JP2023072862A - Grinding device and processing device - Google Patents

Abstract

To keep the distance between a surface to be washed and an injection port of a nozzle constant to always properly perform washing in a grinding device having a two-fluid washing mechanism.SOLUTION: A grinding device 1 includes a chuck table 30 that holds a workpiece 90 on a holding surface 302, a grinding mechanism 5 that grinds the workpiece 90 held on the holding surface 302 with a grinding wheel 541, a top surface height measuring device 382 that measures the top surface height of the workpiece 90 held on the holding surface 302, a two-fluid nozzle 71 that has an injection port 710 and injects two fluids in which water and air are mixed, a nozzle height adjustment mechanism 6 that adjusts the height of the two-fluid nozzle 71, and a first control unit 81 that controls the nozzle height adjustment mechanism 6 such that the distance between the top surface of the workpiece 90 held by the holding surface 302 and the injection port 710 is the preset first distance on the basis of the value measured by the top surface height measuring device 382.SELECTED DRAWING: Figure 1

Description

The present invention relates to a processing apparatus such as a grinding apparatus for grinding a workpiece such as a semiconductor wafer.

For example, in the grinding apparatuses disclosed in Patent Document 1, Patent Document 2, and Patent Document 3, a chuck table holds a wafer ground by a grinding wheel, and water and air are sprayed onto the upper surface of the wafer from a nozzle. is washed by jetting two fluids mixed with each other.

JP 2011-200785 A JP 2017-135343 A JP 2020-116665 A

A nozzle for cleaning the wafer is positioned at a cleaning position above the chuck table. The nozzle moves up and down between two positions, a cleaning position for cleaning the wafer and a retraction position, by an elevating mechanism. Therefore, even if the thickness of the ground wafer varies greatly, cleaning is performed by positioning the nozzle at a predetermined cleaning position, and the distance between the upper surface of the wafer and the nozzle may become closer or longer. As a result, there is a problem that portions of the wafer that cannot be cleaned are generated. Moreover, there are times when it is desired to wash the holding surface of the chuck table with two fluids jetted from the nozzle.

Therefore, in a processing apparatus such as a grinding apparatus equipped with a two-fluid washing mechanism that jets two fluids from a nozzle to wash the surface, the distance between the surface to be washed and the injection port of the nozzle is kept at a desired constant distance, and washing is always performed appropriately. I have a problem to make it work.

To solve the above problems, the present invention provides a chuck table that holds a workpiece on a holding surface, a grinding mechanism that grinds the workpiece held on the holding surface with a grinding wheel, and a chuck table that is held on the holding surface. and a two-fluid nozzle having an injection port for injecting a two-fluid mixture of water and air, wherein the two A nozzle height adjusting mechanism for adjusting the height of the fluid nozzle and a distance between the upper surface of the workpiece held on the holding surface and the injection port are adjusted in advance based on the value measured by the upper surface height measuring device. and a first control unit that controls the nozzle height adjustment mechanism so as to achieve a set first distance.
For example, in the grinding apparatus according to the present invention, the height of the holding surface is measured by the upper surface height measuring device, and based on the value measured by the upper surface height measuring device, the difference between the holding surface and the injection port is determined. A second control section may be provided for controlling the nozzle height adjustment mechanism so that the distance becomes a preset second distance.
For example, the grinding apparatus according to the present invention includes: a holding surface height measuring device for measuring the height of the holding surface; and a third control unit that controls the nozzle height adjustment mechanism so that the distance of is a preset second distance.
For example, in the grinding apparatus according to the present invention, a plurality of the two-fluid nozzles may be arranged so as to correspond to the radial area of the workpiece held on the holding surface.

Further, the present invention for solving the above-mentioned problems is a machining mechanism which is provided with a chuck table for holding a workpiece on a holding surface and a machining tool for machining the upper surface of the workpiece held on the holding surface to reduce the thickness. a thickness measuring unit for measuring the thickness of the workpiece held on the holding surface; a spinner cleaning mechanism for cleaning the upper surface of the workpiece machined by the machining tool; and the spinner cleaning mechanism from the chuck table. A processing apparatus comprising a conveying mechanism for conveying a workpiece and a spinner control section, wherein the thickness measuring unit measures the height of the upper surface of the workpiece held on the holding surface. a holding surface height measuring device for measuring the height of the holding surface, and the difference between the value of the upper surface height measuring device and the value of the holding surface height measuring device is calculated as the thickness of the workpiece. a calculation unit, wherein the spinner cleaning mechanism includes a spinner holding mechanism that holds a workpiece and rotates around the center of the workpiece; a spinner two-fluid nozzle for ejecting a two-fluid mixed with air from a spinner ejection port; and a spinner nozzle height adjustment mechanism for adjusting the height of the spinner two-fluid nozzle. A setting unit is provided for presetting a distance suitable for cleaning between the surface to be cleaned and the spinner nozzle, and the spinner is held by the spinner holding mechanism based on the value set in the setting unit and the value measured by the thickness measurement unit. The spinner nozzle height adjusting mechanism is controlled such that the distance between the upper surface of the workpiece and the spinner nozzle is a preset third distance, and the upper surface of the workpiece held by the spinner holding mechanism is adjusted. It is a processing device that cleans.

The grinding apparatus according to the present invention measures the height of the upper surface of the workpiece held on the holding surface of the chuck table, which is measured by the upper surface height measuring device. By controlling the nozzle height adjustment mechanism by the first control unit so that the distance from the mouth becomes the preset first distance, the upper surface of the workpiece can always be appropriately washed with two fluids. Become. For example, when a plurality of chuck tables with different heights are arranged on the turntable, it is possible to adjust the height of the two-fluid nozzle for each chuck table that sucks and holds the workpiece. Also, for example, even if the grinding is finished before the work piece reaches the planned finish grinding thickness, the height of the top surface of the work piece measured by the top surface height measuring device is measured by 2 By adjusting the height of the fluid nozzle, the two-fluid cleaning of the workpiece is optimized at all times.
Further, the grinding apparatus according to the present invention, for example, when the holding surface of the chuck table is ground (self-grinding) at an appropriate timing during the process of continuously grinding a plurality of workpieces, Even if the height of the surface changes before and after self-grinding, the distance between the holding surface and the nozzle should be adjusted in advance based on the value measured by the upper surface height measuring device or the holding surface height measuring device. By controlling the nozzle height adjustment mechanism so that the set second distance is achieved, the holding surface can be appropriately washed with two fluids.

In the processing apparatus according to the present invention, the spinner cleaning mechanism includes a spinner holding mechanism that holds a workpiece and rotates around the center of the workpiece, and water that is applied to the upper surface of the workpiece held by the spinner holding mechanism. A spinner two-fluid nozzle for ejecting two fluids mixed with air from a spinner ejection port; and a setting unit for presetting a suitable distance for cleaning between the nozzle and the spinner nozzle, and the upper surface of the workpiece held by the spinner holding mechanism and the spinner are determined from the value set in the setting unit and the value measured by the thickness measurement unit. By controlling the spinner nozzle height adjustment mechanism so that the distance from the injection port becomes a preset third distance, for example, the thickness of the workpiece held on the spinner holding surface after grinding is completed can be adjusted. Therefore, the distance between the upper surface of the workpiece held by the spinner holding mechanism and the spinner nozzle can always be adjusted to an appropriate third distance, and the upper surface of the workpiece can be washed with two fluids.

