JP2015512046A - 微小機械測定素子 - Google Patents
微小機械測定素子 Download PDFInfo
- Publication number
- JP2015512046A JP2015512046A JP2014560291A JP2014560291A JP2015512046A JP 2015512046 A JP2015512046 A JP 2015512046A JP 2014560291 A JP2014560291 A JP 2014560291A JP 2014560291 A JP2014560291 A JP 2014560291A JP 2015512046 A JP2015512046 A JP 2015512046A
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- Prior art keywords
- micromechanical
- opening
- measuring element
- sensing element
- cap
- Prior art date
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- 239000012528 membrane Substances 0.000 claims abstract description 35
- 238000005259 measurement Methods 0.000 claims abstract description 34
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 9
- 238000009530 blood pressure measurement Methods 0.000 claims description 6
- 239000002346 layers by function Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 238000001514 detection method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/008—Transmitting or indicating the displacement of flexible diaphragms using piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
- G01L13/02—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
- G01L13/025—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements using diaphragms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
- Measuring Volume Flow (AREA)
Abstract
Description
ベルヌーイの式を利用して、この体積流量の断面積狭窄部の前後での圧力差を用いて等価な静水圧(hydrostatischem Druck)を計算することができる。
2 : 検知素子
21 : メンブレン
211 : 下面
212 : 上面
22 : 抵抗パターン
23 : 導電部
3 : キャップ
4 : 第1の小室
5 : 第1の開口部
6 : 担体
7 : 第2の小室
8 : 第2の開口部
9 : コンタクト面
Claims (15)
- 下面(211)と上面(212)とを有するメンブレン(21)を備えた前記検知素子(2)と、
前記検知素子(2)に直接接続されたキャップ(3)と、
前記検知素子(2)の電気的接続のための少なくとも1つのコンタクト面(9)と、
を備えた微小機械測定素子(1)であって、
前記検知素子(2)および前記キャップ(3)は、第1の小室(4)を形成し、
前記第1の小室(4)は、第1の開口部(5)を備える、
ことを特徴とする、微小機械測定素子。 - 前記検知素子(2)は、前記キャップ(3)に向いていない面が直接基板(6)と接続されており、
前記検知素子(2)および前記担体(6)によって、第2の小室(7)が形成されており、
前記第2の小室(7)は、第2の開口部(8)を備える、
ことを特徴とする、請求項1に記載の微小機械測定素子。 - 前記メンブレン(21)の前記上面(212)は、前記第1の開口部(5)によって第1の媒体が到達可能となっており、
前記メンブレン(21)の下面(211)は、前記第2の開口部(8)によって第2の媒体が到達可能となっている、
ことを特徴とする、請求項2に記載の微小機械測定素子。 - 前記第2の開口部(8)は、前記担体(6)に形成されていることを特徴とする、請求項2または3に記載の微小機械測定素子。
- 前記第2の開口部(8)は、前記検知素子(2)に形成されていることを特徴とする、請求項2または3に記載の微小機械測定素子。
- 前記第1の開口部(5)は、前記キャップ(3)に形成されることを特徴とする、請求項1乃至5のいずれか1項に記載の微小機械測定素子。
- 前記第1の開口部(5)は、前記検知素子(2)および前記担体(6)を貫通して延在することを特徴とする、請求項1乃至5のいずれか1項に記載の微小機械測定素子。
- 前記微小機械測定素子(1)は、複数の外面を備え、
前記第1の開口部(5)および前記第2の開口部(8)は、同じ外面に配設されている、
ことを特徴とする、請求項1乃至7のいずれか1項に記載の微小機械測定素子。 - 前記少なくとも1つのコンタクト面(9)は、前記検知素子(2)の前記キャップ(3)に向いた面で、前記検知素子(2)上に配設されており、
前記少なくとも1つのコンタクト面(9)は、少なくとも部分的に前記キャップ(3)の外側に配設されている、
ことを特徴とする、請求項1乃至8のいずれか1項に記載の微小機械測定素子。 - 前記微小機械測定素子(1)は、相対圧センサおよび/または差圧センサとして形成されていることを特徴とする、請求項1乃至9のいずれか1項に記載の微小機械測定素子。
- 前記微小機械測定素子(1)は、体積流量センサおよび/または流量センサとして形成されていることを特徴とする、請求項1乃至10のいずれか1項に記載の微小機械測定素子。
- 前記検知素子(2)は、圧力測定および/または流量測定のための圧電抵抗性測定ブリッジを形成する、抵抗パターン(22)と導電部(23)とを備える、ことを特徴とする、請求項1乃至11のいずれか1項に記載の微小機械測定素子。
- 前記測定ブリッジは、機能層(複数)によって形成されていることを特徴とする、請求項12に記載の微小機械測定素子。
- 前記担体(6)および/または前記キャップ(3)は、ガラスを備えるか、またはガラスから成ることを特徴とする、請求項1乃至13のいずれか1項に記載の微小機械測定素子。
