスポンジ41から水が継続的に排水されて、ロールスポンジ41の被加工物Wの下面Waに貼着された保護テープTに接する部分である外周面410は水を吸い取れる状態に維持される。 The water absorbed and contained in the roll sponge 41 passes through the suction hole 420c, the flow path 420d and the suction flow path 438 and is sucked by the suction source 439 of the drainage means 43. Therefore, the water is continuously discharged from the roll sponge 41, and the outer peripheral surface 410, which is a portion in contact with the protective tape T attached to the lower surface Wa of the workpiece W of the roll sponge 41, is maintained in a state capable of absorbing water. To be done.

ロールスポンジ41の筒内411に挿入されたシャフト420は、支持部421によって回転自在に支持されているため、ロールスポンジ41は被加工物Wに貼着された保護テープTとの間の摩擦力によって回転して、水を吸い取る外周面410も回転していく。 Since the shaft 420 inserted in the cylinder 411 of the roll sponge 41 is rotatably supported by the support portion 421, the roll sponge 41 has a friction force between the roll sponge 41 and the protective tape T attached to the workpiece W. The outer peripheral surface 410 that absorbs water also rotates.

図7に示すように、ロールスポンジ41によって被加工物Wの下面Waに貼着された保護テープTの乾燥を行っていき、ロールスポンジ41が保護テープTの一方の外周縁から中心を挟んで対称となる他方の外周縁を越えるまで吸引パッド161が旋回移動することで、ロールスポンジ41による被加工物Wの下面Waに貼着された保護テープTの乾燥が完了する。なお、吸引パッド161をロールスポンジ41上において所定の角度で往復移動させることで、更に保護テープTの乾燥を行ってもよい。 As shown in FIG. 7, the roll sponge 41 dries the protective tape T attached to the lower surface Wa of the workpiece W, and the roll sponge 41 sandwiches the center from one outer peripheral edge of the protective tape T. The suction pad 161 is swung until it passes over the other symmetrical outer peripheral edge, whereby the drying of the protective tape T attached to the lower surface Wa of the workpiece W by the roll sponge 41 is completed. The protective tape T may be further dried by reciprocating the suction pad 161 on the roll sponge 41 at a predetermined angle.

保護テープTの乾燥が終了した被加工物Wは、搬出手段16によって図1に示すスピンナー洗浄機構156に搬送される。スピンナー洗浄機構156で被加工物Wの上面Wbの洗浄が行われる。上面Wbの洗浄が行われた被加工物Wは、ロボット155により第2のカセット151a内に収容される。 The workpiece W on which the protective tape T has been dried is conveyed by the carry-out means 16 to the spinner cleaning mechanism 156 shown in FIG. The spinner cleaning mechanism 156 cleans the upper surface Wb of the workpiece W. The workpiece W whose upper surface Wb has been cleaned is housed in the second cassette 151a by the robot 155.

例えば、被加工物Wの下面Waに貼着された保護テープTの乾燥が完了した後、図8に示すようにロールスポンジ41の外周面410の洗浄を行う。
図8に示すように、ソレノイドバルブ437が吸引流路438を水供給手段44の水供給源449に連通させる。水供給源449から供給された洗浄水は、吸引流路438からシャフト420の流路420dを通り複数の吸引孔420cから噴出して、ロールスポンジ41の外周面410から溢れ出て、外周面410に付着していた加工屑が洗い落とされる。なお、被加工物Wの下面Waに貼着された保護テープTの洗浄が完了した後に、ロールスポンジ41の外周面410の洗浄を行ってもよい。また、水供給源449に加えてコンプレッサー等からなるエア供給源を吸引流路438に連通させるものとしてもよい。そして、水とエアと混合流体をロールスポンジ41に供給し、ロールスポンジ41の外周面410を洗浄してもよい。また、水とエアとを交互にロールスポンジ41に供給し、ロールスポンジ41の外周面410を洗浄してもよい。または、エア供給源からエアのみをロールスポンジ41に供給して、ロールスポンジ41の外周面410に付着している加工屑をエアで吹き飛ばして洗浄するものとしてもよい。
For example, after the protective tape T attached to the lower surface Wa of the workpiece W is completely dried, the outer peripheral surface 410 of the roll sponge 41 is washed as shown in FIG.
As shown in FIG. 8, the solenoid valve 437 communicates the suction flow path 438 with the water supply source 449 of the water supply means 44. The cleaning water supplied from the water supply source 449 flows from the suction flow path 438 through the flow path 420d of the shaft 420 and is ejected from the plurality of suction holes 420c, overflows from the outer peripheral surface 410 of the roll sponge 41, and the outer peripheral surface 410. The processing waste adhering to the is washed off. The outer peripheral surface 410 of the roll sponge 41 may be cleaned after the cleaning of the protective tape T attached to the lower surface Wa of the workpiece W is completed. Further, in addition to the water supply source 449, an air supply source such as a compressor may be connected to the suction passage 438. Then, water, air and a mixed fluid may be supplied to the roll sponge 41 to clean the outer peripheral surface 410 of the roll sponge 41. Alternatively, water and air may be alternately supplied to the roll sponge 41 to clean the outer peripheral surface 410 of the roll sponge 41. Alternatively, only the air may be supplied from the air supply source to the roll sponge 41, and the processing waste adhering to the outer peripheral surface 410 of the roll sponge 41 may be blown away with the air for cleaning.