It is a perspective view which shows an example of a grinding apparatus. The distance between the upper surface of the first work piece with the finishing thickness held on the holding surface of the chuck table and each injection port of the first two-fluid nozzle to the third two-fluid nozzle is set to a preset first distance. FIG. 10 is a side view showing a state in which the upper surface of the first workpiece is properly washed in a state in which the first workpiece is being cleaned. FIG. 4 is a plan view showing an example of an arrangement pattern of first to third two-fluid nozzles; FIG. 8 is a plan view showing another example of the arrangement pattern of the first two-fluid nozzles to the third two-fluid nozzles; A first distance, which is a preset distance between the upper surface of the second workpiece held on the holding surface of the chuck table and having a thickness greater than the finished thickness, and each injection port of the first two-fluid nozzle to the third two-fluid nozzle. FIG. 10 is a side view showing the top surface of the second workpiece not being properly cleaned because it is shorter than the . In a state where the distance between the upper surface of the second workpiece held on the holding surface of the chuck table and each injection port of the first two-fluid nozzle to the third two-fluid nozzle is set to the preset first distance. , and is a side view showing a state in which the upper surface of the second workpiece is properly cleaned. A first distance, which is a preset distance between the upper surface of the third workpiece held on the holding surface of the chuck table and having a thinner thickness than the finished thickness, and each injection port of the first two-fluid nozzle to the third two-fluid nozzle. FIG. 10 is a side view showing a state in which the top surface of the third workpiece has not been properly cleaned because it has become longer than the third workpiece; In a state where the distance between the upper surface of the third workpiece held on the holding surface of the chuck table and each injection port of the first two-fluid nozzle to the third two-fluid nozzle is set to the preset first distance. and FIG. 11 is a side view showing a state in which the upper surface of the third workpiece is properly cleaned. In a state where the distance between the upper surface of the first workpiece with the finishing thickness held on the holding surface of the chuck table and the injection port of the slit nozzle is set to the preset first distance, the first workpiece is FIG. 4 is a side view showing a state in which the upper surface is properly washed; The distance between the upper surface of the second workpiece, which is thicker than the finished thickness and held on the holding surface of the chuck table, and the injection port of the slit nozzle is shorter than the preset first distance. FIG. 10 is a side view showing a state in which the upper surface of the second workpiece is not properly cleaned; The distance between the upper surface of the third workpiece that is thinner than the finished thickness held on the holding surface of the chuck table and the injection port of the slit nozzle is longer than the preset first distance. FIG. 10 is a side view showing a state in which the upper surface of the second workpiece is not properly cleaned; After the self-grinding, the holding surface of the chuck table is properly cleaned while the distance between the holding surface of the chuck table and the injection ports of the first to third two-fluid nozzles is set to the preset second distance. FIG. 10 is a side view showing a state in which It is a perspective view which shows an example of a processing apparatus provided with a spinner cleaning mechanism. FIG. 10 is a side view showing a state in which the thickness measuring unit measures the thickness of the workpiece held on the chuck table and after grinding is completed; The distance between the upper surface of the workpiece held on the spinner holding surface of the spinner table and each of the spinner nozzles of the first to third spinner two-fluid nozzles is set to a preset third distance. and FIG. 9 is a side view for explaining a case in which the upper surface of the workpiece is properly cleaned.

A grinding apparatus 1 shown in FIG. 1 is an apparatus that grinds a workpiece 90 held on a chuck table 30 by a grinding mechanism 5 . The front side (-Y direction side) of the base 10 of the grinding apparatus 1 is a loading/unloading area where the workpiece 90 is loaded/unloaded to/from the chuck table 30. direction side) is a processing area in which the grinding mechanism 5 grinds the workpiece 90 held on the chuck table 30 .
The grinding apparatus 1 has two shafts, a rough grinding mechanism and a finish grinding mechanism, as grinding mechanisms. The holding chuck table 30 may be configured to be positioned below each grinding mechanism.

The workpiece 90 shown in FIG. 1 is, for example, a circular semiconductor wafer made of a silicon base material or the like. A surface 900 (lower surface 900) of the workpiece 90 facing downward in FIG. It is formed and is protected by affixing a protective tape (not shown). A back surface 903 (upper surface 903) of the workpiece 90 facing upward is a surface to be ground. In addition to silicon, the workpiece 90 may be made of gallium arsenide, sapphire, gallium nitride, resin, ceramics, silicon carbide, or the like. It may be a wafer or the like.

The chuck table 30 having a circular outer shape in plan view includes, for example, a circular plate-shaped porous member 300 and a frame 301 that supports the porous member 300 . The porous member 300 communicates with a suction source (not shown) such as an ejector mechanism or a vacuum generator, and the suction force generated by the suction source is transmitted to the holding surface 302, which is the top surface of the porous member 300. , the chuck table 30 can hold the workpiece 90 on the holding surface 302 by suction.

As shown in FIG. 1, the chuck table 30 is surrounded by a cover 39 and is rotatable about a rotation axis whose axial direction is the Z-axis direction (vertical direction) and which passes through the center of the holding surface 302. The base 10 can be reciprocated in the Y-axis direction by a Y-axis feed unit (not shown) such as an electric slider disposed under the cover 39 and the bellows cover 390 connected to the cover 39 and extending and contracting in the Y-axis direction.

A column 11 is erected on the rear side of the base 10, and the grinding mechanism 5 is mounted on the front surface of the column 11 on the -Y direction side in the vertical direction (Z-axis direction) perpendicular to the holding surface 302 of the chuck table 30. ), a grinding feed unit 17 is provided.
The grinding feed unit 17 includes a ball screw 170 whose axial direction is the Z-axis direction, a pair of guide rails 171 extending parallel to the ball screw 170, a motor 172 connected to the ball screw 170 to rotate the ball screw 170, and an internal A nut is screwed onto the ball screw 170, and the sides of the lift plate 173 are in sliding contact with a pair of guide rails 171. When the motor 172 rotates the ball screw 170, the lift plate 173 is guided by the guide rail 171. and moves in the Z-axis direction, and the grinding mechanism 5 attached to the lifting plate 173 also moves in the Z-axis direction.

The grinding mechanism 5 includes a rotating shaft 50 whose axial direction is the Z-axis direction, a housing 51 that rotatably supports the rotating shaft 50 by an air bearing or the like formed inside, a motor 52 that rotationally drives the rotating shaft 50, A disk-shaped mount 53 connected to the lower end of the rotating shaft 50, a grinding wheel 54 detachably attached to the lower surface of the mount 53, and a holder 55 supporting the housing 51 and connected to the lifting plate 173. Prepare.

The grinding wheel 54 includes a wheel base 542 and a plurality of substantially rectangular parallelepiped segment grinding wheels arranged in a ring on the bottom surface of the wheel base 542 . The segmented grindstone is formed by bonding diamond abrasive grains or the like with, for example, a resin bond, a vitrified bond, or the like. A ring-shaped grinding wheel 541 is formed by a plurality of ring-shaped segmented wheels. A so-called continuous-arrangement grinding wheel in which segmented grinding wheels are arranged in an annular shape without gaps may be arranged on the lower surface of the wheel base 542 .

Inside the rotating shaft 50, a flow path (not shown) that communicates with the grinding water supply source and serves as a path for the grinding water is provided through the rotating shaft 50 in the axial direction. Through the mount 53 , an opening is formed on the bottom surface of the wheel base 542 so that grinding water can be jetted toward the annular grinding wheel 541 .

At a position near the grinding wheel 54 lowered to a height for grinding the workpiece 90, a thickness measuring unit 38 is arranged for measuring the thickness of the workpiece 90 during grinding, for example, in a contact manner. The thickness measurement unit 38 includes, for example, a pair of measuring instruments (height gauges), that is, the height of the holding surface 302 that is the upper surface of the chuck table 30 (actually, the upper surface of the frame 301 flush with the holding surface 302). and a top surface height measuring device 382 for measuring the height of the top surface 903 of the workpiece 90 held on the chuck table 30 by suction.

The holding surface height measuring device 381 and the upper surface height measuring device 382 are provided with contacts at their respective ends for contacting the respective measuring surfaces. The contacts of the holding surface height measuring device 381 and the upper surface height measuring device 382 are supported so as to be vertically movable, and can be pressed against each measuring surface with an appropriate force. A scale for reading the height of the contact whose tip is brought into contact with each measurement surface is provided, and the height of the holding surface and the top surface height of the workpiece 90 are measured based on the value of the scale.
The thickness measurement unit 38 includes a calculator 383 that calculates the difference between the holding surface height measured by the holding surface height measuring device 381 and the top surface height of the workpiece 90 measured by the top surface height measuring device 382. .