- 前記担体(6)および/または前記キャップ(3)は、シリコンを備えるか、またはシリコンから成ることを特徴とする、請求項1乃至14のいずれか1項に記載の微小機械測定素子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012102020A DE102012102020A1 (de) | 2012-03-09 | 2012-03-09 | Mikromechanisches Messelement |
DE102012102020.5 | 2012-03-09 | ||
PCT/EP2013/052548 WO2013131711A1 (de) | 2012-03-09 | 2013-02-08 | Mikromechanisches messelement |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016101010A Division JP6236117B2 (ja) | 2012-03-09 | 2016-05-20 | 微小機械測定素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015512046A true JP2015512046A (ja) | 2015-04-23 |
JP6130405B2 JP6130405B2 (ja) | 2017-05-17 |
Family
ID=47714077
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014560291A Active JP6130405B2 (ja) | 2012-03-09 | 2013-02-08 | 微小機械測定素子 |
JP2016101010A Active JP6236117B2 (ja) | 2012-03-09 | 2016-05-20 | 微小機械測定素子 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016101010A Active JP6236117B2 (ja) | 2012-03-09 | 2016-05-20 | 微小機械測定素子 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150047435A1 (ja) |
EP (1) | EP2823274B1 (ja) |
JP (2) | JP6130405B2 (ja) |
DE (1) | DE102012102020A1 (ja) |
WO (1) | WO2013131711A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112129328A (zh) * | 2020-08-13 | 2020-12-25 | 江苏大学 | 一种微型风压风速集成传感器及制作和检测方法 |
JP2021092490A (ja) * | 2019-12-12 | 2021-06-17 | アズビル株式会社 | 差圧計 |
US11340128B2 (en) | 2019-10-09 | 2022-05-24 | Azbil Corporation | Pressure sensor element for measuring differential pressure and a diaphragm base having a set of diaphragms displaced by receiving pressures where a set of pressure inlet passages respectively transmit different pressures to the set of diaphragms |
US11366032B2 (en) | 2019-10-09 | 2022-06-21 | Azbil Corporation | Sensor device with multiple simultaneous pressure measurements |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7389700B2 (ja) * | 2020-03-31 | 2023-11-30 | 日本碍子株式会社 | ガスセンサ |
JP7474173B2 (ja) | 2020-10-02 | 2024-04-24 | 日本碍子株式会社 | ガスセンサ |
CN113432778B (zh) * | 2021-05-25 | 2023-09-29 | 歌尔微电子股份有限公司 | Mems差压传感器及其制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6427275A (en) * | 1988-07-08 | 1989-01-30 | Toshiba Corp | Semiconductor pressure measuring apparatus |
JPH0192634A (ja) * | 1987-10-02 | 1989-04-11 | Yokogawa Electric Corp | 半導体差圧センサ |
JPH01503326A (ja) * | 1986-07-28 | 1989-11-09 | ローズマウント インコ | 媒体分離形差圧センサ |
JPH07103840A (ja) * | 1993-10-05 | 1995-04-21 | Yokogawa Electric Corp | 差圧測定装置 |
JPH08247873A (ja) * | 1995-03-13 | 1996-09-27 | Tokai Rika Co Ltd | 圧力センサ |
JP2005091166A (ja) * | 2003-09-17 | 2005-04-07 | Matsushita Electric Works Ltd | 半導体圧力センサ |
Family Cites Families (11)
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US4905575A (en) * | 1988-10-20 | 1990-03-06 | Rosemount Inc. | Solid state differential pressure sensor with overpressure stop and free edge construction |
US5490034A (en) * | 1989-01-13 | 1996-02-06 | Kopin Corporation | SOI actuators and microsensors |
US5295395A (en) * | 1991-02-07 | 1994-03-22 | Hocker G Benjamin | Diaphragm-based-sensors |