以上のように、チャックテーブル30と、加工手段6と、搬入手段18と、搬出手段16と、を備える加工装置1に配設され、搬入手段18または搬出手段16に保持された被加工物Wの下面Wa(本実施形態においては、下面Waに貼着された保護テープT)を洗浄する本発明に係る洗浄ユニット4は、被加工物Wに接触するスポンジ41(ロールスポンジ41)と、スポンジ41の被加工物Wに接触する部分である外周面410以外の部分でスポンジ41を支持するとともにスポンジ41を吸引源439に連通する吸引孔420cを備える支持手段42と、スポンジ41に含まれる水を吸引孔420cから吸引し排水する排水手段43と、吸引孔420cを水供給源449に連通させスポンジ41の被加工物Wに接触する部分から水を溢れ出させる水供給手段44と、搬出手段16に保持された被加工物Wの下面Waに平行に搬出手段16と支持手段42とを相対的に移動させる搬出移動手段164と、搬入手段18に保持された被加工物Wの下面Waに平行に搬入手段18と支持手段42とを相対的に移動させる搬入移動手段184と、を備えているため、被加工物W(本実施形態においては下面Waに貼着された保護テープT)を洗浄するときは、水供給手段44によりスポンジ41の被加工物Wに接触する部分である外周面410から洗浄水を溢れ出させ、スポンジ41を被加工物Wに接触させ、搬出移動手段164で搬出手段16と支持手段42とを相対的に移動させて、または搬入移動手段184で搬入手段18と支持手段42とを相対的に移動させて、洗浄を行うことができる。
また、被加工物Wを乾燥させるときは、スポンジ41を被加工物Wに接触させ、排水手段43によりスポンジ41に含まれた水を排水しながら、搬出移動手段164で搬出手段16と支持手段42とを相対的に移動させることで、スポンジ41を水で飽和させることなく被加工物Wを継続的に十分に乾燥させることができる。被加工物Wの乾燥時に、スポンジ41を乾燥させつつ被加工物Wに接触させることで、洗浄時に洗浄しきれず被加工物Wに付着している細かな加工屑を拭き取ることも可能となる。
さらに、水供給手段44から水をスポンジ41に供給して、スポンジ41の被加工物Wに接触する外周面410から水を溢れ出させることで、被加工物Wの洗浄時又は乾燥時に拭き取られスポンジ41の外周面410に付着した細かな加工屑を除去することができ、次の被加工物Wに対して綺麗なスポンジ41で洗浄又は乾燥を行うことが可能となる。
そして、本発明に係る洗浄ユニット4は、スポンジ41で被加工物Wの洗浄と乾燥とが可能となるので、加工装置1内における洗浄ユニット4の設置スペースの省スペース化をなし得る。
As described above, the workpiece W that is disposed in the processing apparatus 1 including the chuck table 30, the processing unit 6, the loading unit 18, and the unloading unit 16 and is held by the loading unit 18 or the unloading unit 16. The cleaning unit 4 according to the present invention for cleaning the lower surface Wa (the protective tape T attached to the lower surface Wa in this embodiment) of the sponge 41 (roll sponge 41) that contacts the workpiece W, and the sponge. The support means 42 that supports the sponge 41 at a portion other than the outer peripheral surface 410 that is a portion that contacts the work W of the workpiece 41, and that includes the suction means 420c that communicates the sponge 41 with the suction source 439, and the water contained in the sponge 41. Drainage means 43 for sucking and draining water from the suction hole 420c, water supply means 44 for communicating the suction hole 420c with a water supply source 449 and causing water to overflow from a portion of the sponge 41 in contact with the workpiece W, and a carry-out means. The carrying-out moving means 164 for relatively moving the carrying-out means 16 and the supporting means 42 in parallel to the lower surface Wa of the workpiece W held by 16 and the lower surface Wa of the workpiece W held by the carrying-in means 18. Since the carrying-in moving means 184 for moving the carrying-in means 18 and the supporting means 42 relative to each other are provided in parallel, the workpiece W (the protective tape T adhered to the lower surface Wa in the present embodiment) is provided. When cleaning, the water supply means 44 causes the cleaning water to overflow from the outer peripheral surface 410 of the sponge 41 which is in contact with the workpiece W, the sponge 41 is brought into contact with the workpiece W, and the carry-out moving means 164. Cleaning can be performed by relatively moving the carry-out means 16 and the supporting means 42, or by relatively moving the carry-in moving means 184 between the carry-in means 18 and the supporting means 42.
Further, when the workpiece W is dried, the sponge 41 is brought into contact with the workpiece W, and the water contained in the sponge 41 is drained by the drainage means 43, while the carry-out moving means 164 carries out the carry-out means 16 and the supporting means. By relatively moving 42 and 42, the workpiece W can be continuously and sufficiently dried without saturating the sponge 41 with water. When the workpiece W is dried, the sponge 41 is dried and brought into contact with the workpiece W, so that it is possible to wipe off fine machining debris adhering to the workpiece W that cannot be washed during cleaning.
Further, by supplying water from the water supply means 44 to the sponge 41 and causing the water to overflow from the outer peripheral surface 410 of the sponge 41 which comes into contact with the workpiece W, the workpiece W can be wiped off during cleaning or drying. It is possible to remove the fine processing dust attached to the outer peripheral surface 410 of the sponge 41, and it is possible to clean or dry the next workpiece W with the clean sponge 41.
Since the cleaning unit 4 according to the present invention can clean and dry the workpiece W with the sponge 41, the installation space of the cleaning unit 4 in the processing apparatus 1 can be saved.

