DK0868474T3 - Silicone-elastomer med en høj termisk ledningsevne - Google Patents

Silicone-elastomer med en høj termisk ledningsevne

Info

Publication number
DK0868474T3
DK0868474T3 DK96943158T DK96943158T DK0868474T3 DK 0868474 T3 DK0868474 T3 DK 0868474T3 DK 96943158 T DK96943158 T DK 96943158T DK 96943158 T DK96943158 T DK 96943158T DK 0868474 T3 DK0868474 T3 DK 0868474T3
Authority
DK
Denmark
Prior art keywords
thermal conductivity
filler
high thermal
silicone elastomer
optionally
Prior art date
Application number
DK96943158T
Other languages
English (en)
Inventor
Bernard Dalbe
Yves Giraud
Original Assignee
Rhodia Chimie Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rhodia Chimie Sa filed Critical Rhodia Chimie Sa
Application granted granted Critical
Publication of DK0868474T3 publication Critical patent/DK0868474T3/da

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Laminated Bodies (AREA)
DK96943158T 1995-12-22 1996-12-20 Silicone-elastomer med en høj termisk ledningsevne DK0868474T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9515776A FR2742763B1 (fr) 1995-12-22 1995-12-22 Elastomere silicone a haute conductibilite thermique
PCT/FR1996/002042 WO1997023555A1 (fr) 1995-12-22 1996-12-20 Elastomere silicone a haute conductibilite thermique

Publications (1)

Publication Number Publication Date
DK0868474T3 true DK0868474T3 (da) 2002-12-30

Family

ID=9486180

Family Applications (1)

Application Number Title Priority Date Filing Date
DK96943158T DK0868474T3 (da) 1995-12-22 1996-12-20 Silicone-elastomer med en høj termisk ledningsevne

Country Status (13)

Country Link
US (1) US6284829B1 (da)
EP (1) EP0868474B1 (da)
CN (1) CN1136258C (da)
AT (1) ATE226606T1 (da)
CA (1) CA2238886C (da)
DE (1) DE69624499T2 (da)
DK (1) DK0868474T3 (da)
ES (1) ES2181931T3 (da)
FR (1) FR2742763B1 (da)
MX (1) MX9804859A (da)
PT (1) PT868474E (da)
TW (1) TW341583B (da)
WO (1) WO1997023555A1 (da)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1478688A1 (de) * 2002-02-28 2004-11-24 Siemens Aktiengesellschaft Hochgefülltes giessharzsystem
US20030168731A1 (en) * 2002-03-11 2003-09-11 Matayabas James Christopher Thermal interface material and method of fabricating the same
EP1585784A1 (de) * 2003-01-23 2005-10-19 Siemens Aktiengesellschaft Hochgefülltes giessharzsystem
JP2004352947A (ja) * 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物
JP4219793B2 (ja) * 2003-11-25 2009-02-04 信越化学工業株式会社 放熱用シリコーングリース組成物
WO2005066252A2 (en) * 2004-01-08 2005-07-21 Showa Denko K.K. Inorganic powder, resin composition filled with the powder and use thereof
JP4828146B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP4828145B2 (ja) * 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
CA2605209C (en) * 2005-04-19 2013-10-22 Denki Kagaku Kogyo Kabushiki Kaisha Metal base circuit board, light-emitting diode and led light source unit
CN1978582A (zh) * 2005-12-09 2007-06-13 富准精密工业(深圳)有限公司 导热膏及使用该导热膏的电子装置
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
WO2008082001A1 (ja) * 2006-12-28 2008-07-10 Dow Corning Toray Co., Ltd. 加熱硬化性シリコーンゴム組成物
US7736470B2 (en) * 2007-01-25 2010-06-15 Exxonmobil Research And Engineering Company Coker feed method and apparatus
DE102007019942A1 (de) 2007-04-27 2008-11-06 Continental Aktiengesellschaft Kautschukmischung mit verbesserter Rückprallelastizität
JP2013513233A (ja) 2009-12-04 2013-04-18 エー ビー ビー リサーチ リミテッド 高電圧サージアレスタ
CN102234427B (zh) * 2010-04-29 2013-01-30 比亚迪股份有限公司 一种硅橡胶组合物及硅橡胶的制备方法
CN105358615B (zh) * 2013-09-03 2017-12-22 道康宁公司 用于有机硅封装材料的添加剂
KR102297295B1 (ko) * 2014-03-27 2021-09-02 쓰리엠 이노베이티브 프로퍼티즈 캄파니 충전된 폴리다이오가노실록산-함유 조성물, 및 그의 사용 방법
WO2015193558A1 (en) * 2014-06-19 2015-12-23 Inkron Oy A method of making a siloxane polymer composition
JP6845343B2 (ja) 2017-02-08 2021-03-17 エルケム・シリコーンズ・ユーエスエイ・コーポレーションElkem Silicones Usa Corp. 温度管理の改善された二次電池パック
JP6941810B2 (ja) * 2017-04-19 2021-09-29 パナソニックIpマネジメント株式会社 樹脂組成物ならびにそれを用いた電子部品および電子機器
CN113166545B (zh) * 2018-12-29 2023-05-23 陶氏环球技术有限责任公司 包含mgo填料的导热组合物以及使用所述组合物的方法和装置
CN110776745A (zh) * 2019-10-09 2020-02-11 苏州欣天新精密机械有限公司 一种热界面材料的制备方法
CN114761492B (zh) * 2019-12-05 2024-06-11 美国陶氏有机硅公司 高度导热的可流动有机硅组合物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1602372A (en) * 1977-05-18 1981-11-11 Hotfoil Ltd Electrically conductive rubber composition
JPS5822055B2 (ja) * 1979-06-15 1983-05-06 昭和電工株式会社 高分子物質用配合剤
US4450282A (en) * 1981-07-29 1984-05-22 General Electric Company Catalyst for a process for producing silicones
US4505955A (en) * 1981-07-30 1985-03-19 Dow Corning Corporation Mineral particles bound with silicone elastomeric emulsion
US4518655A (en) * 1983-11-25 1985-05-21 Xerox Corporation Fusing member for electrostatographic copiers
GB8724958D0 (en) * 1987-10-24 1987-11-25 Dow Corning Sa Filled compositions & additives
US5202362A (en) * 1991-09-09 1993-04-13 Intech Specialties Co., Inc. Syringeable ear plug molding putty composition
TW250486B (da) * 1992-08-24 1995-07-01 Gen Electric
US5319040A (en) * 1993-03-12 1994-06-07 General Electric Company Method for making substantially silanol-free silicone resin powder, product and use

Also Published As

Publication number Publication date
ATE226606T1 (de) 2002-11-15
CN1136258C (zh) 2004-01-28
US6284829B1 (en) 2001-09-04
TW341583B (en) 1998-10-01
PT868474E (pt) 2003-03-31
CA2238886A1 (fr) 1997-07-03
MX9804859A (es) 1998-10-31
EP0868474B1 (fr) 2002-10-23
WO1997023555A1 (fr) 1997-07-03
FR2742763A1 (fr) 1997-06-27
DE69624499T2 (de) 2003-09-04
FR2742763B1 (fr) 1998-03-06
ES2181931T3 (es) 2003-03-01
EP0868474A1 (fr) 1998-10-07
CA2238886C (fr) 2002-09-17
CN1205721A (zh) 1999-01-20
DE69624499D1 (de) 2002-11-28

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