JP2001503806A - 高熱伝導性高適合性アルミナ充填組成物およびその製法 - Google Patents
高熱伝導性高適合性アルミナ充填組成物およびその製法Info
- Publication number
- JP2001503806A JP2001503806A JP52151898A JP52151898A JP2001503806A JP 2001503806 A JP2001503806 A JP 2001503806A JP 52151898 A JP52151898 A JP 52151898A JP 52151898 A JP52151898 A JP 52151898A JP 2001503806 A JP2001503806 A JP 2001503806A
- Authority
- JP
- Japan
- Prior art keywords
- gel
- alumina
- weight
- composition
- styrene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 94
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000002243 precursor Substances 0.000 claims abstract description 27
- 239000002245 particle Substances 0.000 claims abstract description 26
- 239000011159 matrix material Substances 0.000 claims abstract description 14
- 239000004744 fabric Substances 0.000 claims abstract description 7
- 239000006260 foam Substances 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 28
- -1 styrene- (ethylene butylene) -styrene Chemical class 0.000 claims description 23
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- 229920001169 thermoplastic Polymers 0.000 claims description 10
- 238000009472 formulation Methods 0.000 claims description 9
- 239000004416 thermosoftening plastic Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 6
- 229920006132 styrene block copolymer Polymers 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000945 filler Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000499 gel Substances 0.000 description 73
- 239000000523 sample Substances 0.000 description 40
- 239000000126 substance Substances 0.000 description 17
- 239000012491 analyte Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 8
- 239000012530 fluid Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 6
- 238000010336 energy treatment Methods 0.000 description 6
- 230000035515 penetration Effects 0.000 description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000013256 coordination polymer Substances 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 229920002943 EPDM rubber Polymers 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000007480 spreading Effects 0.000 description 4
- 238000003892 spreading Methods 0.000 description 4
- 238000007906 compression Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000010985 leather Substances 0.000 description 3
- 229920002742 polystyrene-block-poly(ethylene/propylene) -block-polystyrene Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004606 Fillers/Extenders Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229920006037 cross link polymer Polymers 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002480 mineral oil Substances 0.000 description 2
- 235000010446 mineral oil Nutrition 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 2
- 239000012074 organic phase Substances 0.000 description 2
- 150000001282 organosilanes Chemical class 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- BWLBGMIXKSTLSX-UHFFFAOYSA-N 2-hydroxyisobutyric acid Chemical compound CC(C)(O)C(O)=O BWLBGMIXKSTLSX-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000006201 3-phenylpropyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 description 1
