DE69706188D1 - Hoch wärmeleitfähige und stark verformbare, mit Aluminiumoxid gefüllte Zusammensetzung, sowie Verfahren zu deren Herstellung - Google Patents

Hoch wärmeleitfähige und stark verformbare, mit Aluminiumoxid gefüllte Zusammensetzung, sowie Verfahren zu deren Herstellung

Info

Publication number
DE69706188D1
DE69706188D1 DE69706188T DE69706188T DE69706188D1 DE 69706188 D1 DE69706188 D1 DE 69706188D1 DE 69706188 T DE69706188 T DE 69706188T DE 69706188 T DE69706188 T DE 69706188T DE 69706188 D1 DE69706188 D1 DE 69706188D1
Authority
DE
Germany
Prior art keywords
highly
alumina
thermally conductive
alpha
processes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69706188T
Other languages
English (en)
Other versions
DE69706188T2 (de
Inventor
W Mercer
P Ching
Zbigniew Cichocki
H Reamey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Corp filed Critical Tyco Electronics Corp
Publication of DE69706188D1 publication Critical patent/DE69706188D1/de
Application granted granted Critical
Publication of DE69706188T2 publication Critical patent/DE69706188T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Conductive Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69706188T 1996-11-05 1997-10-28 Hoch wärmeleitfähige und stark verformbare, mit Aluminiumoxid gefüllte Zusammensetzung, sowie Verfahren zu deren Herstellung Expired - Lifetime DE69706188T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/746,024 US5929138A (en) 1996-11-05 1996-11-05 Highly thermally conductive yet highly comformable alumina filled composition and method of making the same
PCT/US1997/019584 WO1998020072A1 (en) 1996-11-05 1997-10-28 Highly thermally conductive yet highly conformable alumina filled composition and method of making the same

Publications (2)

Publication Number Publication Date
DE69706188D1 true DE69706188D1 (de) 2001-09-20
DE69706188T2 DE69706188T2 (de) 2002-05-02

Family

ID=24999187

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69706188T Expired - Lifetime DE69706188T2 (de) 1996-11-05 1997-10-28 Hoch wärmeleitfähige und stark verformbare, mit Aluminiumoxid gefüllte Zusammensetzung, sowie Verfahren zu deren Herstellung

Country Status (16)