スポンジ41は、ロールスポンジ41であって、支持手段42は、ロールスポンジ41の筒内411に挿入され外側面420aに吸引孔420cが配設されたシャフト420と、シャフト420を回転自在に支持する支持部421と、を備えることで、被加工物Wの洗浄中又は乾燥中において、ロールスポンジ41の被加工物Wの下面Waの保護テープTに接触する外周面410が回転できるため、外周面410の全面で満遍なく洗浄又は乾燥を行えるようになる。 The sponge 41 is the roll sponge 41, and the supporting means 42 rotatably supports the shaft 420, which is inserted into the cylinder 411 of the roll sponge 41 and has the suction hole 420c on the outer surface 420a. By including the support portion 421, the outer peripheral surface 410 of the lower surface Wa of the workpiece W of the roll sponge 41 that is in contact with the protective tape T can be rotated while the workpiece W is being washed or dried. The entire surface of 410 can be uniformly washed or dried.

図1に示す加工装置1には、図2、3に示す支持手段42及びロールスポンジ41を備える洗浄ユニット4に代えて、図9、10に示す支持手段48及び矩形スポンジ47を備え洗浄ユニット4Aが配設されていてもよい。
図9、10に示す矩形スポンジ47は、例えば、被加工物Wの直径以上の長さで延在する直方体状の外形を備えている。矩形スポンジ47の材質等については、図1に示すロールスポンジ41と同様となっている。そして、矩形スポンジ47はその上面470が、図1に示す被加工物Wの下面Waに貼着された保護テープTに接触する部分となる。
In the processing apparatus 1 shown in FIG. 1, instead of the cleaning unit 4 including the supporting means 42 and the roll sponge 41 illustrated in FIGS. 2 and 3, a cleaning unit 4A including a supporting means 48 and a rectangular sponge 47 illustrated in FIGS. May be provided.
The rectangular sponge 47 shown in FIGS. 9 and 10 has, for example, a rectangular parallelepiped outer shape that extends over the diameter of the workpiece W or more. The material and the like of the rectangular sponge 47 are the same as those of the roll sponge 41 shown in FIG. The upper surface 470 of the rectangular sponge 47 becomes a portion in contact with the protective tape T attached to the lower surface Wa of the workpiece W shown in FIG.

図9、10に示す支持手段48は、矩形スポンジ47の被加工物Wに接する部分である上面470を露出させ、矩形スポンジ47の被加工物Wに接する上面470以外を収容する凹部480を有し、凹部480の例えば5つ内面、即ち、4つの内側面と1つの内側下面とに吸引孔481が形成された基台482を備える。なお、吸引孔481は、5つの内面全てに形成されている必要は無い。 The supporting means 48 shown in FIGS. 9 and 10 has a concave portion 480 which exposes an upper surface 470 of the rectangular sponge 47 which is in contact with the workpiece W and accommodates a portion other than the upper surface 470 of the rectangular sponge 47 which is in contact with the workpiece W. The recess 480 is provided with a base 482 having suction holes 481 formed in, for example, five inner surfaces, that is, four inner surfaces and one inner lower surface. The suction holes 481 do not have to be formed on all five inner surfaces.