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 238000005773 Enders reaction Methods 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004988 Nematic liquid crystal Substances 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 229920001222 biopolymer Polymers 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 101150037603 cst-1 gene Proteins 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- GAURFLBIDLSLQU-UHFFFAOYSA-N diethoxy(methyl)silicon Chemical compound CCO[Si](C)OCC GAURFLBIDLSLQU-UHFFFAOYSA-N 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 239000010690 paraffinic oil Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
- C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
- C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.熱伝導性かつ適合性の組成物を製造する方法であって、 (a)ゲル100重量部を供給し、 (b)少なくとも10重量%が少なくとも74μmの粒子サイズを有するα− アルミナ150〜400重量部にゲルを組み合わせて、ゲルとα−アルミナの配 合物を形成し、 (c)配合物を混合して熱伝導性適合性組成物を得る 工程を含んでなる方法。 2.ゲルは、スチレン−(エチレン ブチレン)−スチレンまたはスチレン−( エチレン プロピレン)−スチレンブロック共重合体から製造された熱可塑性ゲ ルである請求項1に記載の方法。 3.熱伝導性かつ適合性の組成物を製造する方法であって、 (a)硬化してゲルになる前駆体物質100重量部を供給し、 (b)少なくとも10重量%が少なくとも74μmの粒子サイズを有するα− アルミナ150〜400重量部に前駆体物質を組み合わせて、前駆体物質とα− アルミナの配合物を形成し、 (c)前駆体物質を硬化してゲルにして熱伝導性適合性組成物を得る 工程を含んでなる方法。 4.ゲルは、有機ポリシロキサンゲルである請求項3に記載の方法。 5.ゲルおよびα−アルミナの組み合わせを、少なくとも10Joule/gの比エ ネルギー投入量で混合する請求項1〜4のいずれかに記載の方法。 6.熱伝導性かつ適合性の組成物を製造する方法であって、 (a)混合した場合に、硬化してゲルを形成する第1および第2前駆体成分を 、第1および第2前駆体成分の合計量が100重量部となるように、別個に供給 し、 (b)第1および第2前駆体成分それぞれに、少なくとも10重量%が少なく とも74μmの粒子サイズを有するα−アルミナ合計150〜400重量部を別 個に組み合わせて、α−アルミナと第1または第2前駆体成分それぞれを含む第 1および第2配合物を形成し、 (c)第1および第2配合物を混合し、硬化して熱伝導性適合性組成物を得る 工程を含んでなる方法。 7.混合および硬化工程の前に、α−アルミナの第1または第2成分に対する 比がそれぞれ3:2に等しいかまたはそれより大きい第1および第2配合物を、 少なくとも10Joule/gの比エネルギー投入量で混合する請求項6に記載の方法 。 8.ゲルは、有機ポリシロキサンゲルである請求項6または7に記載の方法。 9.α−アルミナは、焼成α−アルミナである請求項1〜8のいずれかに記載 の方法。 10.α−アルミナは、1.0g/cm3未満の嵩密度を有する粉末である請 求項1〜9のいずれかに記載の方法。 11.熱伝導性適合性組成物は、少なくとも1.3watt/m・℃の熱伝導率、1 000g未満の硬さ、および少なくとも50%の破断時伸びを有する請求項1〜 10のいずれかに記載の方法。 12.請求項1〜11のいずれかに記載の方法により製造された熱伝導性適合 性組成物。 13.適合性かつ熱伝導性の組成物であって、 (a)ゲル100重量部、および (b)少なくとも10重量%が少なくとも74μmの粒子サイズを有するα− アルミナ150〜400重量部 を含んでなる組成物。 14.ゲルは、有機ポリシロキサンゲルである請求項13に記載の組成物。 15.ゲルは、スチレン−(エチレン ブチレン)−スチレンまたはスチレン− (エチレン プロピレン)−スチレンブロック共重合体から製造された熱可塑性ゲ ルである請求項13に記載の組成物。 16.α−アルミナは、焼成α−アルミナである請求項13〜15のいずれか に記載の組成物。 17.α−アルミナは、1.0g/cm3未満の嵩密度を有する粉末である請求 項13〜16のいずれかに記載の組成物。 18.少なくとも1.3watt/m・℃の熱伝導率、1000g未満の硬さ、お よび少なくとも50%の破断時伸びを有する請求項13〜17のいずれかに記載 の組成物。 19. (I)(a)ゲル100重量部、および (b)少なくとも10重量%が少なくとも74μmの粒子サイズを有するα− アルミナ150〜400重量部 を含んでなる適合性かつ熱伝導性の組成物、並びに (II)組成物を支持する柔軟性マトリックス を含んでなる物品。 20.柔軟性マトリックスは、布である請求項19に記載の物品。 21.柔軟性マトリックスは、連続気泡発泡体である請求項19に記載の物品 。 22.ゲルは、誘起ポロシロキサンゲルである請求項19〜21のいずれかに 記載の物品。 23.ゲルは、スチレン−(エチレン ブチレン)−スチレンまたはスチレン− (エチレン プロピレン)−スチレンブロック共重合体から製造された熱可塑性ゲ ルである請求項19〜21のいずれかに記載の物品。 24.α−アルミナは、焼成α−アルミナである請求項19〜23のいずれか に記載の物品。 25.α−アルミナは、1.0g/cm3未満の嵩密度を有する粉末である請求 項19〜24のいずれかに記載の物品。 26.組成物は、少なくとも1.3watt/m・℃の熱伝導率、1000g未満 の硬さ、および少なくとも50%の破断時伸びを有する請求項19〜25のいず れかに記載の物品。
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US08/746,024 US5929138A (en) | 1996-11-05 | 1996-11-05 | Highly thermally conductive yet highly comformable alumina filled composition and method of making the same |
US08/746,024 | 1996-11-05 | ||
PCT/US1997/019584 WO1998020072A1 (en) | 1996-11-05 | 1997-10-28 | Highly thermally conductive yet highly conformable alumina filled composition and method of making the same |
Publications (3)
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JP2001503806A true JP2001503806A (ja) | 2001-03-21 |
JP2001503806A5 JP2001503806A5 (ja) | 2005-06-16 |
JP3959118B2 JP3959118B2 (ja) | 2007-08-15 |