Country Link
US (2) US5929138A (de)
EP (1) EP0937119B1 (de)
JP (1) JP3959118B2 (de)
KR (1) KR100509285B1 (de)
CN (1) CN1106427C (de)
AT (1) ATE204316T1 (de)
AU (1) AU724839B2 (de)
BR (1) BR9712876A (de)
CA (1) CA2271003A1 (de)
DE (1) DE69706188T2 (de)
HK (1) HK1025343A1 (de)
HU (1) HUP9904214A3 (de)
IL (1) IL129510A0 (de)
MY (1) MY132738A (de)
TW (1) TW467868B (de)
WO (1) WO1998020072A1 (de)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6333374B1 (en) 1990-05-21 2001-12-25 Applied Elastomerics, Inc. Fluffy, strong, solid elastic gels, articles and method of making same
US6324703B1 (en) 1994-04-19 2001-12-04 Applied Elastomerics, Inc. Strong, soft, tear resistant insulating compositions and composites for extreme cold weather use
US7134236B2 (en) * 1994-04-19 2006-11-14 Applied Elastomerics, Inc. Gelatinous elastomer compositions and articles for use as fishing bait
US6420475B1 (en) 1994-04-19 2002-07-16 Applied Elastomerics, Inc. Tear resistant elastic crystal gels gel composites and their uses
US6627275B1 (en) 1994-04-19 2003-09-30 Applied Elastomerics, Incorporated Tear resistant elastic crystal gels suitable for inflatable restraint cushions and other uses
US7193002B2 (en) 1992-08-24 2007-03-20 Applied Elastomerics, Inc. Adherent gels, composites, and articles
US7208184B2 (en) * 2002-07-20 2007-04-24 Applied Elastomerics, Inc. Gelatinous food elastomer compositions and articles for use as fishing bait
US7093599B2 (en) * 1994-04-19 2006-08-22 Applied Elastomerics, Inc. Gels, composites, and health care articles
US7105607B2 (en) * 1994-04-19 2006-09-12 Applied Elastomerics, Inc. Tear resistant gels, composites, and articles
US6161555A (en) * 1994-04-19 2000-12-19 Applied Elastomerics, Inc. Crystal gels useful as dental floss with improved high tear, high tensile, and resistance to high stress rupture properties
US7222380B2 (en) * 1994-04-19 2007-05-29 Applied Elastomerics, Inc. Tear resistant gels, composites, and cushion articles
US7344568B2 (en) 1994-04-19 2008-03-18 Applied Elastomerics, Inc. Tear resistant gels, composites, and liner articles
US7093316B2 (en) 1994-04-19 2006-08-22 Applied Elastomerics, Inc. Gels for force gauging
US7067583B2 (en) * 1994-04-19 2006-06-27 Applied Elastomerics, Inc. Tear resistant adherent gels, composites, and articles
US6865759B2 (en) 1996-02-14 2005-03-15 Edizone, Inc. Cushions with non-intersecting-columnar elastomeric members exhibiting compression instability
US5749111A (en) 1996-02-14 1998-05-12 Teksource, Lc Gelatinous cushions with buckling columns
US6906292B2 (en) * 1998-10-29 2005-06-14 Applera Corporation Sample tray heater module
US6531771B1 (en) 1999-04-20 2003-03-11 Tyco Electronics Corporation Dissipation of heat from a circuit board having bare silicon chips mounted thereon
US6652805B2 (en) 1999-07-02 2003-11-25 Holl Technologies Company Highly filled composites of powdered fillers and polymer matrix
US6471392B1 (en) 2001-03-07 2002-10-29 Holl Technologies Company Methods and apparatus for materials processing
US6391082B1 (en) 1999-07-02 2002-05-21 Holl Technologies Company Composites of powdered fillers and polymer matrix