A second column 12 is erected on the -X direction side area on the base 10 shown in FIG. A nozzle height adjustment mechanism 6 for adjusting the heights of the first two-fluid nozzle 71, the second two-fluid nozzle 72, and the third two-fluid nozzle 73 is arranged.

The nozzle height adjustment mechanism 6 includes a ball screw 60 whose axial direction is the Z-axis direction, a guide rail 61 extending parallel to the ball screw 60, a motor 62 connected to the ball screw 60 for rotating the ball screw 60, and an internal The nut is screwed onto the ball screw 60, and the side portion of the lifting block 63 is in sliding contact with the guide rail 61. When the motor 62 rotates the ball screw 60, the lifting block 63 is guided by the guide rail 61. The first two-fluid nozzle 71 to the third two-fluid nozzle 73 attached to the lifting block 63 are also moved up and down in the Z-axis direction.

For example, the nozzle height adjustment mechanism 6 includes a height detection unit 66 that detects the heights of the first two-fluid nozzles 71 to the third two-fluid nozzles 73 from the height of the lift block 63 . The height detection unit 66 includes a scale 660 extending in the Z-axis direction along the guide rail 61, and an elevation block 63 attached to the scale 660, which moves up and down together with the elevation block 63. and a reader 662 for reading.
The height detector 66 may read the heights of the first to third two-fluid nozzles 71 to 73 using an encoder connected to the rotating shaft of the motor 62 instead of the scale 660 .

As shown in FIG. 1, the grinding machine 1 according to the present invention comprises a control unit 8 for controlling the whole machine. The control unit 8 is composed of a CPU that performs arithmetic processing according to a control program, a storage medium such as a memory, and the like. The control unit 8 is electrically connected to the grinding feed unit 17, the grinding mechanism 5, etc., for example, via a wired or wireless communication path. Under the control of the control unit 8, the vertical movement of the grinding mechanism 5 by the grinding feed unit 17, the rotation of the grinding wheel 54 in the grinding mechanism 5, and the like are performed.

The control unit 8 is also, for example, electrically connected to a motor 62 of the nozzle height adjustment mechanism 6 and supplies operating signals to the motor 62 to cause the nozzle height adjustment mechanism 6 to operate the first two fluids. The vertical movement of the nozzle 71 to the third two-fluid nozzle 73 can be controlled. Further, the reader 662 of the height detector 66 transmits the read height information of the first two-fluid nozzle 71 to the third two-fluid nozzle 73 to the control unit 8 .

A box 75 that houses the first to third two-fluid nozzles 71 to 73 is connected to the lower surface of the lifting block 63 shown in FIG. A rectangular opening 750 is formed in the lower surface of the box 75 , and the movement path of the chuck table 30 is positioned below the opening 750 .

The grinding apparatus 1 according to the present embodiment has a two-fluid nozzle having an injection port for injecting two fluids in which water and air are mixed. A plurality (for example, three) are arranged so as to correspond to a radius area 904 from 902 to the outer peripheral edge. Specifically, a first two-fluid nozzle 71 shown in FIG. Injection ports 710 are opposed to each other, and a second two-fluid nozzle 72 and a third two-fluid nozzle 73 are provided in this order at equal intervals radially outward of the workpiece 90, respectively. 730 is arranged to face the upper surface 903 of the workpiece 90 . For example, as shown in FIG. 2, the injection port 730 of the third two-fluid nozzle 73 is located at a predetermined distance toward the center of the outer peripheral edge of the workpiece 90 .
That is, as shown in FIG. 3, the first two-fluid nozzle 71, the second two-fluid nozzle 72, and the third two-fluid nozzle 73 inject the two-fluid T into the radial area 904 of the workpiece 90. They are spaced evenly apart. As shown in FIG. 3, for example, the first two-fluid nozzle 71 to the third two-fluid nozzle 73 spray the two fluids in a spray pattern that spreads downward in a conical shape and contact the upper surface 903 of the workpiece 90. Each circular injection area in plan view of T may overlap slightly. It should be noted that the injection areas that overlap each other are overlapped so that the detergency does not cancel each other out. In FIG. 3, the first two-fluid nozzle 71, the second two-fluid nozzle 72, and the third two-fluid nozzle 73 are arranged in a row in the radial direction of the workpiece 90. 4, they may be staggered in the circumferential direction. In the example shown in FIG. 4 , the two-fluid T ejected from the first two-fluid nozzle 71 located closest to the center 902 of the workpiece 90 is ejected from the upper surface 903 of the relatively rotating workpiece 90 . The two-fluid T jetted from the third two-fluid nozzle 73 positioned farthest from the center 902 of the workpiece 90 cleans the upper surface of the rotating workpiece 90. An annular area including the outer periphery of 903 is cleaned, and an annular area between the annular cleaning area by the first two-fluid nozzle 71 and the annular cleaning area by the third two-fluid nozzle 73 is cleaned. , the entire surface of the upper surface 903 is cleaned by cleaning with the two-fluid T jetted from the second two-fluid nozzle 72 . Note that the annular regions may overlap slightly.

Since the structures of the first two-fluid nozzle 71, the second two-fluid nozzle 72, and the third two-fluid nozzle 73 are the same, only the structure of the first two-fluid nozzle 71 will be described below. The first two-fluid nozzle 71 in the present embodiment has a linear outer shape extending in the Z-axis direction, and two fluids ejected from an ejection port 710 formed at the lower end of the nozzle spread in a fan-like flat fan shape. or a full cone pattern nozzle that provides a conical pattern, but is not limited thereto. The spread angle of the two fluids jetted from the jet port 710 is recognized in advance by the control unit 8 .

The upper part of the first two-fluid nozzle 71 communicates with a washing water supply source 77 composed of a pump or the like and capable of sending pure water, for example, as washing water, through a joint or the like and a water pipe 76 such as a resin tube. there is Although not shown in FIG. 1, the cleaning water supply source 77 similarly communicates with the second two-fluid nozzle 72 and the third two-fluid nozzle 73 .

An air supply source 79 composed of a compressor or the like capable of sending out compressed air communicates with the upper side of the first two-fluid nozzle 71 via a joint or the like and a pipe 78 such as a resin tube. Although not shown in FIG. 1, the air supply source 79 similarly communicates with the second two-fluid nozzle 72 and the third two-fluid nozzle 73 .

The first two-fluid nozzle 71, the second two-fluid nozzle 72, and the third two-fluid nozzle 73 are attached so as to be located in the inner space of the box 75, and are arranged at the same height. It is The box 75 prevents the two fluids sprayed on the upper surface 903 of the workpiece 90 from scattering over a wider area than necessary when cleaning the workpiece 90 suction-held on the holding surface 302 of the chuck table 30. belongs to. Note that the grinding apparatus 1 may be configured without the box 75 .

The control unit 8 includes, for example, a first control section 81, a second control section 82, and a third control section 83, as shown in FIG. Based on the height value of the upper surface 903 of the workpiece 90 sucked and held on the holding surface 302 of the chuck table 30 measured by the upper surface height measuring device 382, the first control unit 81 determines whether the workpiece 90 is held on the holding surface 302. The nozzle height is adjusted so that the distance between the upper surface 903 of the workpiece 90 and the ejection port 710 of the first two-fluid nozzle 71 to the ejection port 730 of the third two-fluid nozzle 73 is the preset first distance. It controls the height adjustment mechanism 6.

Based on the height value of the holding surface 302 of the chuck table 30 measured by the upper surface height measuring device 382 , the second control unit 82 controls the holding surface 302 and the injection ports 710 to 30 of the first two-fluid nozzle 71 . The nozzle height adjustment mechanism 6 is controlled so that the distance between the injection port 730 of the two-fluid nozzle 73 and the second distance is set in advance.

