ATE226606T1 - Silikon-elastomer mit hoher wärmeleitfähigkeit - Google Patents
Silikon-elastomer mit hoher wärmeleitfähigkeitInfo
- Publication number
- ATE226606T1 ATE226606T1 AT96943158T AT96943158T ATE226606T1 AT E226606 T1 ATE226606 T1 AT E226606T1 AT 96943158 T AT96943158 T AT 96943158T AT 96943158 T AT96943158 T AT 96943158T AT E226606 T1 ATE226606 T1 AT E226606T1
- Authority
- AT
- Austria
- Prior art keywords
- thermal conductivity
- filler
- high thermal
- silicone elastomer
- optionally
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9515776A FR2742763B1 (fr) | 1995-12-22 | 1995-12-22 | Elastomere silicone a haute conductibilite thermique |
PCT/FR1996/002042 WO1997023555A1 (fr) | 1995-12-22 | 1996-12-20 | Elastomere silicone a haute conductibilite thermique |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE226606T1 true ATE226606T1 (de) | 2002-11-15 |
Family
ID=9486180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT96943158T ATE226606T1 (de) | 1995-12-22 | 1996-12-20 | Silikon-elastomer mit hoher wärmeleitfähigkeit |
Country Status (13)
Country | Link |
---|---|
US (1) | US6284829B1 (de) |
EP (1) | EP0868474B1 (de) |
CN (1) | CN1136258C (de) |
AT (1) | ATE226606T1 (de) |
CA (1) | CA2238886C (de) |
DE (1) | DE69624499T2 (de) |
DK (1) | DK0868474T3 (de) |
ES (1) | ES2181931T3 (de) |
FR (1) | FR2742763B1 (de) |
MX (1) | MX9804859A (de) |
PT (1) | PT868474E (de) |
TW (1) | TW341583B (de) |
WO (1) | WO1997023555A1 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2003214014A1 (en) * | 2002-02-28 | 2003-09-09 | Siemens Aktiengesellschaft | Highly loaded casting resin system |
US20030168731A1 (en) * | 2002-03-11 | 2003-09-11 | Matayabas James Christopher | Thermal interface material and method of fabricating the same |
WO2004065469A1 (de) * | 2003-01-23 | 2004-08-05 | Siemens Aktiengesellschaft | Hochgefülltes giessharzsystem |
JP2004352947A (ja) * | 2003-05-30 | 2004-12-16 | Shin Etsu Chem Co Ltd | 室温硬化型熱伝導性シリコーンゴム組成物 |
JP4219793B2 (ja) * | 2003-11-25 | 2009-02-04 | 信越化学工業株式会社 | 放熱用シリコーングリース組成物 |
WO2005066252A2 (en) * | 2004-01-08 | 2005-07-21 | Showa Denko K.K. | Inorganic powder, resin composition filled with the powder and use thereof |
JP4828146B2 (ja) * | 2005-03-30 | 2011-11-30 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
JP4828145B2 (ja) * | 2005-03-30 | 2011-11-30 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
US8071882B2 (en) * | 2005-04-19 | 2011-12-06 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal base circuit board, LED, and LED light source unit |
CN1978582A (zh) * | 2005-12-09 | 2007-06-13 | 富准精密工业(深圳)有限公司 | 导热膏及使用该导热膏的电子装置 |
US20080166552A1 (en) * | 2006-11-06 | 2008-07-10 | Arlon, Inc. | Silicone based compositions for thermal interface materials |
JP5410762B2 (ja) * | 2006-12-28 | 2014-02-05 | 東レ・ダウコーニング株式会社 | 加熱硬化性シリコーンゴム組成物 |
US7736470B2 (en) * | 2007-01-25 | 2010-06-15 | Exxonmobil Research And Engineering Company | Coker feed method and apparatus |
DE102007019942A1 (de) | 2007-04-27 | 2008-11-06 | Continental Aktiengesellschaft | Kautschukmischung mit verbesserter Rückprallelastizität |
CN106935342A (zh) * | 2009-12-04 | 2017-07-07 | Abb研究有限公司 | 高压电涌避雷器 |
CN102234427B (zh) * | 2010-04-29 | 2013-01-30 | 比亚迪股份有限公司 | 一种硅橡胶组合物及硅橡胶的制备方法 |
EP3041897B1 (de) * | 2013-09-03 | 2017-05-24 | Dow Corning Corporation | Additiv für eine silikoneinkapselungsmasse |
JP6691870B2 (ja) * | 2014-03-27 | 2020-05-13 | スリーエム イノベイティブ プロパティズ カンパニー | 充填されたポリジオルガノシロキサンを含有する組成物、及びこれを使用する方法 |
