EP1291132A3 - Semiconductor wafer polishing apparatus and polishing method - Google Patents

Semiconductor wafer polishing apparatus and polishing method Download PDF

Info

Publication number
EP1291132A3
EP1291132A3 EP02019759A EP02019759A EP1291132A3 EP 1291132 A3 EP1291132 A3 EP 1291132A3 EP 02019759 A EP02019759 A EP 02019759A EP 02019759 A EP02019759 A EP 02019759A EP 1291132 A3 EP1291132 A3 EP 1291132A3
Authority
EP
European Patent Office
Prior art keywords
semiconductor wafer
polishing
polishing apparatus
polishing method
wafer polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP02019759A
Other languages
German (de)
French (fr)
Other versions
EP1291132A2 (en
Inventor
Shunji Hakomori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Publication of EP1291132A2 publication Critical patent/EP1291132A2/en
Publication of EP1291132A3 publication Critical patent/EP1291132A3/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
EP02019759A 2001-09-06 2002-09-04 Semiconductor wafer polishing apparatus and polishing method Pending EP1291132A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001269640 2001-09-06
JP2001269640A JP2003077872A (en) 2001-09-06 2001-09-06 Semiconductor wafer polishing equipment and polishing method

Publications (2)

Publication Number Publication Date
EP1291132A2 EP1291132A2 (en) 2003-03-12
EP1291132A3 true EP1291132A3 (en) 2004-03-31

Family

ID=19095422

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02019759A Pending EP1291132A3 (en) 2001-09-06 2002-09-04 Semiconductor wafer polishing apparatus and polishing method

Country Status (3)

Country Link
EP (1) EP1291132A3 (en)
JP (1) JP2003077872A (en)
TW (1) TWI241229B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006112532A1 (en) * 2005-04-19 2006-10-26 Ebara Corporation Substrate processing apparatus
JP4849482B2 (en) * 2008-05-02 2012-01-11 スピードファム株式会社 Underwater aligner for semiconductor wafers with notches
FR2995136B1 (en) 2012-09-04 2015-06-26 Soitec Silicon On Insulator PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USE OF MONOCRYSTALLINE MATERIAL
JP6589807B2 (en) * 2016-10-13 2019-10-16 株式会社Sumco Silicon wafer polishing method, silicon wafer manufacturing method, and silicon wafer
CN109605207A (en) * 2018-12-27 2019-04-12 西安奕斯伟硅片技术有限公司 Wafer processing method and device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5769695A (en) * 1994-11-28 1998-06-23 Tokyo Seimitsu Co., Ltd. Chamfer grinding system for wafer
JP2000124172A (en) * 1998-10-19 2000-04-28 Tokyo Seimitsu Co Ltd Processing of wafer and device thereof
EP1004400A1 (en) * 1998-11-27 2000-05-31 SpeedFam- IPEC Co., Ltd. Method for polishing a notch of a wafer
EP1120191A2 (en) * 2000-01-28 2001-08-01 TSK America, Inc. Wafer processing machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5769695A (en) * 1994-11-28 1998-06-23 Tokyo Seimitsu Co., Ltd. Chamfer grinding system for wafer
JP2000124172A (en) * 1998-10-19 2000-04-28 Tokyo Seimitsu Co Ltd Processing of wafer and device thereof
EP1004400A1 (en) * 1998-11-27 2000-05-31 SpeedFam- IPEC Co., Ltd. Method for polishing a notch of a wafer
EP1120191A2 (en) * 2000-01-28 2001-08-01 TSK America, Inc. Wafer processing machine

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 07 29 September 2000 (2000-09-29) *

Also Published As

Publication number Publication date
EP1291132A2 (en) 2003-03-12
JP2003077872A (en) 2003-03-14
TWI241229B (en) 2005-10-11

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