Based on the height value of the holding surface 302 of the chuck table 30 measured by the holding surface height measuring device 381, the third control unit 83 controls the holding surface 302 and the ejection port 710 of the first two-fluid nozzle 71 to the second nozzle. The nozzle height adjustment mechanism 6 is controlled so that the distance between the injection port 730 of the two-fluid nozzle 73 of No. 3 and the ejection port 730 becomes the preset second distance.

The operation of the grinding apparatus 1 when grinding the workpiece 90 held on the chuck table 30 will be described below. First, in the attachment/detachment area, the first workpiece 90 is placed on the holding surface 302 of the chuck table 30 with their centers substantially aligned. A suction force generated by a suction source (not shown) is transmitted to the holding surface 302 , and the chuck table 30 suction-holds the workpiece 90 on the holding surface 302 .

Next, the chuck table 30 holding the workpiece 90 is moved in the +Y direction to below the grinding mechanism 5 by a Y-axis feed unit (not shown). Then, the center of rotation of the grinding wheel 541 of the grinding mechanism 5 is horizontally displaced from the center of rotation of the workpiece 90 by a predetermined distance, and the rotation locus of the grinding wheel 541 passes through the center of rotation 902 of the workpiece 90. Positioned.

In order to start the grinding process, the motor 52 rotates the grinding wheel 54, the grinding mechanism 5 is lowered by the grinding feed unit 17, and the rotating grinding wheel 541 contacts the upper surface 903 of the workpiece 90 to start grinding. done. During grinding, the chuck table 30 rotates at a predetermined rotational speed, and the workpiece 90 held on the holding surface 302 also rotates. conduct. Grinding water passing through a flow path (not shown) is supplied to the contact portion between the grinding wheel 541 and the workpiece 90 to cool the contact portion.

During grinding, the thickness measuring unit 38 uses the holding surface height measuring device 381 to measure the height of the holding surface 302 serving as the reference surface (the height of the upper surface of the frame 301 on which the workpiece 90 is not placed). The height of the upper surface 903 of the workpiece 90 to be ground is measured by the upper surface height measuring device 382, and the difference between the two measured values is calculated to determine the thickness of the workpiece 90 during grinding. Measure sequentially. After grinding the workpiece 90 to a desired thickness (predicted finish thickness), the grinding mechanism 5 is lifted, the grinding wheel 541 is separated from the workpiece 90, and grinding is completed. Here, in the grinding apparatus 1 according to the present invention, information about the height of the top surface 903 of the workpiece 90 at the end of grinding measured by the top surface height measuring device 382 is sent to the control unit 8 and stored. be done.

The chuck table 30 sucking and holding the workpiece 90 that has been ground moves in the -Y direction, and as shown in FIG. A jet 710 of nozzle 71 is positioned, and a second two-fluid nozzle 72 and a third two-fluid nozzle 73 are positioned along radial area 904 of workpiece 90 and above it.

The first control section 81 of the control unit 8 shown in FIG. Based on the height Z1 shown in FIG. 2 of 903, control of the nozzle height adjustment mechanism 6 is implemented. In the storage medium of the control unit 8, the upper surface 903 of the workpiece 90 held on the holding surface 302 and the ejection port 710 of the first two-fluid nozzle 71 to the ejection port 730 of the third two-fluid nozzle 73 are stored in advance. A first distance L1 of is stored. The first distance L1 is the distance between the two fluids jetted from the first two-fluid nozzle 71, the second two-fluid nozzle 72, and the third two-fluid nozzle 73 and sprayed onto the upper surface 903 of the workpiece 90. It is a value that does not cancel out the cleaning power with each other in the area, and the upper surface 903 of the workpiece 90 is properly cleaned by the two fluids ejected from the first two-fluid nozzle 71 to the third two-fluid nozzle 73. It is a distance that can be washed. Note that the first distance L1 may be a value such that the areas do not overlap each other. A cleaning experiment was performed by changing the first distance L1, and the image of the upper surface 903 of the workpiece 90 after cleaning was taken with a camera. It is good also as the distance of time.

In this embodiment, the reader 662 of the height detection unit 66 shown in FIG. height is read, and the height information is transmitted to the first control unit 81 . 2, the first control unit 81 receives the information and, as shown in FIG. An operation signal is supplied to the motor 62 of the nozzle height adjustment mechanism 6 while adjusting it so that the outlet 710 to the ejection port 730 of the third two-fluid nozzle 73 are positioned, and the motor 62 is rotated forward or backward to rotate the nozzle height. The first two-fluid nozzle 71 to the third two-fluid nozzle 73 are lowered or raised. Then, for example, by positioning the first two-fluid nozzle 71 to the third two-fluid nozzle 73 at the height Z2, the first distance L1 from the upper surface 903 of the workpiece 90 held on the holding surface 302. The ejection port 710 of the first two-fluid nozzle 71 to the ejection port 730 of the third two-fluid nozzle 73 are positioned above.
An encoder detects the number of revolutions of the motor 62 of the nozzle height adjustment mechanism 6 shown in FIG. , the first two-fluid nozzle 71 to the third two-fluid nozzle 73 may be positioned at an appropriate height Z2.

In this state, washing water is supplied from the washing water supply source 77 shown in FIG. It is supplied to the fluid nozzle 71 to the third two-fluid nozzle 73 . In the first two-fluid nozzle 71 to third two-fluid nozzle 73, the cleaning water and air are mixed to form two-fluid T, and the injection port 710 of the first two-fluid nozzle 71 to the third two-fluid nozzle Two fluids T are jetted from the jet port 730 of the nozzle 73 toward the upper surface 903 of the workpiece 90 . In addition, as the chuck table 30 rotates, the entire upper surface 903 of the workpiece 90 is washed by the two fluids T, and fine particles such as grinding dust adhering to the upper surface 903 of the workpiece 90 are washed away. be dropped.
The cleaning water of the two fluids T that has washed away the deposits flows down from the chuck table 30, for example, into a water case (not shown) through a drainage port formed on the side of the cover 39 and the bellows cover 390 shown in FIG. flowing.

As shown in FIG. 2, in this embodiment, first two-fluid nozzles 71 to third two-fluid nozzles 73 are arranged above a radial area 904 from the center 902 to the outer periphery of the workpiece 90. In addition, the ejection port 710 of the first two-fluid nozzle 71 to the ejection port 730 of the third two-fluid nozzle 73 are positioned above the upper surface 903 of the workpiece 90 by the first distance L1. Therefore, the radial area 904 is thoroughly and appropriately cleaned by the two-fluid T that is ejected from the ejection port 710 of the first two-fluid nozzle 71 to the ejection port 730 of the third two-fluid nozzle 73 and spreads, for example, in a fan shape. be done.

After the two-fluid cleaning of the upper surface 903 of the workpiece 90 is performed for a predetermined time, for example, the supply of cleaning water from the cleaning water supply source 77 is stopped and the supply of air from the air supply source 79 is continued. , the workpiece 90 is dried by the air. Alternatively, the supply of air from the air supply source 79 may also be stopped, and the workpiece 90 may be spin-dried by rotating the chuck table 30 .

Next, the first workpiece 90 that has been ground and cleaned is carried out from the chuck table 30 shown in FIG. Similarly, it is held by suction on the chuck table 30 . After that, the second workpiece 90 is also ground in the same manner as the grinding of the first workpiece 90 .

When the thickness of the second workpiece 90 is measured by the thickness measuring unit 38 shown in FIG. Therefore, the second workpiece 90 may become thicker than the predetermined finished thickness. In this case, information about the height of the upper surface 903 of the second workpiece 90 after grinding measured by the upper surface height measuring device 382 (for example, height Z3 shown in FIG. 5) is used by the control sent to unit 8 for storage. In addition, when the second workpiece 90 is a wafer different in type from the first workpiece 90, or when the originally planned finish thickness is greater than that of the first workpiece 90, the second workpiece 90 Even when the workpiece 90 is thick, the height Z3 of the upper surface 903 of the second workpiece 90 shown in FIG. It is higher than the height Z1.

