DE10136281B4 - Vorrichtung zum Polieren abgeschrägter Umfangsteile eines Wafers - Google Patents

Vorrichtung zum Polieren abgeschrägter Umfangsteile eines Wafers Download PDF

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Publication number
DE10136281B4
DE10136281B4 DE2001136281 DE10136281A DE10136281B4 DE 10136281 B4 DE10136281 B4 DE 10136281B4 DE 2001136281 DE2001136281 DE 2001136281 DE 10136281 A DE10136281 A DE 10136281A DE 10136281 B4 DE10136281 B4 DE 10136281B4
Authority
DE
Germany
Prior art keywords
polishing
round object
round
wafer
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE2001136281
Other languages
German (de)
English (en)
Other versions
DE10136281A1 (de
Inventor
Shunji Hakomori
Seiichi Maeda
Noriaki Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Publication of DE10136281A1 publication Critical patent/DE10136281A1/de
Application granted granted Critical
Publication of DE10136281B4 publication Critical patent/DE10136281B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE2001136281 2000-07-26 2001-07-25 Vorrichtung zum Polieren abgeschrägter Umfangsteile eines Wafers Expired - Fee Related DE10136281B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000-225441 2000-07-26
JP2000225441A JP2002036079A (ja) 2000-07-26 2000-07-26 被研磨物の研磨方法及び研磨装置

Publications (2)

Publication Number Publication Date
DE10136281A1 DE10136281A1 (de) 2002-04-25
DE10136281B4 true DE10136281B4 (de) 2007-06-28

Family

ID=18719212

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2001136281 Expired - Fee Related DE10136281B4 (de) 2000-07-26 2001-07-25 Vorrichtung zum Polieren abgeschrägter Umfangsteile eines Wafers

Country Status (2)

Country Link
JP (1) JP2002036079A (https=)
DE (1) DE10136281B4 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4826013B2 (ja) * 2000-12-21 2011-11-30 株式会社ニコン 研磨装置、半導体ウェハの研磨方法、半導体デバイスの製造方法及び製造装置
WO2002049802A1 (fr) * 2000-12-21 2002-06-27 Nikon Corporation Dispositif et procede de polissage, et procede et dispositif pour produire un dispositif a semiconducteurs
JP4655369B2 (ja) * 2000-12-25 2011-03-23 株式会社ニコン 研磨装置、研磨方法及び半導体デバイスの製造方法
JP5033066B2 (ja) * 2008-06-13 2012-09-26 株式会社Bbs金明 ワーク外周部の研磨装置および研磨方法
CN115229602A (zh) * 2022-09-22 2022-10-25 苏州恒嘉晶体材料有限公司 一种圆片倒角磨削机构及使用方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0544256A1 (en) * 1991-11-28 1993-06-02 Tokyo Seimitsu Co.,Ltd. Method of chamfering semiconductor wafer
DE4440867A1 (de) * 1993-11-16 1995-05-18 Tokyo Seimitsu Co Ltd Scheiben-Anfasmaschine
DE19809697C2 (de) * 1998-03-06 1999-12-23 Thuringia Netzsch Feinkeramik Werkzeug zum Schleifen und Polieren rotationssymmetrischer Ränder hohler keramischer Gegenstände wie Tassen und dergl.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0544256A1 (en) * 1991-11-28 1993-06-02 Tokyo Seimitsu Co.,Ltd. Method of chamfering semiconductor wafer
DE4440867A1 (de) * 1993-11-16 1995-05-18 Tokyo Seimitsu Co Ltd Scheiben-Anfasmaschine
DE19809697C2 (de) * 1998-03-06 1999-12-23 Thuringia Netzsch Feinkeramik Werkzeug zum Schleifen und Polieren rotationssymmetrischer Ränder hohler keramischer Gegenstände wie Tassen und dergl.

Also Published As

Publication number Publication date
DE10136281A1 (de) 2002-04-25
JP2002036079A (ja) 2002-02-05

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Legal Events

Date Code Title Description
8128 New person/name/address of the agent

Representative=s name: KEHL & ETTMAYR, PATENTANWAELTE, 81679 MUENCHEN

8110 Request for examination paragraph 44
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20120201