US6742774B2 (en) * 1999-07-02 2004-06-01 Holl Technologies Company Process for high shear gas-liquid reactions
US7538237B2 (en) * 1999-07-02 2009-05-26 Kreido Laboratories Process for high shear gas-liquid reactions
EP1142946A1 (de) * 2000-04-06 2001-10-10 Dow Corning Toray Silicone Co., Ltd. Härtbare Siliconzusammensetzung
JP3340112B2 (ja) * 2000-06-02 2002-11-05 北川工業株式会社 熱伝導材及びその製造方法
US6830806B2 (en) * 2001-04-12 2004-12-14 Kreido Laboratories Methods of manufacture of electric circuit substrates and components having multiple electric characteristics and substrates and components so manufactured
JP3976166B2 (ja) * 2001-07-13 2007-09-12 持田商工株式会社 Ｐｄｐパネル
EP1446222A2 (de) * 2001-09-13 2004-08-18 Holl Technologies Company Verfahren und vorrichtung zur übertragung von wärmeenergie zwischen einer körperoberfläche und wärmeübertragungsmittel
US6787246B2 (en) 2001-10-05 2004-09-07 Kreido Laboratories Manufacture of flat surfaced composites comprising powdered fillers in a polymer matrix
US10595710B2 (en) * 2001-10-19 2020-03-24 Visionscope Technologies Llc Portable imaging system employing a miniature endoscope
JP3807995B2 (ja) * 2002-03-05 2006-08-09 ポリマテック株式会社 熱伝導性シート
JP4130091B2 (ja) * 2002-04-10 2008-08-06 信越化学工業株式会社 放熱用シリコーングリース組成物
US7208192B2 (en) * 2002-05-31 2007-04-24 Parker-Hannifin Corporation Thermally or electrically-conductive form-in-place gap filter
US7098360B2 (en) * 2002-07-16 2006-08-29 Kreido Laboratories Processes employing multiple successive chemical reaction process steps and apparatus therefore
US7165881B2 (en) * 2002-09-11 2007-01-23 Holl Technologies Corporation Methods and apparatus for high-shear mixing and reacting of materials
EP1546629A2 (de) * 2002-10-03 2005-06-29 Kredo Laboratories Vorrichtung zur übertragung von wärmeenergie zwischen einer körperoberfläche und einem wärme bertragungsfluid
US20040101031A1 (en) * 2002-11-25 2004-05-27 Ford Global Technologies, Inc. Temperature sensor with improved response time
US20040116571A1 (en) * 2002-12-12 2004-06-17 Yung-Ming Su Thermally conductive thermoplastic materials and method of making the same
US8119191B2 (en) * 2003-01-16 2012-02-21 Parker-Hannifin Corporation Dispensable cured resin
TW200503952A (en) 2003-06-04 2005-02-01 Showa Denko Kk Corundum for filling in resin and resin composition
WO2004108812A1 (en) * 2003-06-04 2004-12-16 Showa Denko K.K. Corundum for filling in resin and resin composition
JP4774409B2 (ja) * 2004-12-16 2011-09-14 アトランティック ビジネス センター オブ エクセレンス アンド コマーシャライゼイション オブ イノベーション リミテッド 材料をモニタする方法及び装置
TW200635993A (en) * 2004-12-17 2006-10-16 Solvay Advanced Polymers Llc Semi-crystalline polymer composition and article manufactured therefrom
KR101357514B1 (ko) * 2006-01-26 2014-02-03 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 방열재와 이를 이용한 반도체 장치
WO2007123645A2 (en) * 2006-03-28 2007-11-01 Parker-Hannifin Corporation Dispensable cured resin
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
DE102008049850A1 (de) * 2008-10-01 2010-04-08 Tesa Se Wärmeleitende Haftklebemasse
CA2770719C (en) 2009-08-12 2017-12-12 Jonathan Bergin Fully-cured thermally or electrically-conductive form-in-place gap filler