FIG. 5 shows, for example, like a conventional grinding apparatus, the injection port 710 of the first two-fluid nozzle 71 to the injection port 730 of the third two-fluid nozzle 73 depending on the height value of the upper surface 903 of the workpiece 90. without adjusting the height of the first two-fluid nozzle 71 to the nozzle height Z2 when the nozzle height adjustment mechanism 6 cleans the first workpiece 90 shown in FIG. It is assumed that the injection port 730 of the two-fluid nozzle 73 is positioned to wash the second workpiece 90 .

In this case, from the height Z3 of the upper surface 903 of the second workpiece 90 to the height Z2 of the ejection port 710 of the first two-fluid nozzle 71 to the ejection port 730 of the third two-fluid nozzle 73 Since the distance is shorter than the predetermined appropriate first distance L1 shown in FIG. 2, as shown in FIG. Since the two fluids T jetted from the injection port 730 of 73 are not sufficiently spread in a fan shape, the two fluids T reach the radius area 904 of the rotating workpiece 90 . A location 905 that is difficult to reach is generated, and cleaning of the upper surface 903 of the workpiece 90 becomes insufficient.

On the other hand, in the grinding apparatus 1 according to the present invention, the first control unit 81 shown in FIG. While receiving information sent from the reader 662 of the height detector 66 shown in 1, the nozzle height adjustment mechanism 6 is controlled. Then, the nozzle height adjustment mechanism 6 raises the first two-fluid nozzle 71 to the third two-fluid nozzle 73, for example, to the height Z4 shown in FIG. By positioning the two-fluid nozzle 73, the injection port 710 of the first two-fluid nozzle 71 to the second nozzle are positioned upward by the first distance L1 from the upper surface 903 of the second workpiece 90 held on the holding surface 302. 3 of the two-fluid nozzles 73 are located.

In this state, while the chuck table 30 is rotating, the two fluids T are ejected from the ejection port 710 of the first two-fluid nozzle 71 to the ejection port 730 of the third two-fluid nozzle 73, and the two fluids T spread like a fan, for example. The radial area 904 of the upper surface 903 of the workpiece 90 is thoroughly and appropriately washed, and the fine grinding dust and the like adhering to the entire upper surface 903 are properly washed off.

Next, the second workpiece 90 that has been cleaned and dried is carried out from the chuck table 30, and a new third workpiece 90 is added to the first and second workpieces 90. , and is held by suction on the chuck table 30, and the third workpiece 90 is ground.

For example, the thickness of the third workpiece 90 is set to be smaller than the thickness set for the first workpiece 90 . In this state, the thickness is measured by the thickness measuring unit 38 shown in FIG. 1 during grinding. As a result, the ground third workpiece 90 is ground thinner than the first workpiece 90 . In this case, information about the height of the top surface 903 of the third workpiece 90 at the end of grinding measured by the top surface height measuring device 382 (for example, height Z5 shown in FIG. 7) is It is sent to the control unit 8 and stored.

FIG. 7 shows, for example, like a conventional grinding apparatus, the injection port 710 of the first two-fluid nozzle 71 to the injection port 730 of the third two-fluid nozzle 73 depending on the height value of the upper surface 903 of the workpiece 90. Without adjusting the height of the first two-fluid nozzle 71, the nozzle height adjustment mechanism 6 shown in FIG. It is assumed that the injection port 730 of the two-fluid nozzle 73 is positioned to clean the third workpiece 90 .

The distance from the height Z5 of the upper surface 903 of the third workpiece 90 to the height Z2 of the ejection port 710 of the first two-fluid nozzle 71 to the ejection port 730 of the third two-fluid nozzle 73 is determined in advance. is longer than the appropriate first distance L1 (see FIG. 2), the distance between the injection port 710 of the first two-fluid nozzle 71 and the injection port 730 of the third two-fluid nozzle 73 is 2. The fluids T fan out so far that the two fluids T collide and interfere in mid-air before reaching the radial area 904 of the rotating workpiece 90 . As a result, a location 906 that is difficult for the two fluids T to reach occurs in the radius area 904, and cleaning of the upper surface 903 of the workpiece 90 becomes insufficient.

On the other hand, in the grinding apparatus 1 according to the present invention, the first control unit 81 shown in FIG. While receiving information sent from the reader 662 shown in 1, the nozzle height adjustment mechanism 6 is controlled. Then, the nozzle height adjusting mechanism 6 lowers the first two-fluid nozzle 71 to the third two-fluid nozzle 73 as shown in FIG. By positioning the third two-fluid nozzle 73, the ejection port of the first two-fluid nozzle 71 is positioned upward by the first distance L1 from the upper surface 903 of the third workpiece 90 held on the holding surface 302. 710 to the ejection port 730 of the third two-fluid nozzle 73 are located.

In this state, the chuck table 30 rotates, and the two fluids T that are ejected from the ejection port 710 of the first two-fluid nozzle 71 to the ejection port 730 of the third two-fluid nozzle 73 and spread like a fan form the third wafer. The radial area 904 of the upper surface 903 of the workpiece 90 is thoroughly and adequately cleaned to properly wash off deposits such as fine grinding debris adhering to the entire upper surface 903 .

The two-fluid nozzles provided in the grinding apparatus 1 are not limited to the first two-fluid nozzle 71 to the third two-fluid nozzle 73 shown in FIGS. For example, a rectangular slit nozzle 70 as shown in FIG. 9 may be arranged above the movement path of the chuck table 30 shown in FIG.

The slit nozzle 70 shown in FIG. 9 extends, for example, in the X-axis direction with a length equal to or longer than the radial area 904 of the workpiece 90, and has a slit-shaped injection port 700 formed on its lower surface. A cleaning water supply source 77 and an air supply source 79 communicate with the slit nozzle 70 .

1 and 2, the first two-fluid nozzle 71 to the second two-fluid nozzle 71 shown in FIGS. 9 is used instead of the two-fluid nozzle 73 of FIG.

The first control unit 81 receives the height information of the slit nozzle 70 from the height detection unit 66 shown in FIG. 1 and, as shown in FIG. The nozzle height adjustment mechanism 6 is controlled to lower or raise the slit nozzle 70 so that the injection port 700 of the slit nozzle 70 is positioned above the upper surface 903 of the height Z1 by a preset first distance L1.

In a state in which the injection port 700 of the slit nozzle 70 is positioned at a height Z2 above the upper surface 903 of the workpiece 90 held on the holding surface 302 by the first distance L1, two fluids T are injected from the injection port 700 of the slit nozzle 70. is jetted toward the upper surface 903 of the workpiece 90 in a strip shape, and the entire upper surface 903 of the rotating workpiece 90 is washed with two fluids, and grinding dust and the like are appropriately washed off.

The second workpiece 90 after grinding shown in FIG. The height of the upper surface 903 of the workpiece 90 is a height Z3 that is higher than the height Z1 of the upper surface 903 of the first workpiece 90 . 10, for example, without adjusting the height of the injection port 700 of the slit nozzle 70 according to the height value of the upper surface 903 of the workpiece 90 as in the conventional grinding apparatus, the nozzle shown in FIG. It is assumed that the second workpiece 90 is cleaned by positioning the injection port 700 of the slit nozzle 70 at the height Z2 when the height adjustment mechanism 6 cleans the first workpiece 90. is.

In this case, the distance from the height Z3 of the upper surface 903 of the second workpiece 90 to the height Z2 of the injection port 700 of the slit nozzle 70 is a predetermined appropriate first distance shown in FIG. Since it is shorter than L1, the belt-shaped two-fluid T jetted from the jetting port 700 reaches the radius area 904 of the rotating workpiece 90 with a momentum stronger than appropriate momentum. , there occurs a place where the two fluids T bounce off the upper surface 903 . Therefore, cleaning of the upper surface 903 of the workpiece 90 becomes insufficient.