例えば、基台482の凹部480は、矩形スポンジ47が嵌合する大きさに設定されている。例えば、凹部480の内側面には、スプリング等からなる図示しないストッパーが設けられており、矩形スポンジ47が凹部480に挿入された際に該ストッパーによって矩形スポンジ47が凹部480から抜けてしまうことが無いようになっていてもよい。 For example, the concave portion 480 of the base 482 is set to a size with which the rectangular sponge 47 fits. For example, a stopper (not shown) made of a spring or the like is provided on the inner surface of the recess 480, and when the rectangular sponge 47 is inserted into the recess 480, the stopper may cause the rectangular sponge 47 to come out of the recess 480. It may not exist.

基台482の内部には、吸引孔481に連通する図示しない複数の流路が形成されており、該流路は1つに合流した後、基台482の外側面に取り付けられた継手483を介して吸引流路438に連通している。基台482は、その底面が図1に示す装置ベース10上に固定されている。 Inside the base 482, a plurality of flow paths (not shown) communicating with the suction holes 481 are formed. After the flow paths merge into one, a joint 483 attached to the outer surface of the base 482 is installed. It communicates with the suction flow path 438 via. The base 482 has its bottom surface fixed on the device base 10 shown in FIG.

洗浄ユニット4Aは、上記支持手段48及び矩形スポンジ47を備えることで、例えば矩形スポンジ47を新しいものと交換する際に、支持手段48を各種部品に分解することなく矩形スポンジ47を抜き差しして交換することができるため、作業者が容易に交換を行うことができる。 The cleaning unit 4A is provided with the supporting means 48 and the rectangular sponge 47, so that when the rectangular sponge 47 is replaced with a new one, for example, the rectangular sponge 47 is removed and replaced without disassembling the supporting means 48 into various parts. Therefore, the operator can easily perform the replacement.

以下に、上記図1に示す加工装置1を用いて被加工物Wの上面Wbを研削した後に、下面Wa(本実施形態においては、下面Waに貼着された保護テープT)を洗浄して乾燥させる場合の矩形スポンジ47及び支持手段48を備える洗浄ユニット4Aの動作について説明する。
被加工物Wが図1に示す第1のカセット150aから搬出されて、加工手段6によって上面Wbが研削され、搬出手段16によってチャックテーブル30から搬出されるまでは、先に説明した場合と同様である。なお、研削前の被加工物Wの下面Waに貼着された保護テープTを洗浄するときは、図9に示す水供給手段44により矩形スポンジ47の被加工物Wの保護テープTに接触する部分である上面470から水を溢れ出させ、矩形スポンジ47を被加工物Wの保護テープTに接触させ、搬入移動手段184で搬入手段18の被加工物Wを吸引保持した吸引パッド181と支持手段42とを相対的に被加工物Wの下面Waに平行移動させて行う。
Below, after grinding the upper surface Wb of the workpiece W using the processing apparatus 1 shown in FIG. 1, the lower surface Wa (in this embodiment, the protective tape T attached to the lower surface Wa) is washed. The operation of the cleaning unit 4A including the rectangular sponge 47 and the supporting means 48 in the case of drying will be described.
Similar to the case described above until the workpiece W is unloaded from the first cassette 150a shown in FIG. 1, the upper surface Wb is ground by the processing means 6, and is unloaded from the chuck table 30 by the unloading means 16. Is. When the protective tape T attached to the lower surface Wa of the workpiece W before grinding is washed, the protective tape T of the workpiece W of the rectangular sponge 47 is brought into contact with the protective tape T of the rectangular sponge 47 shown in FIG. Water is made to overflow from the upper surface 470 which is a portion, the rectangular sponge 47 is brought into contact with the protective tape T of the workpiece W, and the carrying-in moving means 184 supports the workpiece W of the carrying-in means 18 by suction and holding it. The means 42 is relatively moved in parallel with the lower surface Wa of the workpiece W.

搬出移動手段164が、研削後の被加工物Wを保持した搬出手段16の吸引パッド161を水平方向に旋回移動させて、図11に示すように洗浄ユニット4Aの矩形スポンジ47の上方に被加工物Wを位置付ける。
被加工物Wの下面Waを保護する保護テープTには、研削により生じた図示しない加工屑が付着している。
The carry-out moving means 164 pivotally moves the suction pad 161 of the carry-out means 16 holding the workpiece W after grinding in the horizontal direction, and the workpiece is processed above the rectangular sponge 47 of the cleaning unit 4A as shown in FIG. Position the object W.
On the protective tape T that protects the lower surface Wa of the workpiece W, processing waste (not shown) generated by grinding adheres.

