JP4265074B2 - 半導体圧力センサの製造方法 - Google Patents

半導体圧力センサの製造方法 Download PDF

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Publication number
JP4265074B2
JP4265074B2 JP2000089595A JP2000089595A JP4265074B2 JP 4265074 B2 JP4265074 B2 JP 4265074B2 JP 2000089595 A JP2000089595 A JP 2000089595A JP 2000089595 A JP2000089595 A JP 2000089595A JP 4265074 B2 JP4265074 B2 JP 4265074B2
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Japan
Prior art keywords
diaphragm
silicon substrate
bonding
glass
silicon
Prior art date
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Expired - Fee Related
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JP2000089595A
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English (en)
Japanese (ja)
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JP2001284603A (ja
JP2001284603A5 (enExample
Inventor
宏 齊藤
澄夫 赤井
久和 宮島
万士 片岡
隆司 西條
拓郎 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Electric Works Co Ltd
Original Assignee
Panasonic Corp
Matsushita Electric Works Ltd
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Priority to JP2000089595A priority Critical patent/JP4265074B2/ja
Publication of JP2001284603A publication Critical patent/JP2001284603A/ja
Publication of JP2001284603A5 publication Critical patent/JP2001284603A5/ja
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Publication of JP4265074B2 publication Critical patent/JP4265074B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
JP2000089595A 2000-03-28 2000-03-28 半導体圧力センサの製造方法 Expired - Fee Related JP4265074B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000089595A JP4265074B2 (ja) 2000-03-28 2000-03-28 半導体圧力センサの製造方法

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Application Number Priority Date Filing Date Title
JP2000089595A JP4265074B2 (ja) 2000-03-28 2000-03-28 半導体圧力センサの製造方法

Publications (3)

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JP2001284603A JP2001284603A (ja) 2001-10-12
JP2001284603A5 JP2001284603A5 (enExample) 2005-10-20
JP4265074B2 true JP4265074B2 (ja) 2009-05-20

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JP2000089595A Expired - Fee Related JP4265074B2 (ja) 2000-03-28 2000-03-28 半導体圧力センサの製造方法

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006275961A (ja) * 2005-03-30 2006-10-12 Yamagata Prefecture 半導体センサおよびその製造方法
JP2007292559A (ja) * 2006-04-24 2007-11-08 Mitsumi Electric Co Ltd 半導体圧力センサーの製造方法
EP2518462B1 (en) 2009-12-25 2019-07-24 Alps Alpine Co., Ltd. Force sensor and method of manufacturing the same
TWI791590B (zh) * 2017-08-14 2023-02-11 美商瓦特隆電子製造公司 接合石英件之方法及接合之石英的石英電極及其他裝置
CN111554587A (zh) * 2020-07-01 2020-08-18 广州德芯半导体科技有限公司 耐腐蚀绝压芯片的批量制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131892A (en) * 1978-04-05 1979-10-13 Hitachi Ltd Semiconductor pressure converter
JPH07307260A (ja) * 1994-05-13 1995-11-21 Canon Inc 接合体及びその形成法
JP3961182B2 (ja) * 1999-01-29 2007-08-22 セイコーインスツル株式会社 陽極接合方法

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JP2001284603A (ja) 2001-10-12

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