In order to prevent such inappropriate cleaning from occurring, in the grinding apparatus 1 according to the present invention, the first control unit 81 shown in FIG. While receiving information on the height Z3 of the upper surface 903 and information sent from the reader 662 of the height detection unit 66 shown in FIG. is raised from the illustrated state and positioned at a height Z4, and the distance between the upper surface 903 of the second workpiece 90 held on the holding surface 302 and the injection port 700 of the slit nozzle 70 is adjusted to a predetermined value. After setting the first distance L1, the upper surface 903 of the workpiece 90 is properly washed with two fluids.

The third workpiece 90 after grinding shown in FIG. 11 is thinner than the planned finish thickness, and the third workpiece at the end of grinding measured by the top surface height measuring device 382 shown in FIG. The height of the upper surface 903 of the object 90 is a height Z5 that is lower than the height Z1 of the upper surface 903 of the first workpiece 90 shown in FIG. FIG. 11 shows, for example, a nozzle height adjusting mechanism without adjusting the height of the injection port 700 of the slit nozzle 70 according to the height value of the upper surface 903 of the workpiece 90 as in the conventional grinding apparatus. 6 assumes the case of cleaning the third workpiece 90 by positioning the injection port 700 of the slit nozzle 70 at the height Z2 when cleaning the first workpiece 90 shown in FIG. is.

In this case, the distance from the height Z5 of the upper surface 903 of the third workpiece 90 to the height Z2 of the injection port 700 of the slit nozzle 70 is longer than the predetermined appropriate first distance L1. Therefore, the belt-shaped two-fluid T jetted from the jetting port 700 reaches the radius area 904 of the rotating workpiece 90 with less momentum than the appropriate momentum, so that the upper surface 903 of the workpiece 90 is washed. is insufficient.

In order to prevent such inappropriate cleaning from occurring, in the grinding apparatus 1 according to the present invention, the first control unit 81 shown in FIG. While receiving information on the height Z3 of the upper surface 903 and information sent from the reader 662 of the height detection unit 66 shown in FIG. is lowered from the illustrated state and positioned at a height Z6, and the distance between the upper surface 903 of the third workpiece 90 held on the holding surface 302 and the injection port 700 of the slit nozzle 70 is adjusted to a predetermined value. After setting the first distance L1, the upper surface 903 of the workpiece 90 is properly washed with two fluids.

For example, grinding chips may adhere to the holding surface 302 of the chuck table 30 shown in FIG. In some cases, the grinding failure of the workpiece 90 may occur. Therefore, the holding surface 302 is ground by the grinding wheel 541 so that the holding surface 302 is parallel to the lower surface of the grinding wheel 541, and self-grinding is performed in which the workpiece 90 is adjusted to an optimum state for grinding to a uniform thickness. Before self-grinding, the grinding wheel 54 for grinding the workpiece 90 may be removed and replaced with another grinding wheel suitable for grinding the holding surface 302 .

Specifically, self-grinding is performed at an appropriate timing or the like after the grinding of a certain workpiece 90 is finished and before the next new workpiece 90 is sucked and held by the chuck table 30 . The chuck table 30, which does not hold the workpiece 90, moves below the grinding mechanism 5, and the center of rotation of the grinding wheel 541 is horizontally displaced from the center of rotation of the workpiece 90 by a predetermined distance. The rotation locus of the grinding wheel 541 is positioned so as to pass through the center of rotation of the chuck table 30 .

The grinding wheel 541 descending while rotating comes into contact with the holding surface 302 of the rotating chuck table 30 , and grinds the entire holding surface 302 . Grinding water passing through a flow path (not shown) is supplied to the contact portion between the grinding wheel 541 and the holding surface 302 to cool the contact portion. During self-grinding, the height of the holding surface 302 is measured by the upper surface height measuring device 382 or the holding surface height measuring device 381 shown in FIG. 1, for example. Then, after self-grinding is performed for a predetermined time and the holding surface 302 is adjusted to an optimum state, the grinding wheel 541 is separated from the holding surface 302 .

In the grinding apparatus 1 according to the present invention, information about the height Z7 of the holding surface 302 shown in FIG. Information about the height Z7 of the holding surface 302 at the end of self-grinding is sent to the control unit 8 and stored. Note that the measured value of the upper surface height measuring device 382 and the measured value of the holding surface height measuring device 381 are the same value, and the height Z7 after self-grinding is lower than the height of the holding surface 302 before self-grinding. .

Next, the self-grinded chuck table 30 moves in the -Y direction, and as shown in FIG. is positioned, and a second two-fluid nozzle 72 and a third two-fluid nozzle 73 are positioned along the radius of the retaining surface 302 and above it.

When measurement information is sent to the control unit 8 from the upper surface height measuring device 382 shown in FIG. Alternatively, when measurement information is sent to the control unit 8 from the holding surface height measuring device 381 shown in FIG. do.

The storage medium of the control unit 8 stores in advance the second distance L2 shown in FIG. It is The second distance L2 is a value selected experimentally, empirically, or theoretically. It is a distance that can be washed to Note that the second distance L2 may be the same value as the first distance L1.

In this embodiment, the height detection unit 66 shown in FIG. Information is sent to the second control unit 82 or the third control unit 83 . The second control unit 82 or the third control unit 83 that has received the information controls the injection port 710 of the first two-fluid nozzle 71 to the third two-fluid nozzle 71 at the height Z8 above the holding surface 302 by the second distance L2. The nozzle height adjustment mechanism 6 is controlled to lower and position the first two-fluid nozzle 71 to the third two-fluid nozzle 73 so that the injection port 730 of the fluid nozzle 73 is positioned.

In the state where the positioning is performed, the two-fluid T is jetted toward the holding surface 302 from the jet port 710 of the first two-fluid nozzle 71 to the jet port 730 of the third two-fluid nozzle 73 . Then, the entire rotating holding surface 302 is appropriately washed by the two fluids T. As shown in FIG.
After the two-fluid cleaning of the holding surface 302 is performed for a predetermined time, the injection of the two fluids T onto the holding surface 302 is stopped, and the holding surface 302 is air-dried or spin-dried.

It goes without saying that the grinding apparatus 1 according to the present invention is not limited to the above embodiment, and may be implemented in various forms within the scope of the technical idea. In addition, the configuration of each part of the grinding apparatus 1, the cleaning process of the upper surface 903 of the workpiece 90, the cleaning process of the holding surface 302 after self-grinding, etc. shown in the accompanying drawings are not limited thereto, and the present invention is not limited to this. It can be appropriately changed within the range where the effect of can be exhibited.

FIG. 13 shows an example of a processing device 19 having a spinner cleaning mechanism 2. As shown in FIG. The processing device 19 is, for example, a fully automatic grinding device 19, and parts configured in the same manner as the grinding device 1 of FIG. 1 are given the same reference numerals as in FIG.

The front side (-Y direction side) of the base 190 of the grinding device 19 is a loading/unloading area where the workpiece 90 is loaded/unloaded to/from the chuck table 30. direction side) is a processing area in which the grinding mechanism 5, which is a processing mechanism, grinds the workpiece 90 held on the chuck table 30. As shown in FIG.

A first cassette stage 150 and a second cassette stage 151 are provided on the front side (−Y direction side) of the base 190. A plurality of workpieces 90 to be processed are mounted on the first cassette stage 150. A first cassette 157 is placed on the second cassette stage 151, and a second cassette 158 is placed on the second cassette stage 151. A second cassette 158 is placed on the second cassette stage 151. be.

Behind the opening of the first cassette 157 in the +Y direction is a robot that unloads the unprocessed workpiece 90 from the first cassette 157 and loads the processed workpiece 90 into the second cassette 158. 154 are provided.

A temporary placement area 152 is provided at a position adjacent to the robot 154 , and an alignment unit 153 is arranged in the temporary placement area 152 . The alignment unit 153 aligns (centers) the unprocessed workpiece 90 unloaded from the first cassette 157 and placed on the temporary placement area 152 at a predetermined position with a diameter-reduced alignment pin.