US5323656A (en) * | 1992-05-12 | 1994-06-28 | The Foxboro Company | Overpressure-protected, polysilicon, capacitive differential pressure sensor and method of making the same |
JPH07167724A (ja) * | 1993-12-13 | 1995-07-04 | Omron Corp | 圧力検出方法及び圧力検出器 |
JP3481399B2 (ja) * | 1996-08-30 | 2003-12-22 | 松下電工株式会社 | 圧力センサ |
EP1719993A1 (en) * | 2005-05-06 | 2006-11-08 | STMicroelectronics S.r.l. | Integrated differential pressure sensor and manufacturing process thereof |
JP4929753B2 (ja) * | 2006-02-22 | 2012-05-09 | オムロン株式会社 | 薄膜構造体の形成方法並びに薄膜構造体、振動センサ、圧力センサ及び加速度センサ |
EP2275793A1 (en) * | 2006-05-23 | 2011-01-19 | Sensirion Holding AG | A pressure sensor having a chamber and a method for fabricating the same |
US7644625B2 (en) * | 2007-12-14 | 2010-01-12 | Honeywell International Inc. | Differential pressure sense die based on silicon piezoresistive technology |
US8230745B2 (en) * | 2008-11-19 | 2012-07-31 | Honeywell International Inc. | Wet/wet differential pressure sensor based on microelectronic packaging process |
-
2012
- 2012-03-09 DE DE102012102020A patent/DE102012102020A1/de not_active Withdrawn
-
2013
- 2013-02-08 US US14/383,862 patent/US20150047435A1/en not_active Abandoned
- 2013-02-08 JP JP2014560291A patent/JP6130405B2/ja active Active
- 2013-02-08 WO PCT/EP2013/052548 patent/WO2013131711A1/de active Application Filing
- 2013-02-08 EP EP13704075.4A patent/EP2823274B1/de active Active
-
2016
- 2016-05-20 JP JP2016101010A patent/JP6236117B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01503326A (ja) * | 1986-07-28 | 1989-11-09 | ローズマウント インコ | 媒体分離形差圧センサ |
JPH0192634A (ja) * | 1987-10-02 | 1989-04-11 | Yokogawa Electric Corp | 半導体差圧センサ |
JPS6427275A (en) * | 1988-07-08 | 1989-01-30 | Toshiba Corp | Semiconductor pressure measuring apparatus |
JPH07103840A (ja) * | 1993-10-05 | 1995-04-21 | Yokogawa Electric Corp | 差圧測定装置 |
JPH08247873A (ja) * | 1995-03-13 | 1996-09-27 | Tokai Rika Co Ltd | 圧力センサ |
JP2005091166A (ja) * | 2003-09-17 | 2005-04-07 | Matsushita Electric Works Ltd | 半導体圧力センサ |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11340128B2 (en) | 2019-10-09 | 2022-05-24 | Azbil Corporation | Pressure sensor element for measuring differential pressure and a diaphragm base having a set of diaphragms displaced by receiving pressures where a set of pressure inlet passages respectively transmit different pressures to the set of diaphragms |
US11366032B2 (en) | 2019-10-09 | 2022-06-21 | Azbil Corporation | Sensor device with multiple simultaneous pressure measurements |
JP2021092490A (ja) * | 2019-12-12 | 2021-06-17 | アズビル株式会社 | 差圧計 |
JP7319182B2 (ja) | 2019-12-12 | 2023-08-01 | アズビル株式会社 | 差圧計 |
CN112129328A (zh) * | 2020-08-13 | 2020-12-25 | 江苏大学 | 一种微型风压风速集成传感器及制作和检测方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2823274A1 (de) | 2015-01-14 |
JP6236117B2 (ja) | 2017-11-22 |
EP2823274B1 (de) | 2019-08-14 |
DE102012102020A1 (de) | 2013-09-12 |
US20150047435A1 (en) | 2015-02-19 |
WO2013131711A1 (de) | 2013-09-12 |
JP2016188863A (ja) | 2016-11-04 |
JP6130405B2 (ja) | 2017-05-17 |
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