TWI475103B (zh) * 2009-12-15 2015-03-01 Ind Tech Res Inst 散熱結構
DE102009055099A1 (de) * 2009-12-21 2011-06-22 tesa SE, 20253 Hitzeaktiviert verklebbare Flächenelemente
WO2011112704A2 (en) * 2010-03-12 2011-09-15 General Cable Technologies Corporation Insulation with micro oxide particles and cable using the same
US8350381B2 (en) 2010-04-01 2013-01-08 Infineon Technologies Ag Device and method for manufacturing a device
US8759692B2 (en) 2010-08-30 2014-06-24 Parker-Hannifin Corporation Encapsulated expanded crimped metal mesh for sealing, EMI shielding and lightning strike applications
US8766108B2 (en) 2010-08-30 2014-07-01 Parker Hannifin Corporation Encapsulated expanded crimped metal mesh for sealing and EMI shielding applications
US9136043B2 (en) 2010-10-05 2015-09-15 General Cable Technologies Corporation Cable with barrier layer
US9087630B2 (en) 2010-10-05 2015-07-21 General Cable Technologies Corporation Cable barrier layer with shielding segments
WO2012074558A2 (en) 2010-12-03 2012-06-07 Michael Colburn Mixture of graphite and dielectric particles for heat generation and exchange devices
US9701388B2 (en) 2011-05-11 2017-07-11 Aviation Devices & Electronic Components, Llc Gasket having a pliable resilient body with a perimeter having characteristics different than the body
EP2721914A4 (de) 2011-06-17 2015-07-22 Aviat Devices & Electronic Components Llc Einseitige klebedichtung
US8863625B2 (en) 2011-06-21 2014-10-21 Aviation Devices & Electronics Components, LLC Elastomeric gasket squeeze out removal method and kit
US8691033B1 (en) 2011-07-06 2014-04-08 Aviation Devices & Electronic Components, Llc Positioning a workpiece on a sticky gasket
US9702464B1 (en) 2011-10-03 2017-07-11 The Patent Well LLC Non-planar stick gaskets for receipt between a base and a workpiece
US9303447B1 (en) 2012-05-15 2016-04-05 Aviation Devices & Electronic Components LLC Elastomeric gasket for fuel access door of an aircraft wing and a method for making the same
US9751244B2 (en) 2012-05-15 2017-09-05 The Patent Well LLC Elastomeric gasket for fuel access door of an aircraft wing and a method for making the same
US9016697B2 (en) 2012-07-10 2015-04-28 Aviation Devices & Electronic Components, Llc Spacer and gasket assembly for use on an aircraft
WO2014105981A1 (en) 2012-12-28 2014-07-03 Dow Corning Corporation Method of preparing electroactive article and electroactive article formed in accordance therewith
US9353245B2 (en) * 2014-08-18 2016-05-31 3M Innovative Properties Company Thermally conductive clay
US10837555B2 (en) * 2015-04-08 2020-11-17 Aviation Devices & Electronic Components, L.L.C. Metal mesh with a low electrical resistance conversion coating for use with aircraft structures
CN105246260B (zh) * 2015-11-12 2017-12-12 浙江展邦电子科技有限公司 一种铝基线路板的制造方法
SG11201810208RA (en) 2016-05-16 2018-12-28 Martinswerk Gmbh Products and uses thereof
CN110055038A (zh) 2018-01-19 2019-07-26 天津莱尔德电子材料有限公司 高顺应性非硅酮油灰和包含其的热界面材料
US20240059843A1 (en) 2021-03-04 2024-02-22 Momentive Performance Materials Inc. Thermal gel composition
CN113184886B (zh) * 2021-04-14 2023-01-31 雅安百图高新材料股份有限公司 一种高导热球形氧化铝的制备方法及产品