As shown in FIG. 13, near the temporary placement area 152, a loading arm 161 configured by a suction pad or the like and configured to load the workpiece 90 onto the chuck table 30 is arranged. Next to the carry-in arm 161, a carrying mechanism 162, which is a carry-out arm for carrying the workpiece 90 out from the chuck table 30 and carrying the workpiece 90 to the spinner cleaning mechanism 13, is arranged. The conveying mechanism 162 is capable of holding the workpiece 90 by suction with a suction pad, and turning and moving the workpiece 90 within a horizontal plane.

As shown in FIG. 1, a single-wafer spinner cleaning mechanism 2 that cleans the upper surface 903 of the processed workpiece 90 transported by the transport mechanism 162 is arranged at a position close to the transport mechanism 162 . The spinner cleaning mechanism 2 for cleaning the upper surface 903 of the workpiece 90 ground by the grinding wheel 54 includes a spinner holding mechanism 20 that holds the workpiece 90 and rotates around the center 902 of the workpiece 90, a spinner A spinner two-fluid nozzle for ejecting a two-fluid mixture of water and air from a spinner nozzle onto the upper surface 903 of the workpiece 90 held by the holding mechanism 20, and a spinner nozzle for adjusting the height of the spinner two-fluid nozzle. A height adjustment mechanism 22 is provided.
The workpiece 90 cleaned and dried by the spinner cleaning mechanism 2 is carried into the second cassette 158 by the robot 154 .

For example, the spinner two-fluid nozzles are the first spinner two-fluid nozzle 211, the second spinner two-fluid nozzle 212, and the third spinner two-fluid nozzle 213, and the first spinner two-fluid nozzle described above with reference to FIG. It has the same structure as the two-fluid nozzle 71 to the third two-fluid nozzle 73 .

The spinner holding mechanism 20 can suck and hold the workpiece 90 on a spinner table 201 which is made of a porous member or the like and has a flat spinner holding surface 200 . A rotation shaft 202 whose axial direction is the Z-axis direction and which can be rotated by a spinner motor 203 (see FIG. 15) is connected to the lower surface of the spinner table 201 . The spinner table 201 may be an edge clamp spinner table capable of clamping the annular frame when the workpiece 90 is supported by the annular frame.

The spinner nozzle height adjusting mechanism 22 arranged on a column 193 erected on the side of the spinner holding mechanism 20 shown in FIG. 13 has the same structure as the nozzle height adjusting mechanism 6 previously described with reference to FIG. It has That is, when the motor 222 rotates the ball screw 220, the elevating block 223 is guided by the guide rails 221 and reciprocates in the Z-axis direction. The first spinner two-fluid nozzle 211 to the third spinner two-fluid nozzle 213 housed inside also move up and down in the Z-axis direction.

For example, the spinner nozzle height adjustment mechanism 22 includes a height detector 24 having a reader 242 that optically reads the graduations of a scale 240 extending in the Z-axis direction. The height detector 24 may read the heights of the first to third spinner two-fluid nozzles 211 to 213 using an encoder 227 connected to the rotating shaft of the motor 222 instead of the scale 240. good.

The third spinner two-fluid nozzle 213 shown in FIG. 13 aligns the center of each other with the spinner holding surface 200 of the spinner table 201 and is sucked and held at the center 902 of the workpiece 90 in the Z-axis direction. 216 are opposed to each other, and evenly spaced radially outward of the workpiece 90, a second spinner two-fluid nozzle 212 and a first spinner two-fluid nozzle 211 are arranged in turn with respective spinner jets 215 and spinner nozzles 215 and 216, respectively. The injection port 214 is arranged so as to face the upper surface 903 of the workpiece 90 .

A cleaning water supply source 77 communicates with the upper side of the first spinner two-fluid nozzle 211 to the third spinner two-fluid nozzle 213 through a water pipe 76 . An air supply source 79 communicates with the upper side of the first spinner two-fluid nozzle 211 to the third spinner two-fluid nozzle 213 through a pipe 78 .

For example, the control unit 8 that controls the entire apparatus includes a spinner control section 84 . Then, the spinner control unit 84 determines the distance (for example, the 15 is provided with a setting unit 840 for presetting the distance L11).

As shown in FIG. 13, the chuck table 30 is reciprocally movable on the base 190 in the Y-axis direction by a table feed mechanism 37 arranged therebelow. In the table feed mechanism 37, when the motor 372 rotates the ball screw 370, the movable plate 373 is guided by the guide rail 371 and linearly moves in the Y-axis direction. The arranged chuck table 30 can be linearly moved in the Y-axis direction.

A processing mechanism 5, which has a grinding wheel 54 as a processing tool shown in FIG. is similar to
The processing mechanism 5 may be a polishing mechanism having a polishing pad as a processing tool. Moreover, the machining mechanism 5 may be a tool cutting mechanism having a cutting tool as a machining tool.

Further, as shown in FIG. 13, the grinding device 19 also includes a first two-fluid nozzle 71 to a third two-fluid nozzle 73, and similarly to the grinding device 1 shown in FIG. The upper surface 903 of the workpiece 90 held by suction on the surface 302 can also be washed with two fluids.

The operation of the grinding device 19 shown in FIG. 13 when grinding the workpiece 90 held on the chuck table 30 will be described below. First, the robot 154 pulls out the workpiece 90 from the first cassette 157 and moves the workpiece 90 to the temporary placement area 152 . The workpiece 90 is then centered on the temporary placement area 152 by the alignment unit 153 . A protective tape 92 is attached to the lower surface 900 of the workpiece 90 .

The carry-in arm 161 sucks and holds the upper surface 903 of the workpiece 90, conveys it onto the chuck table 30, and aligns the workpiece 90 so that the holding surface 302 of the chuck table 30 and the center of the workpiece 90 substantially match each other. Then, the workpiece 90 is suction-held on the chuck table 30 .

Thereafter, the workpiece 90 is ground by the grinding mechanism 5 . During grinding, the thickness measurement unit 38 shown in FIG. height) is measured, the height of the upper surface 903 of the workpiece 90 is measured by the upper surface height measuring device 382, and the thickness of the workpiece 90 is calculated by calculating the difference between the two measured values by the calculator 383. Measure sequentially during grinding. After the workpiece 90 has been ground to a desired thickness, the grinding mechanism 5 shown in FIG. 13 is lifted, the grinding wheel 541 is separated from the workpiece 90, and grinding is completed. Here, in the grinding apparatus 19 according to the present invention, the thickness value of the workpiece 90 at the end of grinding measured by the thickness measuring unit 38 (in this embodiment, the thickness value is the thickness value including the thickness of the protective tape 92, For example, thickness value L10 shown in FIG. 14) is sent to the spinner control section 84 of the control unit 8 and stored.

Next, the chuck table 30 shown in FIG. 13, which sucks and holds the workpiece 90 that has been ground, is moved in the −Y direction and positioned in the vicinity of the transport mechanism 162 . Then, the workpiece 90 sucked and held by the transport mechanism 162 is transported to the spinner cleaning mechanism 2 .
The workpiece 90 is sucked and held on the spinner table 201 in a state in which their centers are substantially aligned with each other, and the conveying mechanism 162 is separated from the workpiece 90 .

For example, the heights of the spinner jet port 214 of the first spinner two-fluid nozzle 211 to the spinner jet port 216 of the third spinner two-fluid nozzle 213 indicated by dashed lines in FIG. ing. The distance between the spinner holding surface 200, which is the surface to be cleaned before holding the workpiece 90 by suction, and the spinner injection port 214 of the first spinner two-fluid nozzle 211 to the spinner injection port 216 of the third spinner two-fluid nozzle 213. is set in the setting unit 840 and is a distance suitable for cleaning the spinner holding surface 200 (for example, the distance L11).
In this way, the distance between the spinner holding surface 200 and the spinner jet port 214 of the first spinner two-fluid nozzle 211 to the spinner jet port 216 of the third spinner two-fluid nozzle 213 is set to the distance L11, and the workpiece is The spinner holding surface 200 that does not hold 90 may be cleaned.

