JP2001284603A5 - - Google Patents

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Publication number
JP2001284603A5
JP2001284603A5 JP2000089595A JP2000089595A JP2001284603A5 JP 2001284603 A5 JP2001284603 A5 JP 2001284603A5 JP 2000089595 A JP2000089595 A JP 2000089595A JP 2000089595 A JP2000089595 A JP 2000089595A JP 2001284603 A5 JP2001284603 A5 JP 2001284603A5
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JP
Japan
Prior art keywords
silicon substrate
bonding
diaphragm
glass substrate
digging
Prior art date
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Application number
JP2000089595A
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English (en)
Japanese (ja)
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JP4265074B2 (ja
JP2001284603A (ja
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Priority to JP2000089595A priority Critical patent/JP4265074B2/ja
Priority claimed from JP2000089595A external-priority patent/JP4265074B2/ja
Publication of JP2001284603A publication Critical patent/JP2001284603A/ja
Publication of JP2001284603A5 publication Critical patent/JP2001284603A5/ja
Application granted granted Critical
Publication of JP4265074B2 publication Critical patent/JP4265074B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000089595A 2000-03-28 2000-03-28 半導体圧力センサの製造方法 Expired - Fee Related JP4265074B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000089595A JP4265074B2 (ja) 2000-03-28 2000-03-28 半導体圧力センサの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000089595A JP4265074B2 (ja) 2000-03-28 2000-03-28 半導体圧力センサの製造方法

Publications (3)

Publication Number Publication Date
JP2001284603A JP2001284603A (ja) 2001-10-12
JP2001284603A5 true JP2001284603A5 (enExample) 2005-10-20
JP4265074B2 JP4265074B2 (ja) 2009-05-20

Family

ID=18605331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000089595A Expired - Fee Related JP4265074B2 (ja) 2000-03-28 2000-03-28 半導体圧力センサの製造方法

Country Status (1)

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JP (1) JP4265074B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006275961A (ja) * 2005-03-30 2006-10-12 Yamagata Prefecture 半導体センサおよびその製造方法
JP2007292559A (ja) * 2006-04-24 2007-11-08 Mitsumi Electric Co Ltd 半導体圧力センサーの製造方法
WO2011078043A1 (ja) * 2009-12-25 2011-06-30 アルプス電気株式会社 フォースセンサ及びその製造方法
WO2019036525A2 (en) * 2017-08-14 2019-02-21 Component Re-Engineering Company, Inc. METHOD FOR ASSEMBLING QUARTZ PARTS AND QUARTZ ELECTRODES AND OTHER ASSEMBLED QUARTZ DEVICES
CN111554587A (zh) * 2020-07-01 2020-08-18 广州德芯半导体科技有限公司 耐腐蚀绝压芯片的批量制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131892A (en) * 1978-04-05 1979-10-13 Hitachi Ltd Semiconductor pressure converter
JPH07307260A (ja) * 1994-05-13 1995-11-21 Canon Inc 接合体及びその形成法
JP3961182B2 (ja) * 1999-01-29 2007-08-22 セイコーインスツル株式会社 陽極接合方法

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