搬出昇降手段165が、矩形スポンジ47の上面470が被加工物Wの下面Waに貼着された保護テープTに接する所定の高さまで、吸引パッド161を降下させる。
次いで、ソレノイドバルブ437が吸引流路438を水供給手段44の水供給源449に連通させる。水供給源449から供給された洗浄水は、吸引流路438から基台482内の図示しない流路へ流入し、さらに複数の吸引孔481から噴出して、矩形スポンジ47へと到達する。そして、矩形スポンジ47の内部から保護テープTに接触する部分である上面470に洗浄水が溢れ出ていく。この状態で、搬出移動手段164が吸引パッド161を水平方向に旋回移動させることで、固定されている支持手段48により支持されている矩形スポンジ47の上面470が洗浄水を溢れ出させつつ、相対的に移動する搬出手段16で保持される被加工物Wの下面Waに貼着された保護テープTを洗浄していく。その結果、保護テープTに付着していた加工屑が洗浄除去されていく。
The carry-out lifting/lowering means 165 lowers the suction pad 161 to a predetermined height at which the upper surface 470 of the rectangular sponge 47 contacts the protective tape T attached to the lower surface Wa of the workpiece W.
Then, the solenoid valve 437 connects the suction flow path 438 to the water supply source 449 of the water supply means 44. The cleaning water supplied from the water supply source 449 flows from the suction flow path 438 into a flow path (not shown) in the base 482, is further ejected from the plurality of suction holes 481, and reaches the rectangular sponge 47. Then, the washing water overflows from the inside of the rectangular sponge 47 to the upper surface 470, which is the portion in contact with the protective tape T. In this state, the carry-out moving means 164 pivotally moves the suction pad 161 in the horizontal direction, so that the upper surface 470 of the rectangular sponge 47 supported by the fixed supporting means 48 overflows the wash water and is relatively moved. The protective tape T affixed to the lower surface Wa of the workpiece W held by the unloading means 16 that is moved as desired is washed. As a result, the processing scraps attached to the protective tape T are washed away.

そして、矩形スポンジ47によって被加工物Wに貼着された保護テープTの洗浄を行っていき、矩形スポンジ47が保護テープTの一方の外周縁から中心を挟んで対称となる他方の外周縁を越えるまで吸引パッド161が旋回移動することで、保護テープTの洗浄が完了する。なお、吸引パッド161を矩形スポンジ47上において所定の角度で往復移動させることで、更に保護テープTの洗浄を行ってもよい。 Then, the protective tape T attached to the workpiece W is cleaned by the rectangular sponge 47, and the rectangular sponge 47 is symmetric with respect to the other outer peripheral edge of the protective tape T from one outer peripheral edge of the protective tape T. The suction pad 161 pivotally moves until it is exceeded, and thus the cleaning of the protective tape T is completed. The protective tape T may be further washed by reciprocating the suction pad 161 on the rectangular sponge 47 at a predetermined angle.

被加工物Wの下面Waに貼着された保護テープTの洗浄が完了した後、保護テープTには洗浄水が付着しているので、例えば、図12に示すように、洗浄ユニット4Aによって保護テープTの乾燥を行う。即ち、ソレノイドバルブ437が吸引流路438を吸引源439に連通させ、作動した吸引源439が生み出す吸引力が、吸引流路438を通り基台482の吸引孔481に伝達される。この状態で、吸引パッド161で吸引保持された被加工物Wの下面Waに貼着された保護テープTが、搬出昇降手段165によって矩形スポンジ47の上面470に当接される。さらに、搬出移動手段164が、被加工物Wを保持した吸引パッド161を水平方向に旋回移動させていくことで、被加工物Wに接触する矩形スポンジ47の上面470で保護テープTに付着していた水が吸収される。 After the cleaning of the protective tape T attached to the lower surface Wa of the workpiece W is completed, cleaning water adheres to the protective tape T. Therefore, for example, as shown in FIG. 12, it is protected by the cleaning unit 4A. The tape T is dried. That is, the solenoid valve 437 communicates the suction passage 438 with the suction source 439, and the suction force generated by the operated suction source 439 is transmitted to the suction hole 481 of the base 482 through the suction passage 438. In this state, the protective tape T attached to the lower surface Wa of the workpiece W suction-held by the suction pad 161 is brought into contact with the upper surface 470 of the rectangular sponge 47 by the carry-out lifting/lowering means 165. Further, the carry-out moving means 164 moves the suction pad 161 holding the workpiece W in the horizontal direction so that the suction pad 161 is attached to the protective tape T on the upper surface 470 of the rectangular sponge 47 which comes into contact with the workpiece W. The water that had been absorbed is absorbed.