As shown in FIG. 15, the workpiece 90 after grinding is sucked and held on the spinner holding surface 200, so that the surface to be cleaned by the spinner two-fluid nozzles 211 to 213 becomes the spinner holding surface. 200 switches to the top surface 903 of the workpiece 90 . Then, the spinner control unit 84 determines the upper surface of the workpiece 90 held on the spinner table 201 based on the distance L11 set in the setting unit 840 and the thickness value L10 of the workpiece 90 after grinding measured by the thickness measurement unit 38 . Adjust the spinner nozzle height so that the distance between 903 and the spinner injection port 214 of the first spinner two-fluid nozzle 211 to the spinner injection port 216 of the third spinner two-fluid nozzle 213 becomes a preset third distance L13. Control mechanism 22 .
Note that the third distance L13 is the same distance as the distance L11 in this embodiment.

The specific control of the spinner nozzle height adjustment mechanism 22 is that the distance L11 set in the setting unit 840 is the same distance as the third distance L13 in this embodiment, so that the workpiece 90 is positioned on the spinner table 201. The spinner injection port 214 of the first spinner two-fluid nozzle 211 to the spinner injection port 216 of the third spinner two-fluid nozzle 213 located at the origin height Z12 immediately after being sucked and held are moved by the thickness value L10 of the workpiece 90. raise. For example, an operation signal is supplied to the motor 222 from the spinner control unit 84 that is electrically connected to the motor 222 of the spinner nozzle height adjustment mechanism 22 and also functions as a servo amplifier via a wired or wireless communication path. Then, the rotation speed of the motor 222 detected by the encoder 227 is output to the input interface of the spinner control section 84 as an encoder signal. Then, the spinner control unit 84, which receives the rotation speed of the motor 222 as an encoder signal, performs feedback control to accurately control the lift distance of the first spinner two-fluid nozzle 211 to the third spinner two-fluid nozzle 213. The spinner injection port 214 of the first spinner two-fluid nozzle 211 to the spinner injection port 216 of the third spinner two-fluid nozzle 213 located at Z12 are replaced with a third nozzle suitable for two-fluid cleaning of the upper surface 903 of the workpiece 90. It is positioned at a height Z13 that is the distance L13 (the same distance as the distance L11 in this embodiment).
The spinner nozzle height adjustment mechanism 22 may be controlled using height detection information from the height detection unit 24 shown in FIG. 13 .

In the state where the above positioning is performed, the two fluids are directed from the spinner injection port 214 of the first spinner two-fluid nozzle 211 to the spinner injection port 216 of the third spinner two-fluid nozzle 213 toward the upper surface 903 of the workpiece 90. be jetted. Then, the entire upper surface 903 of the rotating workpiece 90 is appropriately washed with the two fluids.
After the two-fluid cleaning is performed for a predetermined time, the workpiece 90 is washed with at least the third spinner nozzle among the spinner nozzles 214 of the first spinner two-fluid nozzle 211 to the spinner nozzle 216 of the third spinner two-fluid nozzle 213. Air drying, in which only air is jetted from the spinner nozzle 216 of the spinner two-fluid nozzle 213 for drying, or spin drying, in which the spinner table 201 is rotated at a higher speed than during cleaning, is performed. 13 unloads the workpiece 90 after two-fluid cleaning from the spinner cleaning mechanism 2 and carries it into the second cassette 158 .

1: Grinding device 10: Base 11: Column 17: Grinding feed unit 170: Ball screw 172: Motor
30: Chuck table 300: Porous member 301: Frame 302: Holding surface 38: Thickness measuring unit 381: Holding surface height measuring device 382: Upper surface height measuring device 383: Calculation part 39: Cover 390: Bellows cover 5: Grinding Mechanism 50: Rotating shaft 54: Grinding wheel 541: Grinding wheel
6: Nozzle height adjustment mechanism 60: Ball screw 61: Guide rail 62: Motor 63: Elevating block 634: Connecting member 66: Height detector 660: Scale 662: Reader 70: Slit nozzle 700: Jet port 71: First 710: injection port 72: second two-fluid nozzle 720: injection port 73: third two-fluid nozzle 730: injection port 75: box 750: opening 76: water pipe 77: cleaning water supply source
78: Air piping 79: Air supply source 8: Control unit 81: First controller 82: Second controller 83: Third controller 19: Processing device (grinding device) provided with spinner cleaning mechanism 190: Base 193: Column 152: Temporary Placement Area 153: Alignment Unit 154: Robot 157: First Cassette 158: Second Cassette 161: Loading Arm 162: Transfer Mechanism 2: Spinner Cleaning Mechanism 20: Spinner Holding Mechanism 200: Spinner Holding Surface 201: Spinner table 211: First spinner two-fluid nozzle 214: Spinner injection port 212: Second spinner two-fluid nozzle 215: Spinner injection port 213: Third spinner two-fluid nozzle 216: Spinner injection port 22: Spinner nozzle height Adjustment mechanism 220: Ball screw 221: Guide rail 222: Motor 223: Elevating block 224: Connecting member 225: Box 227: Encoder 24: Height detector 84: Spinner controller 840: Setting unit 90: Work piece 903: Work piece Upper surface of object 900: Lower surface of workpiece 92: Protective tape

Claims (5)

A chuck table that holds a workpiece on a holding surface, a grinding mechanism that grinds the workpiece held on the holding surface with a grinding wheel, and a top surface height of the workpiece held on the holding surface that is measured. A grinding apparatus comprising an upper surface height measuring device and a two-fluid nozzle having an injection port for injecting a two-fluid mixture of water and air,
a nozzle height adjustment mechanism for adjusting the height of the two-fluid nozzle;
Adjusting the nozzle height based on the value measured by the upper surface height measuring device so that the distance between the upper surface of the workpiece held by the holding surface and the injection port is a preset first distance. and a first control unit that controls the mechanism. measuring the height of the holding surface with the upper surface height measuring device;
a second control unit for controlling the nozzle height adjustment mechanism so that the distance between the holding surface and the injection port is a second distance set in advance based on the value measured by the upper surface height measuring device; 2. The grinding apparatus of claim 1, comprising: a holding surface height measuring device for measuring the height of the holding surface;
A third control unit that controls the nozzle height adjustment mechanism so that the distance between the holding surface and the injection port is a preset second distance based on the value measured by the holding surface height measuring device. The grinding apparatus of claim 1, comprising: 4. A grinding apparatus according to claim 1, wherein a plurality of said two-fluid nozzles are arranged so as to correspond to the radial area of the workpiece held on said holding surface. A chuck table that holds a workpiece on a holding surface, a machining mechanism that has a processing tool and processes the upper surface of the workpiece held on the holding surface to reduce the thickness, and a workpiece held on the holding surface. a thickness measuring unit for measuring the thickness of an object;
A processing apparatus comprising: a spinner cleaning mechanism for cleaning the upper surface of a workpiece machined by the machining tool; a transport mechanism for transporting the workpiece from the chuck table to the spinner cleaning mechanism; and a spinner control unit. ,
The thickness measuring unit includes a top surface height measuring device for measuring the top surface height of the workpiece held on the holding surface, a holding surface height measuring device for measuring the height of the holding surface, and the top surface height. a calculator that calculates the difference between the value of the height measuring device and the value of the holding surface height measuring device as the thickness of the workpiece,
The spinner cleaning mechanism includes a spinner holding mechanism that holds a workpiece and rotates around the center of the workpiece, and water and air are mixed on the upper surface of the workpiece held by the spinner holding mechanism. a spinner two-fluid nozzle for injecting two fluids from a spinner orifice; and a spinner nozzle height adjustment mechanism for adjusting the height of the spinner two-fluid nozzle,
The spinner control unit has a setting unit that presets a distance suitable for cleaning between the surface to be cleaned and the spinner injection port. The spinner nozzle height adjusting mechanism is controlled such that the distance between the upper surface of the workpiece held by the holding mechanism and the spinner nozzle is a preset third distance, and the spinner nozzle is held by the spinner holding mechanism. A processing device that cleans the upper surface of a workpiece.

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