JP2001244391A5 - - Google Patents

Download PDF

Info

Publication number
JP2001244391A5
JP2001244391A5 JP2000343677A JP2000343677A JP2001244391A5 JP 2001244391 A5 JP2001244391 A5 JP 2001244391A5 JP 2000343677 A JP2000343677 A JP 2000343677A JP 2000343677 A JP2000343677 A JP 2000343677A JP 2001244391 A5 JP2001244391 A5 JP 2001244391A5
Authority
JP
Japan
Prior art keywords
electronic element
chip
chip module
cooling
element chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000343677A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001244391A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000343677A priority Critical patent/JP2001244391A/ja
Priority claimed from JP2000343677A external-priority patent/JP2001244391A/ja
Priority to DE60043767T priority patent/DE60043767D1/de
Priority to EP00127971A priority patent/EP1111677B1/en
Priority to US09/747,517 priority patent/US20010022395A1/en
Publication of JP2001244391A publication Critical patent/JP2001244391A/ja
Priority to US10/262,865 priority patent/US6969907B2/en
Publication of JP2001244391A5 publication Critical patent/JP2001244391A5/ja
Pending legal-status Critical Current

Links

JP2000343677A 1999-12-21 2000-11-10 マルチチップモジュールの冷却構造 Pending JP2001244391A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000343677A JP2001244391A (ja) 1999-12-21 2000-11-10 マルチチップモジュールの冷却構造
DE60043767T DE60043767D1 (de) 1999-12-21 2000-12-20 Kühlstruktur eines Multi-Chip-Moduls
EP00127971A EP1111677B1 (en) 1999-12-21 2000-12-20 Cooling structure for a multichip module
US09/747,517 US20010022395A1 (en) 1999-12-21 2000-12-21 Cooling structure for multichip module
US10/262,865 US6969907B2 (en) 1999-12-21 2002-10-03 Cooling structure for multichip module

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-362058 1999-12-21
JP36205899 1999-12-21
JP2000343677A JP2001244391A (ja) 1999-12-21 2000-11-10 マルチチップモジュールの冷却構造

Publications (2)

Publication Number Publication Date
JP2001244391A JP2001244391A (ja) 2001-09-07
JP2001244391A5 true JP2001244391A5 (enExample) 2007-12-06

Family

ID=26581343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000343677A Pending JP2001244391A (ja) 1999-12-21 2000-11-10 マルチチップモジュールの冷却構造

Country Status (4)

Country Link
US (2) US20010022395A1 (enExample)
EP (1) EP1111677B1 (enExample)
JP (1) JP2001244391A (enExample)
DE (1) DE60043767D1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10102750B4 (de) * 2001-01-22 2006-04-20 Siemens Ag Schaltungsanordnung
JP3627738B2 (ja) * 2001-12-27 2005-03-09 株式会社デンソー 半導体装置
JP3673776B2 (ja) 2002-07-03 2005-07-20 株式会社日立製作所 半導体モジュール及び電力変換装置
JP3780230B2 (ja) * 2002-07-03 2006-05-31 株式会社日立製作所 半導体モジュール及び電力変換装置
US7612443B1 (en) * 2003-09-04 2009-11-03 University Of Notre Dame Du Lac Inter-chip communication
JP2005158917A (ja) * 2003-11-25 2005-06-16 Sharp Corp 電子ヒートポンプ装置、レーザ部品、光ピックアップおよび電子機器
DE102004018477B4 (de) * 2004-04-16 2008-08-21 Infineon Technologies Ag Halbleitermodul
US7091604B2 (en) * 2004-06-04 2006-08-15 Cabot Microelectronics Corporation Three dimensional integrated circuits
US7079396B2 (en) 2004-06-14 2006-07-18 Sun Microsystems, Inc. Memory module cooling
JP2006066464A (ja) * 2004-08-24 2006-03-09 Toyota Industries Corp 半導体装置
US6943293B1 (en) * 2004-09-01 2005-09-13 Delphi Technologies, Inc. High power electronic package with enhanced cooling characteristics
US7589348B2 (en) * 2005-03-14 2009-09-15 Borealis Technical Limited Thermal tunneling gap diode with integrated spacers and vacuum seal
US7462934B2 (en) * 2006-06-20 2008-12-09 Microsoft Corporation Integrated heat sink
US8091614B2 (en) * 2006-11-10 2012-01-10 International Business Machines Corporation Air/fluid cooling system
US7932170B1 (en) 2008-06-23 2011-04-26 Amkor Technology, Inc. Flip chip bump structure and fabrication method
US9620473B1 (en) 2013-01-18 2017-04-11 University Of Notre Dame Du Lac Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment
JP5765357B2 (ja) * 2013-03-22 2015-08-19 カシオ計算機株式会社 回路基板構造、及び電子機器
JP2015082960A (ja) * 2013-10-24 2015-04-27 株式会社オートネットワーク技術研究所 Ｄｃ−ｄｃコンバータ装置
WO2018164160A1 (ja) * 2017-03-10 2018-09-13 株式会社村田製作所 モジュール