吸収され矩形スポンジ47に含まれた水は、吸引孔481及び吸引流路438を通り排水手段43の吸引源439によって吸引される。よって、矩形スポンジ47から水が継続的に排水されて、矩形スポンジ47の被加工物Wの下面Waに貼着された保護テープTに接する部分である上面470は水を吸い取れる状態に維持される。 The water absorbed and contained in the rectangular sponge 47 passes through the suction hole 481 and the suction flow path 438 and is sucked by the suction source 439 of the drainage means 43. Therefore, water is continuously drained from the rectangular sponge 47, and the upper surface 470, which is a portion in contact with the protective tape T attached to the lower surface Wa of the workpiece W of the rectangular sponge 47, is maintained in a state capable of absorbing water. It

そして、矩形スポンジ47によって被加工物Wに貼着された保護テープTの乾燥を行っていき、矩形スポンジ47が保護テープTの一方の外周縁から中心を挟んで対称となる他方の外周縁を越えるまで吸引パッド161が旋回移動することで、矩形スポンジ47による保護テープTの乾燥が完了する。なお、吸引パッド161を矩形スポンジ47上において所定の角度で往復移動させることで、更に保護テープTの乾燥を行ってもよい。 Then, the protective tape T attached to the workpiece W is dried by the rectangular sponge 47, and the rectangular sponge 47 is moved from one outer peripheral edge of the protective tape T to the other outer peripheral edge which is symmetrical with the center interposed therebetween. The suction pad 161 pivotally moves until it exceeds, and the drying of the protective tape T by the rectangular sponge 47 is completed. The protective tape T may be further dried by reciprocating the suction pad 161 on the rectangular sponge 47 at a predetermined angle.

保護テープTの乾燥が終了した被加工物Wは、搬出手段16によって図1に示すスピンナー洗浄機構156に搬送され、上面Wbの洗浄が行われる。その後、被加工物Wは、ロボット155により第2のカセット151a内に収容される。 The workpiece W, for which the protective tape T has been dried, is conveyed to the spinner cleaning mechanism 156 shown in FIG. 1 by the carry-out means 16 and the upper surface Wb is cleaned. Then, the workpiece W is accommodated in the second cassette 151a by the robot 155.

例えば、図13に示すように、被加工物Wの下面Waに貼着された保護テープTの乾燥が完了した後、矩形スポンジ47の上面470の洗浄を行う。
図13に示すように、ソレノイドバルブ437が吸引流路438を水供給手段44の水供給源449に連通させる。水供給源449から供給された洗浄水は、吸引流路438を通り基台482の複数の吸引孔481から噴出して、矩形スポンジ47の上面470から溢れ出て、上面470に付着していた加工屑が洗い落とされる。また、水供給源449に加えてエア供給源を備えてもよい。水とエアの混合液を供給し矩形スポンジ47の上面470を洗浄してもよい。また、水とエアとを交互に供給し矩形スポンジ47の上面470を洗浄してもよい。または、エア供給源からエアのみを矩形スポンジ47に供給して、矩形スポンジ47の上面470に付着している加工屑をエアで吹き飛ばして洗浄するものとしてもよい。なお、被加工物Wの下面Waに貼着された保護テープTの洗浄が完了した後に、矩形スポンジ47の上面470の洗浄を行ってもよい。
For example, as shown in FIG. 13, after the drying of the protective tape T attached to the lower surface Wa of the workpiece W is completed, the upper surface 470 of the rectangular sponge 47 is washed.
As shown in FIG. 13, the solenoid valve 437 communicates the suction flow path 438 with the water supply source 449 of the water supply means 44. The cleaning water supplied from the water supply source 449 passed through the suction flow path 438, was ejected from the plurality of suction holes 481 of the base 482, overflowed from the upper surface 470 of the rectangular sponge 47, and adhered to the upper surface 470. The processing waste is washed off. Further, an air supply source may be provided in addition to the water supply source 449. The upper surface 470 of the rectangular sponge 47 may be washed by supplying a mixed liquid of water and air. Alternatively, the upper surface 470 of the rectangular sponge 47 may be washed by alternately supplying water and air. Alternatively, only the air may be supplied from the air supply source to the rectangular sponge 47, and the processing waste adhering to the upper surface 470 of the rectangular sponge 47 may be blown away with the air for cleaning. The upper surface 470 of the rectangular sponge 47 may be cleaned after the cleaning of the protective tape T attached to the lower surface Wa of the workpiece W is completed.