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JP52151898A Expired - Fee Related JP3959118B2 (ja) | 1996-11-05 | 1997-10-28 | 高熱伝導性高適合性アルミナ充填組成物およびその製法 |
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US (2) | US5929138A (ja) |
EP (1) | EP0937119B1 (ja) |
JP (1) | JP3959118B2 (ja) |
KR (1) | KR100509285B1 (ja) |
CN (1) | CN1106427C (ja) |
AT (1) | ATE204316T1 (ja) |
AU (1) | AU724839B2 (ja) |
BR (1) | BR9712876A (ja) |
CA (1) | CA2271003A1 (ja) |
DE (1) | DE69706188T2 (ja) |
HK (1) | HK1025343A1 (ja) |
HU (1) | HUP9904214A3 (ja) |
IL (1) | IL129510A0 (ja) |
MY (1) | MY132738A (ja) |
TW (1) | TW467868B (ja) |
WO (1) | WO1998020072A1 (ja) |
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KR970706356A (ko) * | 1994-09-30 | 1997-11-03 | 허버트 지. 버카드 | 고도의 응력완화율을 나타내는 실리콘 밀봉물질(Silicone Sealing Material Exhibiting High Stress Relaxation) |
EP0805825B1 (en) * | 1995-01-27 | 2000-08-23 | TYCO Electronics Corporation | Gels from anhydride-containing polymers |
ATE280995T1 (de) * | 1995-03-22 | 2004-11-15 | Tyco Electronics Corp | Leitfähige polymerzusammensetzung und vorrichtung |
DE19829815A1 (de) * | 1998-07-03 | 2000-01-05 | Schade Gmbh & Co Kg | Klappdeckelverschluß |
-
1996
- 1996-11-05 US US08/746,024 patent/US5929138A/en not_active Expired - Lifetime
-
1997
- 1997-10-20 TW TW086115437A patent/TW467868B/zh not_active IP Right Cessation
- 1997-10-22 MY MYPI97004978A patent/MY132738A/en unknown
- 1997-10-28 CA CA002271003A patent/CA2271003A1/en not_active Abandoned
- 1997-10-28 WO PCT/US1997/019584 patent/WO1998020072A1/en active IP Right Grant
- 1997-10-28 AU AU50038/97A patent/AU724839B2/en not_active Ceased
- 1997-10-28 CN CN97181233A patent/CN1106427C/zh not_active Expired - Fee Related
- 1997-10-28 IL IL12951097A patent/IL129510A0/xx unknown
- 1997-10-28 JP JP52151898A patent/JP3959118B2/ja not_active Expired - Fee Related
- 1997-10-28 EP EP97912981A patent/EP0937119B1/en not_active Expired - Lifetime
- 1997-10-28 KR KR10-1999-7003985A patent/KR100509285B1/ko not_active IP Right Cessation
- 1997-10-28 BR BR9712876-7A patent/BR9712876A/pt not_active Application Discontinuation
- 1997-10-28 AT AT97912981T patent/ATE204316T1/de not_active IP Right Cessation
- 1997-10-28 DE DE69706188T patent/DE69706188T2/de not_active Expired - Lifetime
- 1997-10-28 HU HU9904214A patent/HUP9904214A3/hu unknown
-
1999
- 1999-02-24 US US09/256,809 patent/US6031025A/en not_active Expired - Lifetime
-
2000
- 2000-07-20 HK HK00104491A patent/HK1025343A1/xx not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009531526A (ja) * | 2006-03-28 | 2009-09-03 | パーカー.ハニフィン.コーポレイション | 施用可能な硬化樹脂 |
Also Published As
Publication number | Publication date |
---|---|
HK1025343A1 (en) | 2000-11-10 |
US6031025A (en) | 2000-02-29 |
JP3959118B2 (ja) | 2007-08-15 |
ATE204316T1 (de) | 2001-09-15 |
BR9712876A (pt) | 2000-02-01 |
DE69706188T2 (de) | 2002-05-02 |
CN1242789A (zh) | 2000-01-26 |
IL129510A0 (en) | 2000-02-29 |
KR100509285B1 (ko) | 2005-08-22 |
CA2271003A1 (en) | 1998-05-14 |
WO1998020072A1 (en) | 1998-05-14 |
AU5003897A (en) | 1998-05-29 |
HUP9904214A3 (en) | 2001-01-29 |
HUP9904214A2 (hu) | 2000-04-28 |
EP0937119A1 (en) | 1999-08-25 |
AU724839B2 (en) | 2000-09-28 |
TW467868B (en) | 2001-12-11 |
KR20000053070A (ko) | 2000-08-25 |
EP0937119B1 (en) | 2001-08-16 |
MY132738A (en) | 2007-10-31 |
US5929138A (en) | 1999-07-27 |
CN1106427C (zh) | 2003-04-23 |
DE69706188D1 (de) | 2001-09-20 |
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