JP2001298043A - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法

Info

Publication number
JP2001298043A
JP2001298043A JP2000279987A JP2000279987A JP2001298043A JP 2001298043 A JP2001298043 A JP 2001298043A JP 2000279987 A JP2000279987 A JP 2000279987A JP 2000279987 A JP2000279987 A JP 2000279987A JP 2001298043 A JP2001298043 A JP 2001298043A
Authority
JP
Japan
Prior art keywords
circuit board
semiconductor substrate
semiconductor device
opening
connection conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000279987A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001298043A5 (enrdf_load_stackoverflow
Inventor
Toshihiro Iwasaki
俊寛 岩崎
Keiichiro Wakamiya
敬一郎 若宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2000279987A priority Critical patent/JP2001298043A/ja
Publication of JP2001298043A publication Critical patent/JP2001298043A/ja
Publication of JP2001298043A5 publication Critical patent/JP2001298043A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
    • H01L2224/48481—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a ball bond, i.e. ball on pre-ball
    • H01L2224/48482—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a ball bond, i.e. ball on pre-ball on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2000279987A 2000-02-08 2000-09-14 半導体装置およびその製造方法 Pending JP2001298043A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000279987A JP2001298043A (ja) 2000-02-08 2000-09-14 半導体装置およびその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000030651 2000-02-08
JP2000-30651 2000-02-08
JP2000279987A JP2001298043A (ja) 2000-02-08 2000-09-14 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2001298043A true JP2001298043A (ja) 2001-10-26
JP2001298043A5 JP2001298043A5 (enrdf_load_stackoverflow) 2007-11-01

Family

ID=26585046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000279987A Pending JP2001298043A (ja) 2000-02-08 2000-09-14 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2001298043A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018179265A1 (ja) * 2017-03-30 2018-10-04 シャープ株式会社 表示デバイス、表示デバイスの製造方法、表示デバイスの製造装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234431A (ja) * 1985-11-01 1987-02-14 Minolta Camera Co Ltd 光通信用受信装置
JPS6393124A (ja) * 1986-10-07 1988-04-23 Sharp Corp Ｌｓｉチツプの接続方式
JPH0362542A (ja) * 1989-07-31 1991-03-18 Seiko Epson Corp 半導体装置及びその製造方法
JPH08167630A (ja) * 1994-12-15 1996-06-25 Hitachi Ltd チップ接続構造
JPH0917828A (ja) * 1995-04-28 1997-01-17 Asahi Denka Kenkyusho:Kk 回路基板
JPH09107165A (ja) * 1995-10-13 1997-04-22 Japan Aviation Electron Ind Ltd Ｂｇａ部品実装用基板
JPH09148479A (ja) * 1995-11-21 1997-06-06 Sharp Corp 樹脂封止型半導体装置及びその製造方法
JPH09219415A (ja) * 1996-02-13 1997-08-19 Kokusai Electric Co Ltd ベアチップ薄膜回路素子の実装用配線基板および実装構造
JPH10107091A (ja) * 1996-10-02 1998-04-24 Nec Corp 電子部品の実装構造およびその製造方法
JPH10209204A (ja) * 1997-01-24 1998-08-07 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234431A (ja) * 1985-11-01 1987-02-14 Minolta Camera Co Ltd 光通信用受信装置
JPS6393124A (ja) * 1986-10-07 1988-04-23 Sharp Corp Ｌｓｉチツプの接続方式
JPH0362542A (ja) * 1989-07-31 1991-03-18 Seiko Epson Corp 半導体装置及びその製造方法
JPH08167630A (ja) * 1994-12-15 1996-06-25 Hitachi Ltd チップ接続構造
JPH0917828A (ja) * 1995-04-28 1997-01-17 Asahi Denka Kenkyusho:Kk 回路基板
JPH09107165A (ja) * 1995-10-13 1997-04-22 Japan Aviation Electron Ind Ltd Ｂｇａ部品実装用基板
JPH09148479A (ja) * 1995-11-21 1997-06-06 Sharp Corp 樹脂封止型半導体装置及びその製造方法
JPH09219415A (ja) * 1996-02-13 1997-08-19 Kokusai Electric Co Ltd ベアチップ薄膜回路素子の実装用配線基板および実装構造
JPH10107091A (ja) * 1996-10-02 1998-04-24 Nec Corp 電子部品の実装構造およびその製造方法
JPH10209204A (ja) * 1997-01-24 1998-08-07 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018179265A1 (ja) * 2017-03-30 2018-10-04 シャープ株式会社 表示デバイス、表示デバイスの製造方法、表示デバイスの製造装置

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