AU2001286972A1 - Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby - Google Patents
Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced therebyInfo
- Publication number
- AU2001286972A1 AU2001286972A1 AU2001286972A AU8697201A AU2001286972A1 AU 2001286972 A1 AU2001286972 A1 AU 2001286972A1 AU 2001286972 A AU2001286972 A AU 2001286972A AU 8697201 A AU8697201 A AU 8697201A AU 2001286972 A1 AU2001286972 A1 AU 2001286972A1
- Authority
- AU
- Australia
- Prior art keywords
- cmp
- head
- semiconductor wafer
- mechanical polishing
- chemical mechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000126 substance Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US65363600A | 2000-08-31 | 2000-08-31 | |
US65296300A | 2000-08-31 | 2000-08-31 | |
US09/652,854 | 2000-08-31 | ||
US09/652,855 US6527625B1 (en) | 2000-08-31 | 2000-08-31 | Chemical mechanical polishing apparatus and method having a soft backed polishing head |
US09/653,636 | 2000-08-31 | ||
US09/652,855 | 2000-08-31 | ||
US09/652,963 | 2000-08-31 | ||
US09/652,854 US6540590B1 (en) | 2000-08-31 | 2000-08-31 | Chemical mechanical polishing apparatus and method having a rotating retaining ring |
PCT/US2001/027151 WO2002018101A2 (en) | 2000-08-31 | 2001-08-30 | Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001286972A1 true AU2001286972A1 (en) | 2002-03-13 |
Family
ID=27505281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001286972A Abandoned AU2001286972A1 (en) | 2000-08-31 | 2001-08-30 | Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP2004518270A (en) |
KR (1) | KR100920709B1 (en) |
AU (1) | AU2001286972A1 (en) |
TW (1) | TWI246448B (en) |
WO (1) | WO2002018101A2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7507148B2 (en) * | 2002-09-27 | 2009-03-24 | Sumco Techxiv Corporation | Polishing apparatus, polishing head and polishing method |
KR100752181B1 (en) * | 2005-10-05 | 2007-08-24 | 동부일렉트로닉스 주식회사 | Chemical Mechanical polishing Apparatus |
US7267610B1 (en) * | 2006-08-30 | 2007-09-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having unevenly spaced grooves |
US8460067B2 (en) * | 2009-05-14 | 2013-06-11 | Applied Materials, Inc. | Polishing head zone boundary smoothing |
US9610672B2 (en) * | 2014-06-27 | 2017-04-04 | Applied Materials, Inc. | Configurable pressure design for multizone chemical mechanical planarization polishing head |
TWI574778B (en) * | 2015-02-11 | 2017-03-21 | 國立勤益科技大學 | Polishing machine |
US10283396B2 (en) * | 2016-06-27 | 2019-05-07 | Asm Nexx, Inc. | Workpiece holder for a wet processing system |
CN107214614A (en) * | 2017-07-25 | 2017-09-29 | 蒋南 | A kind of automatic saw blade polishing machine |
JP7113626B2 (en) * | 2018-01-12 | 2022-08-05 | ニッタ・デュポン株式会社 | polishing pad |
US20200055160A1 (en) * | 2018-08-14 | 2020-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing method and apparatus |
WO2020203639A1 (en) * | 2019-04-03 | 2020-10-08 | 株式会社クラレ | Polishing pad |
CN114905386A (en) * | 2021-02-01 | 2022-08-16 | 中国石油化工股份有限公司 | Pendant pretreatment device and method suitable for uniform corrosion rate test |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5020283A (en) * | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
JP2944176B2 (en) * | 1990-09-19 | 1999-08-30 | 三菱マテリアル株式会社 | Ultra-precision polishing method and polishing apparatus for wafer |
US5584746A (en) * | 1993-10-18 | 1996-12-17 | Shin-Etsu Handotai Co., Ltd. | Method of polishing semiconductor wafers and apparatus therefor |
US5624299A (en) * | 1993-12-27 | 1997-04-29 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved carrier and method of use |
JPH08267357A (en) * | 1995-03-31 | 1996-10-15 | Nec Corp | Abrasive device of substrate and abrasive method thereof |
US6024630A (en) * | 1995-06-09 | 2000-02-15 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
JP2708022B2 (en) * | 1995-08-21 | 1998-02-04 | 日本電気株式会社 | Polishing equipment |
JP3106418B2 (en) * | 1996-07-30 | 2000-11-06 | 株式会社東京精密 | Polishing equipment |
JPH10156712A (en) * | 1996-11-29 | 1998-06-16 | Oki Electric Ind Co Ltd | Wafer polishing device |
JP3183204B2 (en) * | 1997-01-08 | 2001-07-09 | 三菱マテリアル株式会社 | Wafer polishing equipment |
US5851140A (en) * | 1997-02-13 | 1998-12-22 | Integrated Process Equipment Corp. | Semiconductor wafer polishing apparatus with a flexible carrier plate |
US6056632A (en) * | 1997-02-13 | 2000-05-02 | Speedfam-Ipec Corp. | Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
JP2897207B1 (en) * | 1997-04-04 | 1999-05-31 | 株式会社東京精密 | Polishing equipment |
US5921855A (en) * | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
JPH10315126A (en) * | 1997-05-16 | 1998-12-02 | Tokyo Seimitsu Co Ltd | Grinding method and device using distributor ring |
US6007411A (en) * | 1997-06-19 | 1999-12-28 | Interantional Business Machines Corporation | Wafer carrier for chemical mechanical polishing |
