SE0402262L - Kretsarrangemang för kylning av ytmonterade halvledare - Google Patents

Kretsarrangemang för kylning av ytmonterade halvledare

Info

Publication number
SE0402262L
SE0402262L SE0402262A SE0402262A SE0402262L SE 0402262 L SE0402262 L SE 0402262L SE 0402262 A SE0402262 A SE 0402262A SE 0402262 A SE0402262 A SE 0402262A SE 0402262 L SE0402262 L SE 0402262L
Authority
SE
Sweden
Prior art keywords
circuit board
heat
circuit arrangement
conductor
semi
Prior art date
Application number
SE0402262A
Other languages
English (en)
Other versions
SE529673C2 (sv
SE0402262D0 (sv
Inventor
Thord Agne Gustaf Nilsson
Ulf Bengt Ingemar Karlsson
Jan Anders Berglund
Ola Ro
Carl Erik Mikael Foerborgen
Erik Haakan Roecklinger
Original Assignee
Danaher Motion Stockholm Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danaher Motion Stockholm Ab filed Critical Danaher Motion Stockholm Ab
Priority to SE0402262A priority Critical patent/SE529673C2/sv
Publication of SE0402262D0 publication Critical patent/SE0402262D0/sv
Priority to EP05445068A priority patent/EP1638384A1/en
Priority to US11/228,886 priority patent/US20060061969A1/en
Publication of SE0402262L publication Critical patent/SE0402262L/sv
Publication of SE529673C2 publication Critical patent/SE529673C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
SE0402262A 2004-09-20 2004-09-20 Kretsarrangemang för kylning av ytmonterade halvledare SE529673C2 (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0402262A SE529673C2 (sv) 2004-09-20 2004-09-20 Kretsarrangemang för kylning av ytmonterade halvledare
EP05445068A EP1638384A1 (en) 2004-09-20 2005-09-12 Circuit arrangement for cooling of surface mounted semi-conductors
US11/228,886 US20060061969A1 (en) 2004-09-20 2005-09-16 Circuit arrangement for cooling of surface mounted semi-conductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0402262A SE529673C2 (sv) 2004-09-20 2004-09-20 Kretsarrangemang för kylning av ytmonterade halvledare

Publications (3)

Publication Number Publication Date
SE0402262D0 SE0402262D0 (sv) 2004-09-20
SE0402262L true SE0402262L (sv) 2006-03-21
SE529673C2 SE529673C2 (sv) 2007-10-16

Family

ID=33308775

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0402262A SE529673C2 (sv) 2004-09-20 2004-09-20 Kretsarrangemang för kylning av ytmonterade halvledare

Country Status (3)

Country Link
US (1) US20060061969A1 (sv)
EP (1) EP1638384A1 (sv)
SE (1) SE529673C2 (sv)

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JP2008060430A (ja) * 2006-08-31 2008-03-13 Daikin Ind Ltd 電力変換装置
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ES2476596T3 (es) * 2008-04-29 2014-07-15 Agie Charmilles Sa Unidad de placa de circuitos impresos y procedimiento para su fabricación
ES2347864B1 (es) * 2010-06-11 2011-06-16 Zertan S.A. Sistema de disipacion de calor para transistores de potencia.
EP2648495B1 (en) * 2012-04-04 2015-02-25 Inmotion Technologies AB Switched power converter
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CN103809708A (zh) * 2012-11-07 2014-05-21 辉达公司 平板电子设备及其辅助散热装置、以及两者的组件
FR2999863B1 (fr) * 2012-12-14 2019-05-17 Valeo Systemes Thermiques Circuit imprime comportant un insert caloporteur
JP6287659B2 (ja) * 2014-07-22 2018-03-07 株式会社オートネットワーク技術研究所 回路構成体
JP6287815B2 (ja) * 2014-12-24 2018-03-07 株式会社オートネットワーク技術研究所 回路構成体の製造方法
US10504813B2 (en) * 2016-09-30 2019-12-10 Astec International Limited Heat sink assemblies for surface mounted devices
EP3310140B1 (en) 2016-10-14 2021-07-14 Vitesco Technologies GmbH Mounting assembly with a heatsink
US10199904B2 (en) 2017-02-23 2019-02-05 Schaft Inc. Cooling a heat-generating electronic device
FR3065114B1 (fr) * 2017-04-11 2019-12-20 Valeo Systemes De Controle Moteur Dispositif electrique et procede d'assemblage du dispositif electrique
CN108336892B (zh) * 2017-05-25 2021-11-16 泰达电子股份有限公司 电源模块及其组装结构与组装方法
US11647611B2 (en) * 2019-04-05 2023-05-09 Dana Tm4 Inc. Thermal interface for plurality of discrete electronic devices
KR20230168522A (ko) * 2022-06-07 2023-12-14 현대모비스 주식회사 파워모듈 팩

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Also Published As

Publication number Publication date
US20060061969A1 (en) 2006-03-23
SE529673C2 (sv) 2007-10-16
SE0402262D0 (sv) 2004-09-20
EP1638384A1 (en) 2006-03-22

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