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59200495A (ja) * 1983-04-27 1984-11-13 株式会社日立製作所 マルチチツプ・モジユ−ル
JP2708495B2 (ja) * 1988-09-19 1998-02-04 株式会社日立製作所 半導体冷却装置
JP2592308B2 (ja) * 1988-09-30 1997-03-19 株式会社日立製作所 半導体パッケージ及びそれを用いたコンピュータ
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5345107A (en) * 1989-09-25 1994-09-06 Hitachi, Ltd. Cooling apparatus for electronic device
US5611140A (en) * 1989-12-18 1997-03-18 Epoxy Technology, Inc. Method of forming electrically conductive polymer interconnects on electrical substrates
FR2665046A1 (fr) * 1990-07-20 1992-01-24 Thomson Csf Procede et dispositif pour le montage en parallele de composants de puissance a semi-conducteurs.
US5239448A (en) * 1991-10-28 1993-08-24 International Business Machines Corporation Formulation of multichip modules
US5369552A (en) * 1992-07-14 1994-11-29 Ncr Corporation Multi-chip module with multiple compartments
US5323292A (en) * 1992-10-06 1994-06-21 Hewlett-Packard Company Integrated multi-chip module having a conformal chip/heat exchanger interface
US5500555A (en) * 1994-04-11 1996-03-19 Lsi Logic Corporation Multi-layer semiconductor package substrate with thermally-conductive prepeg layer
JP2926537B2 (ja) * 1994-12-15 1999-07-28 株式会社日立製作所 マルチチップモジュ−ルの冷却装置
JPH08195455A (ja) 1995-01-17 1996-07-30 Hitachi Ltd 半導体冷却装置
JPH08204068A (ja) * 1995-01-20 1996-08-09 Fuji Electric Co Ltd モジュール構造の半導体装置
US5642262A (en) * 1995-02-23 1997-06-24 Altera Corporation High-density programmable logic device in a multi-chip module package with improved interconnect scheme
JP3058047B2 (ja) * 1995-04-04 2000-07-04 株式会社日立製作所 マルチチップモジュールの封止冷却構造
JPH0945827A (ja) * 1995-08-02 1997-02-14 Hitachi Ltd 半導体装置
US5694297A (en) * 1995-09-05 1997-12-02 Astec International Limited Integrated circuit mounting structure including a switching power supply
KR100211058B1 (ko) * 1995-12-23 1999-07-15 이계철 멀티칩 모듈의 냉각장치 및 방법
US5808874A (en) * 1996-05-02 1998-09-15 Tessera, Inc. Microelectronic connections with liquid conductive elements
WO1998012748A1 (en) * 1996-09-18 1998-03-26 Hitachi, Ltd. Junction semiconductor module
DE19651528B4 (de) * 1996-12-11 2005-10-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Chipanordnung und Verfahren zum Herstellen derselben
US5900674A (en) * 1996-12-23 1999-05-04 General Electric Company Interface structures for electronic devices
JP3241639B2 (ja) * 1997-06-30 2001-12-25 日本電気株式会社 マルチチップモジュールの冷却構造およびその製造方法
JPH11121666A (ja) * 1997-10-20 1999-04-30 Fujitsu Ltd マルチチップモジュールの冷却装置
US6393169B1 (en) * 1997-12-19 2002-05-21 Intel Corporation Method and apparatus for providing optical interconnection
US5930135A (en) * 1998-01-20 1999-07-27 Reliance Electric Industrial Company Heat sink apparatus and method for making the same
US6392296B1 (en) * 1998-08-31 2002-05-21 Micron Technology, Inc. Silicon interposer with optical connections
US6144013A (en) * 1999-07-01 2000-11-07 International Business Machines Corporation Local humidity control system for low temperature electronic module
US20020000239A1 (en) * 1999-09-27 2002-01-03 Krishna G. Sachdev Removal of cured silicone adhesive for reworking electronic components
US6366461B1 (en) * 1999-09-29 2002-04-02 Silicon Graphics, Inc. System and method for cooling electronic components

Similar Documents

Publication Publication Date Title
JP2001244391A5 (enExample)
US6943293B1 (en) High power electronic package with enhanced cooling characteristics
US20050057903A1 (en) Cooling structure for electronic element
KR930015998A (ko) 고전력 전자 소자에 의해 발생된 열의 소산성이 개선된 회로 팩
EP1761114A3 (en) Circuit board
DE50014506D1 (de) Leistungshalbleitermodul
SE0402262L (sv) Kretsarrangemang för kylning av ytmonterade halvledare
JP2001244391A (ja) マルチチップモジュールの冷却構造
CA2334524A1 (en) Electronic apparatus provided with an electronic circuit substrate having high heat dissipation
US20090039382A1 (en) Light emitting diode package structure
US20080156520A1 (en) Complex printed circuit board structure
JP2001135758A (ja) パワーモジュールの放熱構造
JP4085236B2 (ja) 冷却機構付きパワーモジュール及びその冷却方法
KR100756535B1 (ko) 피씨비 생산 기법을 응용한 고효율 방열기 구조 및 이를이용한 방열기 일체형 열전소자 구조.
JP4712948B2 (ja) 半導体装置
JP2005260237A (ja) 半導体素子冷却用モジュール
US7606034B2 (en) Thermally enhanced memory module
JP6503650B2 (ja) 電力変換装置の冷却構造
JP4759716B2 (ja) パワー半導体モジュール
TW202301073A (zh) 具主動式散熱之儲存裝置
KR20000019706A (ko) 열전 냉각기를 갖는 반도체 소자 모듈과 그의 방열 시스템
GB2335075A (en) Heat transfer from a single electronic device
JPH0817533A (ja) 集積回路パッケージ用の放熱機能付きソケット
JP4424818B2 (ja) 電源装置
JPS61172358A (ja) ペルチエ冷却法利用の集積回路