DK0868474T3 - Silicone-elastomer med en høj termisk ledningsevne - Google Patents
Silicone-elastomer med en høj termisk ledningsevneInfo
- Publication number
- DK0868474T3 DK0868474T3 DK96943158T DK96943158T DK0868474T3 DK 0868474 T3 DK0868474 T3 DK 0868474T3 DK 96943158 T DK96943158 T DK 96943158T DK 96943158 T DK96943158 T DK 96943158T DK 0868474 T3 DK0868474 T3 DK 0868474T3
- Authority
- DK
- Denmark
- Prior art keywords
- thermal conductivity
- filler
- high thermal
- silicone elastomer
- optionally
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9515776A FR2742763B1 (fr) | 1995-12-22 | 1995-12-22 | Elastomere silicone a haute conductibilite thermique |
PCT/FR1996/002042 WO1997023555A1 (fr) | 1995-12-22 | 1996-12-20 | Elastomere silicone a haute conductibilite thermique |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0868474T3 true DK0868474T3 (da) | 2002-12-30 |
Family
ID=9486180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK96943158T DK0868474T3 (da) | 1995-12-22 | 1996-12-20 | Silicone-elastomer med en høj termisk ledningsevne |
Country Status (13)
Country | Link |
---|---|
US (1) | US6284829B1 (da) |
EP (1) | EP0868474B1 (da) |
CN (1) | CN1136258C (da) |
AT (1) | ATE226606T1 (da) |
CA (1) | CA2238886C (da) |
DE (1) | DE69624499T2 (da) |
DK (1) | DK0868474T3 (da) |
ES (1) | ES2181931T3 (da) |
FR (1) | FR2742763B1 (da) |
MX (1) | MX9804859A (da) |
PT (1) | PT868474E (da) |
TW (1) | TW341583B (da) |
WO (1) | WO1997023555A1 (da) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1478688A1 (de) * | 2002-02-28 | 2004-11-24 | Siemens Aktiengesellschaft | Hochgefülltes giessharzsystem |
US20030168731A1 (en) * | 2002-03-11 | 2003-09-11 | Matayabas James Christopher | Thermal interface material and method of fabricating the same |
EP1585784A1 (de) * | 2003-01-23 | 2005-10-19 | Siemens Aktiengesellschaft | Hochgefülltes giessharzsystem |
JP2004352947A (ja) * | 2003-05-30 | 2004-12-16 | Shin Etsu Chem Co Ltd | 室温硬化型熱伝導性シリコーンゴム組成物 |
JP4219793B2 (ja) * | 2003-11-25 | 2009-02-04 | 信越化学工業株式会社 | 放熱用シリコーングリース組成物 |
WO2005066252A2 (en) * | 2004-01-08 | 2005-07-21 | Showa Denko K.K. | Inorganic powder, resin composition filled with the powder and use thereof |
JP4828146B2 (ja) * | 2005-03-30 | 2011-11-30 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
JP4828145B2 (ja) * | 2005-03-30 | 2011-11-30 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
CA2605209C (en) * | 2005-04-19 | 2013-10-22 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal base circuit board, light-emitting diode and led light source unit |
CN1978582A (zh) * | 2005-12-09 | 2007-06-13 | 富准精密工业(深圳)有限公司 | 导热膏及使用该导热膏的电子装置 |
US20080166552A1 (en) * | 2006-11-06 | 2008-07-10 | Arlon, Inc. | Silicone based compositions for thermal interface materials |
WO2008082001A1 (ja) * | 2006-12-28 | 2008-07-10 | Dow Corning Toray Co., Ltd. | 加熱硬化性シリコーンゴム組成物 |
US7736470B2 (en) * | 2007-01-25 | 2010-06-15 | Exxonmobil Research And Engineering Company | Coker feed method and apparatus |
DE102007019942A1 (de) | 2007-04-27 | 2008-11-06 | Continental Aktiengesellschaft | Kautschukmischung mit verbesserter Rückprallelastizität |
JP2013513233A (ja) | 2009-12-04 | 2013-04-18 | エー ビー ビー リサーチ リミテッド | 高電圧サージアレスタ |
CN102234427B (zh) * | 2010-04-29 | 2013-01-30 | 比亚迪股份有限公司 | 一种硅橡胶组合物及硅橡胶的制备方法 |
CN105358615B (zh) * | 2013-09-03 | 2017-12-22 | 道康宁公司 | 用于有机硅封装材料的添加剂 |
