JP2002026113A - ホットプレート及び半導体装置の製造方法 - Google Patents

ホットプレート及び半導体装置の製造方法

Info

Publication number
JP2002026113A
JP2002026113A JP2000208355A JP2000208355A JP2002026113A JP 2002026113 A JP2002026113 A JP 2002026113A JP 2000208355 A JP2000208355 A JP 2000208355A JP 2000208355 A JP2000208355 A JP 2000208355A JP 2002026113 A JP2002026113 A JP 2002026113A
Authority
JP
Japan
Prior art keywords
hot plate
wafer
voltage
semiconductor substrate
electrostatic chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000208355A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002026113A5 (enExample
Inventor
Tomio Katada
富夫 堅田
Junichi Wada
純一 和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2000208355A priority Critical patent/JP2002026113A/ja
Priority to TW090116747A priority patent/TW498420B/zh
Priority to US09/901,029 priority patent/US6500686B2/en
Priority to CNB011259523A priority patent/CN1197125C/zh
Priority to KR10-2001-0041066A priority patent/KR100437977B1/ko
Publication of JP2002026113A publication Critical patent/JP2002026113A/ja
Publication of JP2002026113A5 publication Critical patent/JP2002026113A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Surface Heating Bodies (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP2000208355A 2000-07-10 2000-07-10 ホットプレート及び半導体装置の製造方法 Pending JP2002026113A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000208355A JP2002026113A (ja) 2000-07-10 2000-07-10 ホットプレート及び半導体装置の製造方法
TW090116747A TW498420B (en) 2000-07-10 2001-07-09 Hot plate and manufacture method of semiconductor device
US09/901,029 US6500686B2 (en) 2000-07-10 2001-07-10 Hot plate and method of manufacturing semiconductor device
CNB011259523A CN1197125C (zh) 2000-07-10 2001-07-10 热板及半导体装置的制造方法
KR10-2001-0041066A KR100437977B1 (ko) 2000-07-10 2001-07-10 핫 플레이트 및 반도체 장치의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000208355A JP2002026113A (ja) 2000-07-10 2000-07-10 ホットプレート及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2002026113A true JP2002026113A (ja) 2002-01-25
JP2002026113A5 JP2002026113A5 (enExample) 2005-08-25

Family

ID=18704947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000208355A Pending JP2002026113A (ja) 2000-07-10 2000-07-10 ホットプレート及び半導体装置の製造方法

Country Status (5)

Country Link
US (1) US6500686B2 (enExample)
JP (1) JP2002026113A (enExample)
KR (1) KR100437977B1 (enExample)
CN (1) CN1197125C (enExample)
TW (1) TW498420B (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047912A (ja) * 2002-07-16 2004-02-12 Ulvac Japan Ltd 吸着装置及び真空処理装置
WO2005091356A1 (ja) * 2004-03-19 2005-09-29 Creative Technology Corporation 双極型静電チャック
JP2006060117A (ja) * 2004-08-23 2006-03-02 Dainippon Screen Mfg Co Ltd 熱処理装置
JP2012209477A (ja) * 2011-03-30 2012-10-25 Tokyo Electron Ltd 温度制御方法及びプラズマ処理システム
JP2013539913A (ja) * 2010-09-17 2013-10-28 ラム リサーチ コーポレーション リフトピンを用いた静電デチャックのための極性領域
JP2014195009A (ja) * 2013-03-29 2014-10-09 Hitachi High-Technologies Corp プラズマ処理装置およびプラズマ処理方法
WO2020044843A1 (ja) * 2018-08-30 2020-03-05 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法
JP2022154252A (ja) * 2021-03-30 2022-10-13 住友大阪セメント株式会社 静電チャック部材及び静電チャック装置
JP2024519841A (ja) * 2021-05-19 2024-05-21 アプライド マテリアルズ インコーポレイテッド 端面不均一性チューニングのための低インピーダンス電流経路