JP6765368B2 (ja) | 2014-06-19 | 2020-10-07 | インクロン オサケユキチュアInkron Oy | シロキサンポリマー組成物の製造方法 |
EP4243143A3 (de) | 2017-02-08 | 2023-11-01 | Elkem Silicones USA Corp. | Sekundärbatteriepack mit verbesserter thermischer verwaltung |
JP6941810B2 (ja) * | 2017-04-19 | 2021-09-29 | パナソニックIpマネジメント株式会社 | 樹脂組成物ならびにそれを用いた電子部品および電子機器 |
US20210403716A1 (en) * | 2018-12-29 | 2021-12-30 | Dow Global Technologies Llc | Thermally conductive composition containing mgo filler and methods and devices in which said composition is used |
CN110776745A (zh) * | 2019-10-09 | 2020-02-11 | 苏州欣天新精密机械有限公司 | 一种热界面材料的制备方法 |
WO2021109051A1 (en) * | 2019-12-05 | 2021-06-10 | Dow Silicones Corporation | Highly thermally conductive flowable silicone composition |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1602372A (en) * | 1977-05-18 | 1981-11-11 | Hotfoil Ltd | Electrically conductive rubber composition |
JPS5822055B2 (ja) * | 1979-06-15 | 1983-05-06 | 昭和電工株式会社 | 高分子物質用配合剤 |
US4450282A (en) * | 1981-07-29 | 1984-05-22 | General Electric Company | Catalyst for a process for producing silicones |
US4505955A (en) * | 1981-07-30 | 1985-03-19 | Dow Corning Corporation | Mineral particles bound with silicone elastomeric emulsion |
US4518655A (en) * | 1983-11-25 | 1985-05-21 | Xerox Corporation | Fusing member for electrostatographic copiers |
GB8724958D0 (en) * | 1987-10-24 | 1987-11-25 | Dow Corning Sa | Filled compositions & additives |
US5202362A (en) * | 1991-09-09 | 1993-04-13 | Intech Specialties Co., Inc. | Syringeable ear plug molding putty composition |
TW250486B (de) * | 1992-08-24 | 1995-07-01 | Gen Electric | |
US5319040A (en) * | 1993-03-12 | 1994-06-07 | General Electric Company | Method for making substantially silanol-free silicone resin powder, product and use |
-
1995
- 1995-12-22 FR FR9515776A patent/FR2742763B1/fr not_active Expired - Fee Related
-
1996
- 1996-12-20 AT AT96943158T patent/ATE226606T1/de not_active IP Right Cessation
- 1996-12-20 EP EP96943158A patent/EP0868474B1/de not_active Expired - Lifetime
- 1996-12-20 CA CA002238886A patent/CA2238886C/fr not_active Expired - Fee Related
- 1996-12-20 WO PCT/FR1996/002042 patent/WO1997023555A1/fr active IP Right Grant
- 1996-12-20 DE DE69624499T patent/DE69624499T2/de not_active Expired - Fee Related
- 1996-12-20 PT PT96943158T patent/PT868474E/pt unknown
- 1996-12-20 TW TW085115796A patent/TW341583B/zh active
- 1996-12-20 DK DK96943158T patent/DK0868474T3/da active
- 1996-12-20 ES ES96943158T patent/ES2181931T3/es not_active Expired - Lifetime
- 1996-12-20 CN CNB961992018A patent/CN1136258C/zh not_active Expired - Fee Related
-
1998
- 1998-06-17 MX MX9804859A patent/MX9804859A/es not_active IP Right Cessation
-
2000
- 2000-06-09 US US09/590,803 patent/US6284829B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2742763B1 (fr) | 1998-03-06 |
WO1997023555A1 (fr) | 1997-07-03 |
DE69624499D1 (de) | 2002-11-28 |
ES2181931T3 (es) | 2003-03-01 |
CN1205721A (zh) | 1999-01-20 |
CN1136258C (zh) | 2004-01-28 |
EP0868474A1 (de) | 1998-10-07 |
TW341583B (en) | 1998-10-01 |
MX9804859A (es) | 1998-10-31 |
PT868474E (pt) | 2003-03-31 |
CA2238886C (fr) | 2002-09-17 |
DE69624499T2 (de) | 2003-09-04 |
EP0868474B1 (de) | 2002-10-23 |
FR2742763A1 (fr) | 1997-06-27 |
US6284829B1 (en) | 2001-09-04 |
CA2238886A1 (fr) | 1997-07-03 |
DK0868474T3 (da) | 2002-12-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification |
Ref document number: 0868474 Country of ref document: EP |
|
REN | Ceased due to non-payment of the annual fee |