JP3006568B2 (en) * | 1997-12-04 | 2000-02-07 | 日本電気株式会社 | Wafer polishing apparatus and polishing method |
JPH11226865A (en) * | 1997-12-11 | 1999-08-24 | Speedfam Co Ltd | Carrier and cmp device |
US6093651A (en) * | 1997-12-23 | 2000-07-25 | Intel Corporation | Polish pad with non-uniform groove depth to improve wafer polish rate uniformity |
US5993302A (en) * | 1997-12-31 | 1999-11-30 | Applied Materials, Inc. | Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus |
JPH11216663A (en) * | 1998-02-03 | 1999-08-10 | Sony Corp | Grinding pad, grinding apparatus and grinding method |
KR100550034B1 (en) * | 1998-04-06 | 2006-02-08 | 가부시키가이샤 에바라 세이사꾸쇼 | Polishing device |
KR20000025003A (en) * | 1998-10-07 | 2000-05-06 | 윤종용 | Polishing pad used for chemical and mechanical polishing of semiconductor substrate |
US6110012A (en) * | 1998-12-24 | 2000-08-29 | Lucent Technologies Inc. | Chemical-mechanical polishing apparatus and method |
US6368189B1 (en) * | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
US6225224B1 (en) * | 1999-05-19 | 2001-05-01 | Infineon Technologies Norht America Corp. | System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer |
JP2001298006A (en) * | 2000-04-17 | 2001-10-26 | Ebara Corp | Polishing device |
CN1179821C (en) * | 2000-05-12 | 2004-12-15 | 多平面技术公司 | Pneumatic diaphragm head having independent retaining ring and multi-region pressure control, and method to use the same |
US6409579B1 (en) * | 2000-05-31 | 2002-06-25 | Koninklijke Philips Electronics N.V. | Method and apparatus for conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish |
JP2002046061A (en) * | 2000-07-31 | 2002-02-12 | Mitsubishi Materials Corp | Polishing head |
-
2001
- 2001-08-23 TW TW090120699A patent/TWI246448B/en not_active IP Right Cessation
- 2001-08-30 KR KR1020037003077A patent/KR100920709B1/en active IP Right Grant
- 2001-08-30 WO PCT/US2001/027151 patent/WO2002018101A2/en active Search and Examination
- 2001-08-30 JP JP2002523058A patent/JP2004518270A/en not_active Withdrawn
- 2001-08-30 AU AU2001286972A patent/AU2001286972A1/en not_active Abandoned
-
2012
- 2012-04-04 JP JP2012085828A patent/JP5562370B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2012151501A (en) | 2012-08-09 |
JP5562370B2 (en) | 2014-07-30 |
KR20030064393A (en) | 2003-07-31 |
KR100920709B1 (en) | 2009-10-07 |
WO2002018101A2 (en) | 2002-03-07 |
WO2002018101A9 (en) | 2003-10-30 |
JP2004518270A (en) | 2004-06-17 |
TWI246448B (en) | 2006-01-01 |
WO2002018101A3 (en) | 2003-01-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU1683899A (en) | Abrasive, method of polishing wafer, and method of producing semiconductor device | |
SG100632A1 (en) | Polishing slurry, polishing method and processes for fabricating semiconductor devices | |
AU2002341583A1 (en) | Chemical mechanical polishing tool, apparatus and method | |
AU2002229023A1 (en) | Methods, apparatus and slurries for chemical mechanical planarization | |
AU2001229403A1 (en) | System and method for controlled polishing and planarization of semiconductor wafers | |
AU2002360612A1 (en) | Apparatus and methods for controlling wafer temperature in chemical mechanical polishing | |
SG95694A1 (en) | Wafer planarization apparatus | |
EP1205965A4 (en) | Abrasive compound for cmp, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for cmp abrasive compound | |
TW349244B (en) | Method of fabricating a semiconductor device using a CMP process and a polishing apparatus for such a CMP process | |
SG102648A1 (en) | Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same | |
AU2001250876A1 (en) | Method and apparatus for planarizing a semiconductor contactor | |
EP1295680A3 (en) | Polishing pad for semiconductor wafer | |
SG116418A1 (en) | Semiconductor wafer grinding method. | |
AU2003270725A1 (en) | Polishing media for chemical mechanical planarization (cmp) | |
AU2003254825A1 (en) | Cmp abrasive and substrate polishing method | |
AU2001253180A1 (en) | A chemical-mechanical polishing system for the manufacture of semiconductor devices | |
AU2001286972A1 (en) | Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby | |
SG105536A1 (en) | Wafer planarization apparatus and planarization method thereof | |
AU2001271573A1 (en) | A conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers | |
WO2002011947A3 (en) | Method for processing a semiconductor wafer using double-side polishing | |
AU4875601A (en) | Polishing compound for polishing semiconductor device and method for manufacturing semiconductor device using the same | |
GB2361447B (en) | Wafer polishing apparatus | |
AU2002358257A1 (en) | Method and apparatus for applying downward force on wafer during cmp | |
AU2002219124A1 (en) | Method for determinating an endpoint during cmp of a semiconductor wafer | |
EP1291132A3 (en) | Semiconductor wafer polishing apparatus and polishing method |