Families Citing this family (29)

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US7479456B2 (en) 2004-08-26 2009-01-20 Applied Materials, Inc. Gasless high voltage high contact force wafer contact-cooling electrostatic chuck
JP2003115442A (ja) * 2001-10-04 2003-04-18 Nikon Corp 荷電粒子線露光装置におけるレチクル又はウエハの静電チャック方法
US6734117B2 (en) * 2002-03-12 2004-05-11 Nikon Corporation Periodic clamping method and apparatus to reduce thermal stress in a wafer
KR100573351B1 (ko) * 2002-12-26 2006-04-25 미츠비시 쥬고교 가부시키가이샤 정전 척
US7430104B2 (en) * 2003-03-11 2008-09-30 Appiled Materials, Inc. Electrostatic chuck for wafer metrology and inspection equipment
US20040229477A1 (en) * 2003-05-13 2004-11-18 Daniel Timothy J. Apparatus and method for producing a <111> orientation aluminum film for an integrated circuit device
CN100470755C (zh) * 2004-03-19 2009-03-18 创意科技股份有限公司 双极型静电吸盘
US7457097B2 (en) * 2004-07-27 2008-11-25 International Business Machines Corporation Pressure assisted wafer holding apparatus and control method
US7666464B2 (en) 2004-10-23 2010-02-23 Applied Materials, Inc. RF measurement feedback control and diagnostics for a plasma immersion ion implantation reactor
CN101218668B (zh) * 2005-07-08 2010-11-03 创意科技股份有限公司 静电吸盘以及静电吸盘用的电极片
KR101312292B1 (ko) * 2006-12-11 2013-09-27 엘아이지에이디피 주식회사 플라즈마 처리장치의 기판 파손 방지장치 및 그 방법
KR101295776B1 (ko) * 2007-08-02 2013-08-12 삼성전자주식회사 직류 및 교류 전압들을 교대로 사용하는 웨이퍼의 디척킹방법 및 이를 채택하는 반도체 소자의 제조 장치
CN101916738B (zh) * 2010-07-08 2013-07-17 中微半导体设备(上海)有限公司 一种易于释放晶片的静电吸盘结构及方法
US20120227886A1 (en) * 2011-03-10 2012-09-13 Taipei Semiconductor Manufacturing Company, Ltd. Substrate Assembly Carrier Using Electrostatic Force
JP2012248613A (ja) * 2011-05-26 2012-12-13 Elpida Memory Inc 半導体装置の製造方法
TWI456688B (zh) * 2011-08-05 2014-10-11 Advanced Micro Fab Equip Inc 一種易於釋放晶片的靜電吸盤結構及方法
DE102013113048A1 (de) * 2013-11-26 2015-05-28 Aixtron Se Heizvorrichtung für einen Suszeptor eines CVD-Reaktors
US9570272B2 (en) * 2015-03-31 2017-02-14 Panasonic Intellectual Property Management Co., Ltd. Plasma processing apparatus and plasma processing method
US20170047867A1 (en) * 2015-08-12 2017-02-16 Applied Materials, Inc. Electrostatic chuck with electrostatic fluid seal for containing backside gas
JP6924196B2 (ja) * 2016-01-19 2021-08-25 インテヴァック インコーポレイテッド 基板製造用のパターンチャック
CN105919721A (zh) * 2016-04-22 2016-09-07 济南圣泉集团股份有限公司 一种发热贴
KR20180032893A (ko) * 2016-09-23 2018-04-02 고등기술연구원연구조합 가변식 압력검출매트
KR102644272B1 (ko) * 2016-10-31 2024-03-06 삼성전자주식회사 정전척 어셈블리
US10497667B2 (en) 2017-09-26 2019-12-03 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for bond wave propagation control
KR102085446B1 (ko) * 2018-09-21 2020-03-05 캐논 톡키 가부시키가이샤 정전척 시스템, 성막 장치, 피흡착체 분리방법, 성막 방법 및 전자 디바이스의 제조방법
KR102650613B1 (ko) * 2018-10-30 2024-03-21 캐논 톡키 가부시키가이샤 정전척 시스템, 성막장치, 흡착방법, 성막방법 및 전자 디바이스의 제조방법
KR102661368B1 (ko) * 2018-12-07 2024-04-25 캐논 톡키 가부시키가이샤 정전척, 정전척 시스템, 성막 장치, 흡착 방법, 성막 방법 및 전자 디바이스의 제조 방법
KR102497965B1 (ko) * 2019-03-18 2023-02-08 엔지케이 인슐레이터 엘티디 정전 척
US11417557B2 (en) * 2020-12-15 2022-08-16 Entegris, Inc. Spiraling polyphase electrodes for electrostatic chuck