W:被加工物 Wa:被加工物の下面 Wb:被加工物の上面 T:保護テープ
1:加工装置 10:装置ベース 11:筐体 17:コラム 19:タッチパネル
150a:第1のカセット 151a:第2のカセット
155:ロボット 152:仮置き領域 153:位置合わせ手段 18:搬入手段 180:アーム部 181:吸引パッド 184:搬入移動手段 185:搬入昇降手段
156:スピンナー洗浄機構
16:搬出手段 160:アーム部 164:搬出移動手段 165:搬出昇降手段
161:吸引パッド 161a:吸着部 161c:吸着面 161b:枠体
169:吸引源
30:チャックテーブル 300:保持面 39:カバー 39a:蛇腹カバー
7:加工送り手段 70:ボールネジ 72:モータ 73:昇降板
6:加工手段 60:回転軸 62:モータ 64:加工具 641:研削砥石
38:厚み測定手段
4:洗浄ユニット 41:ロールスポンジ 410:ロールスポンジの外周面
42:支持手段 420:シャフト 420c:吸引孔 420d:流路 421:支持部 422:継手
43:排水手段 438:吸引流路 439:吸引源 437:ソレノイドバルブ
44:水供給手段 449:水供給源
4A:洗浄ユニット 47:矩形スポンジ 470:矩形スポンジの上面
48:支持手段 480:凹部 481:吸引孔 482:基台 483:継手
W: Workpiece Wa: Lower surface of workpiece Wb: Upper surface of workpiece T: Protective tape 1: Processing device 10: Device base 11: Housing 17: Column 19: Touch panel 150a: First cassette 151a: First 2 cassette 155: robot 152: temporary placement area 153: positioning means 18: carry-in means 180: arm part 181: suction pad 184: carry-in moving means 185: carry-in lifting means 156: spinner cleaning mechanism 16: carry-out means 160: arm Part 164: Unloading moving device 165: Unloading elevating device 161: Suction pad 161a: Suction part 161c: Suction surface 161b: Frame body
169: Suction source 30: Chuck table 300: Holding surface 39: Cover 39a: Bellows cover 7: Processing feed means 70: Ball screw 72: Motor 73: Elevating plate 6: Processing means 60: Rotating shaft 62: Motor 64: Processing tool 641 : Grinding stone 38: Thickness measuring means 4: Cleaning unit 41: Roll sponge 410: Roll sponge outer peripheral surface 42: Supporting means 420: Shaft 420c: Suction hole 420d: Flow path 421: Supporting part 422: Joint 43: Draining means 438 : Suction flow path 439: Suction source 437: Solenoid valve 44: Water supply means 449: Water supply source 4A: Cleaning unit 47: Rectangular sponge 470: Top surface of rectangular sponge 48: Supporting means 480: Recessed portion 481: Suction hole 482: Base Stand 483: Joint

Claims (3)