KR102297295B1 (ko) * | 2014-03-27 | 2021-09-02 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 충전된 폴리다이오가노실록산-함유 조성물, 및 그의 사용 방법 |
WO2015193558A1 (en) * | 2014-06-19 | 2015-12-23 | Inkron Oy | A method of making a siloxane polymer composition |
JP6845343B2 (ja) | 2017-02-08 | 2021-03-17 | エルケム・シリコーンズ・ユーエスエイ・コーポレーションElkem Silicones Usa Corp. | 温度管理の改善された二次電池パック |
JP6941810B2 (ja) * | 2017-04-19 | 2021-09-29 | パナソニックIpマネジメント株式会社 | 樹脂組成物ならびにそれを用いた電子部品および電子機器 |
CN113166545B (zh) * | 2018-12-29 | 2023-05-23 | 陶氏环球技术有限责任公司 | 包含mgo填料的导热组合物以及使用所述组合物的方法和装置 |
CN110776745A (zh) * | 2019-10-09 | 2020-02-11 | 苏州欣天新精密机械有限公司 | 一种热界面材料的制备方法 |
CN114761492B (zh) * | 2019-12-05 | 2024-06-11 | 美国陶氏有机硅公司 | 高度导热的可流动有机硅组合物 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1602372A (en) * | 1977-05-18 | 1981-11-11 | Hotfoil Ltd | Electrically conductive rubber composition |
JPS5822055B2 (ja) * | 1979-06-15 | 1983-05-06 | 昭和電工株式会社 | 高分子物質用配合剤 |
US4450282A (en) * | 1981-07-29 | 1984-05-22 | General Electric Company | Catalyst for a process for producing silicones |
US4505955A (en) * | 1981-07-30 | 1985-03-19 | Dow Corning Corporation | Mineral particles bound with silicone elastomeric emulsion |
US4518655A (en) * | 1983-11-25 | 1985-05-21 | Xerox Corporation | Fusing member for electrostatographic copiers |
GB8724958D0 (en) * | 1987-10-24 | 1987-11-25 | Dow Corning Sa | Filled compositions & additives |
US5202362A (en) * | 1991-09-09 | 1993-04-13 | Intech Specialties Co., Inc. | Syringeable ear plug molding putty composition |
TW250486B (da) * | 1992-08-24 | 1995-07-01 | Gen Electric | |
US5319040A (en) * | 1993-03-12 | 1994-06-07 | General Electric Company | Method for making substantially silanol-free silicone resin powder, product and use |
-
1995
- 1995-12-22 FR FR9515776A patent/FR2742763B1/fr not_active Expired - Fee Related
-
1996
- 1996-12-20 WO PCT/FR1996/002042 patent/WO1997023555A1/fr active IP Right Grant
- 1996-12-20 CA CA002238886A patent/CA2238886C/fr not_active Expired - Fee Related
- 1996-12-20 PT PT96943158T patent/PT868474E/pt unknown
- 1996-12-20 DK DK96943158T patent/DK0868474T3/da active
- 1996-12-20 DE DE69624499T patent/DE69624499T2/de not_active Expired - Fee Related
- 1996-12-20 EP EP96943158A patent/EP0868474B1/fr not_active Expired - Lifetime
- 1996-12-20 ES ES96943158T patent/ES2181931T3/es not_active Expired - Lifetime
- 1996-12-20 AT AT96943158T patent/ATE226606T1/de not_active IP Right Cessation
- 1996-12-20 CN CNB961992018A patent/CN1136258C/zh not_active Expired - Fee Related
- 1996-12-20 TW TW085115796A patent/TW341583B/zh active
-
1998
- 1998-06-17 MX MX9804859A patent/MX9804859A/es not_active IP Right Cessation
-
2000
- 2000-06-09 US US09/590,803 patent/US6284829B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ATE226606T1 (de) | 2002-11-15 |
CN1136258C (zh) | 2004-01-28 |
US6284829B1 (en) | 2001-09-04 |
TW341583B (en) | 1998-10-01 |
PT868474E (pt) | 2003-03-31 |
CA2238886A1 (fr) | 1997-07-03 |
MX9804859A (es) | 1998-10-31 |
EP0868474B1 (fr) | 2002-10-23 |
WO1997023555A1 (fr) | 1997-07-03 |
FR2742763A1 (fr) | 1997-06-27 |
DE69624499T2 (de) | 2003-09-04 |
FR2742763B1 (fr) | 1998-03-06 |
ES2181931T3 (es) | 2003-03-01 |
EP0868474A1 (fr) | 1998-10-07 |
CA2238886C (fr) | 2002-09-17 |
CN1205721A (zh) | 1999-01-20 |
DE69624499D1 (de) | 2002-11-28 |
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