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03180049A (ja) * 1989-12-08 1991-08-06 Sumitomo Electric Ind Ltd 半導体装置のピックアップ方法
US5467249A (en) * 1993-12-20 1995-11-14 International Business Machines Corporation Electrostatic chuck with reference electrode
US5997962A (en) 1995-06-30 1999-12-07 Tokyo Electron Limited Plasma process utilizing an electrostatic chuck
JPH09129716A (ja) 1995-11-02 1997-05-16 Hitachi Ltd 静電吸着装置とその製造方法、ウエハ処理方法
JPH10151516A (ja) * 1996-11-22 1998-06-09 Nikon Corp 研磨皿への溝加工方法
US5880923A (en) * 1997-06-09 1999-03-09 Applied Materials Inc. Method and apparatus for improved retention of a semiconductor wafer within a semiconductor wafer processing system
JP2973982B2 (ja) * 1997-07-18 1999-11-08 日本電気株式会社 電子部品の成形端子の画像検査方法及びチップ型電子部品

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047912A (ja) * 2002-07-16 2004-02-12 Ulvac Japan Ltd 吸着装置及び真空処理装置
KR101212246B1 (ko) * 2004-03-19 2012-12-12 가부시키가이샤 크리에이티브 테크놀러지 쌍극형 정전 척
JPWO2005091356A1 (ja) * 2004-03-19 2008-02-07 株式会社クリエイティブ テクノロジー 双極型静電チャック
JP4684222B2 (ja) * 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック
WO2005091356A1 (ja) * 2004-03-19 2005-09-29 Creative Technology Corporation 双極型静電チャック
JP2006060117A (ja) * 2004-08-23 2006-03-02 Dainippon Screen Mfg Co Ltd 熱処理装置
JP2013539913A (ja) * 2010-09-17 2013-10-28 ラム リサーチ コーポレーション リフトピンを用いた静電デチャックのための極性領域
JP2012209477A (ja) * 2011-03-30 2012-10-25 Tokyo Electron Ltd 温度制御方法及びプラズマ処理システム
JP2014195009A (ja) * 2013-03-29 2014-10-09 Hitachi High-Technologies Corp プラズマ処理装置およびプラズマ処理方法
WO2020044843A1 (ja) * 2018-08-30 2020-03-05 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法
JP2020035905A (ja) * 2018-08-30 2020-03-05 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法
JP2022154252A (ja) * 2021-03-30 2022-10-13 住友大阪セメント株式会社 静電チャック部材及び静電チャック装置
JP2024519841A (ja) * 2021-05-19 2024-05-21 アプライド マテリアルズ インコーポレイテッド 端面不均一性チューニングのための低インピーダンス電流経路

Also Published As

Publication number Publication date
US6500686B2 (en) 2002-12-31
KR100437977B1 (ko) 2004-07-02
CN1335640A (zh) 2002-02-13
KR20020005986A (ko) 2002-01-18
US20020006680A1 (en) 2002-01-17
CN1197125C (zh) 2005-04-13
TW498420B (en) 2002-08-11

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