被加工物の下面を保持するチャックテーブルと、加工具を回転可能に支持し該チャックテーブルに保持された被加工物の上面を加工する加工手段と、被加工物の上面を保持し該チャックテーブルに搬入する搬入手段と、被加工物の上面を保持し該チャックテーブルから搬出する搬出手段と、を備える加工装置に配設され、該搬入手段または該搬出手段に保持された被加工物の下面を洗浄する洗浄ユニットであって、
該洗浄ユニットは、被加工物に接触するスポンジと、
該スポンジの被加工物に接触する部分以外の部分で該スポンジを支持するとともに該スポンジを吸引源に連通する吸引孔を備える支持手段と、
該スポンジに含まれる水を該吸引孔から吸引し排水する排水手段と、
該吸引孔を水供給源に連通させ該スポンジの被加工物に接触する部分から水を溢れ出させる水供給手段と、
該搬出手段に保持された被加工物の下面に平行に該搬出手段と該支持手段とを相対的に移動させる、または該搬入手段に保持された被加工物の下面に平行に該搬入手段と該支持手段とを相対的に移動させる移動手段と、を備え、
被加工物を洗浄するときは、該水供給手段により該スポンジの被加工物に接触する部分から水を溢れ出させ、該スポンジを被加工物に接触させ、該移動手段で該搬出手段と該支持手段とを、または該移動手段で該搬入手段と該支持手段とを相対的に移動させ、
被加工物を乾燥させるときは、該スポンジを被加工物に接触させ、該排水手段により該スポンジに含まれた水を排水しながら、該移動手段で該搬出手段と該支持手段とを相対的に移動させる洗浄ユニット。
A chuck table for holding a lower surface of a workpiece, a processing means for rotatably supporting a processing tool to process an upper surface of the workpiece held by the chuck table, and a chuck table for holding an upper surface of the workpiece. Bottom surface of the workpiece held by the carrying-in means or the carrying-out means, the carrying-in means for carrying in the workpiece and the carrying-out means for holding the upper surface of the workpiece and carrying it out from the chuck table. A cleaning unit for cleaning
The cleaning unit includes a sponge that contacts the workpiece,
Supporting means for supporting the sponge at a portion other than a portion of the sponge which is in contact with the workpiece and having a suction hole for communicating the sponge with a suction source;
Drainage means for sucking and draining water contained in the sponge from the suction hole,
Water supply means for communicating the suction hole with a water supply source so as to overflow water from a portion of the sponge which comes into contact with a workpiece.
The carrying-out means and the supporting means are relatively moved in parallel with the lower surface of the workpiece held by the carrying-out means, or the carrying-in means is parallel with the lower surface of the workpiece held by the carrying-in means. A moving means for relatively moving the supporting means,
When cleaning the work piece, water is made to overflow from the portion of the sponge that comes into contact with the work piece by the water supply means, the sponge is brought into contact with the work piece, and the moving means and the carrying-out means are used. Supporting means, or the moving means to relatively move the carrying-in means and the supporting means,
When drying the work piece, the sponge is brought into contact with the work piece, and while the water contained in the sponge is being drained by the draining means, the moving means relatively moves the carrying-out means and the supporting means. Cleaning unit to be moved to.
前記スポンジは、ロールスポンジであって、
前記支持手段は、該ロールスポンジの筒内に挿入され外側面に前記吸引孔が配設されたシャフトと、該シャフトを回転自在に支持する支持部と、を備える請求項1記載の洗浄ユニット。
The sponge is a roll sponge,
The cleaning unit according to claim 1, wherein the supporting means includes a shaft that is inserted into a cylinder of the roll sponge and has the suction hole on the outer surface thereof, and a support portion that rotatably supports the shaft.
前記スポンジは、矩形スポンジであって、
前記支持手段は、該矩形スポンジの被加工物に接する部分を露出させ該矩形スポンジの被加工物に接する部分以外を収容する凹部を有し、該凹部の内面に該吸引孔が形成された基台と、を備える請求項1記載の洗浄ユニット。
The sponge is a rectangular sponge,
The support means has a recessed portion that exposes a portion of the rectangular sponge that contacts the workpiece and accommodates a portion other than the portion of the rectangular sponge that contacts the workpiece, and a base on which the suction hole is formed on the inner surface of the recessed portion. The cleaning unit according to claim 1, further comprising a table.
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JP7478625B2 (en) 2020-08-25 2024-05-07 株式会社荏原製作所 SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE C

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104376A (en) * 1992-09-17 1994-04-15 Mitsui High Tec Inc Rinse water drier in flon substitute washing
JP2000015190A (en) * 1998-07-03 2000-01-18 Matsushita Electric Ind Co Ltd Method and device for substrate washing
JP2000301079A (en) * 1999-02-18 2000-10-31 Ebara Corp Substrate washing device
JP2008045857A (en) * 2006-08-21 2008-02-28 Kyoyu Kiko:Kk Water absorbing roll for use in water absorbing device, and surface treating device
JP2013122995A (en) * 2011-12-12 2013-06-20 Disco Abrasive Syst Ltd Grinding device
JP2016115776A (en) * 2014-12-12 2016-06-23 株式会社ディスコ Washing apparatus
JP2016167514A (en) * 2015-03-09 2016-09-15 株式会社荏原製作所 Substrate cleaning device, substrate cleaning method, and substrate processing device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9531152B2 (en) 2013-06-06 2016-12-27 Mitsubishi Electric Corporation Waveguide laser

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104376A (en) * 1992-09-17 1994-04-15 Mitsui High Tec Inc Rinse water drier in flon substitute washing
JP2000015190A (en) * 1998-07-03 2000-01-18 Matsushita Electric Ind Co Ltd Method and device for substrate washing
JP2000301079A (en) * 1999-02-18 2000-10-31 Ebara Corp Substrate washing device
JP2008045857A (en) * 2006-08-21 2008-02-28 Kyoyu Kiko:Kk Water absorbing roll for use in water absorbing device, and surface treating device
JP2013122995A (en) * 2011-12-12 2013-06-20 Disco Abrasive Syst Ltd Grinding device
JP2016115776A (en) * 2014-12-12 2016-06-23 株式会社ディスコ Washing apparatus
JP2016167514A (en) * 2015-03-09 2016-09-15 株式会社荏原製作所 Substrate cleaning device, substrate cleaning method, and substrate processing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7478625B2 (en) 2020-08-25 2024-05-07 株式会社荏原製作所 SUBSTRATE CLEANING APPARATUS, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE C

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