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3020260A (en) * 1960-08-18 1962-02-06 Dow Corning Organosiloxane potting compound
US4369284A (en) * 1977-03-17 1983-01-18 Applied Elastomerics, Incorporated Thermoplastic elastomer gelatinous compositions
US4237441A (en) * 1978-12-01 1980-12-02 Raychem Corporation Low resistivity PTC compositions
US4373239A (en) * 1980-02-27 1983-02-15 Xerox Corporation Fusing member for electrostatographic copiers
JPS58219259A (ja) * 1982-06-14 1983-12-20 Toray Silicone Co Ltd 熱伝導性シリコ−ンゴム組成物
US5140746A (en) * 1982-10-12 1992-08-25 Raychem Corporation Method and device for making electrical connector
US4634207A (en) * 1982-10-12 1987-01-06 Raychem Corporation Apparatus and method for protection of a substrate
US5357057A (en) * 1982-10-12 1994-10-18 Raychem Corporation Protected electrical connector
US4600261A (en) * 1982-10-12 1986-07-15 Raychem Corporation Apparatus and method for protection of electrical contacts
US4643924A (en) * 1985-03-25 1987-02-17 Raychem Corporation Protective article comprising an elastic gel
US4865905A (en) * 1983-06-23 1989-09-12 Raychem Corporation Article for protection of a substrate
US4690831A (en) * 1983-06-23 1987-09-01 Raychem Corp. Protective article
US4574879A (en) * 1984-02-29 1986-03-11 The Bergquist Company Mounting pad for solid-state devices
US4548862A (en) * 1984-09-04 1985-10-22 Minnesota Mining And Manufacturing Company Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer
US4585822A (en) * 1984-10-29 1986-04-29 Sws Silicones Corporation Thermally conductive room temperature vulcanizable compositions
US4701574A (en) * 1985-02-06 1987-10-20 Raychem Corp. Cable sealing apparatus
US4777063A (en) * 1985-05-02 1988-10-11 Raychem Corporation Curable organopolysiloxane composition
US4595635A (en) * 1985-05-02 1986-06-17 Raychem Corporation Organopolysiloxane materials having decreased surface tack
US4680233A (en) * 1985-05-02 1987-07-14 Raychem Corporation Sealing material
US4716183A (en) * 1985-11-22 1987-12-29 Raychem Corp. Styrene-diene block copolymer compositions
US4741940A (en) * 1986-05-19 1988-05-03 Raychem Corporation Articles and methods for protecting substrates
US4900877A (en) * 1987-01-13 1990-02-13 Raychem Corporation Shielding and sealing gaskets
JPS63251466A (ja) * 1987-04-06 1988-10-18 Shin Etsu Chem Co Ltd 熱伝導性液状シリコ−ンゴム組成物
US4852646A (en) * 1987-06-16 1989-08-01 Raychem Corporation Thermally conductive gel materials
US4942270A (en) * 1987-07-13 1990-07-17 Raychem Corporation Cable sealing apparatus comprising heat resistant gel compositions
JPH0297559A (ja) * 1988-10-03 1990-04-10 Toshiba Silicone Co Ltd 熱伝導性シリコーン組成物
CA2002473A1 (en) * 1988-11-09 1990-05-09 Alistair A. P. Sutherland Gels
EP0461185A1 (de) * 1989-03-01 1991-12-18 Raychem Corporation Verfahren zum härten von organopolysiloxanzusammensetzungen sowie zusammensetzungen daraus
US5104930A (en) * 1990-02-27 1992-04-14 Raychem Corporation Polyurea gel compositions and articles therefrom
US5060114A (en) * 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
TW218887B (de) * 1991-01-24 1994-01-11 Shinetsu Chem Ind Co
TW197458B (de) * 1991-02-14 1993-01-01 Ciba Geigy Ag
JP3253981B2 (ja) * 1991-04-17 2002-02-04 東レ・ダウコーニング・シリコーン株式会社 硬化性オルガノポリシロキサンゲル組成物
JP2623380B2 (ja) * 1991-06-03 1997-06-25 信越化学工業株式会社 熱伝導性に優れたシリコーン組成物
CA2093191A1 (en) * 1992-04-15 1993-10-16 Richard J. Webb Psa containing thermally conductive, electrically insulative particles and a transfer tape from this psa
KR950701663A (ko) * 1992-05-13 1995-04-28 존 에버리트 벤슨 겔(gels)
JP2882972B2 (ja) * 1993-06-15 1999-04-19 電気化学工業株式会社 放熱シート
US5510174A (en) * 1993-07-14 1996-04-23 Chomerics, Inc. Thermally conductive materials containing titanium diboride filler
WO1996005602A1 (en) * 1994-08-16 1996-02-22 Raychem Cororation Thermally conductive gel materials
KR970706356A (ko) * 1994-09-30 1997-11-03 허버트 지. 버카드 고도의 응력완화율을 나타내는 실리콘 밀봉물질(Silicone Sealing Material Exhibiting High Stress Relaxation)
DE69609947T2 (de) * 1995-01-27 2001-04-12 Tyco Electronics Corp Gele aus anhydrid enthaltenden polymeren
EP0815569B1 (de) * 1995-03-22 2004-10-27 Tyco Electronics Corporation Leitfähige polymerzusammensetzung und vorrichtung
DE19829815A1 (de) * 1998-07-03 2000-01-05 Schade Gmbh & Co Kg Klappdeckelverschluß

Also Published As

Publication number Publication date
TW467868B (en) 2001-12-11
AU724839B2 (en) 2000-09-28
HK1025343A1 (en) 2000-11-10
KR100509285B1 (ko) 2005-08-22
HUP9904214A3 (en) 2001-01-29
EP0937119B1 (de) 2001-08-16
CN1242789A (zh) 2000-01-26
EP0937119A1 (de) 1999-08-25
CA2271003A1 (en) 1998-05-14
BR9712876A (pt) 2000-02-01
DE69706188T2 (de) 2002-05-02
WO1998020072A1 (en) 1998-05-14
IL129510A0 (en) 2000-02-29
US6031025A (en) 2000-02-29
CN1106427C (zh) 2003-04-23
ATE204316T1 (de) 2001-09-15
AU5003897A (en) 1998-05-29
HUP9904214A2 (hu) 2000-04-28
JP3959118B2 (ja) 2007-08-15
KR20000053070A (ko) 2000-08-25
JP2001503806A (ja) 2001-03-21
MY132738A (en) 2007-10-31
US5929138A (en) 1999-07-27

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