FR2999863B1 - Circuit imprime comportant un insert caloporteur - Google Patents
Circuit imprime comportant un insert caloporteur Download PDFInfo
- Publication number
- FR2999863B1 FR2999863B1 FR1262093A FR1262093A FR2999863B1 FR 2999863 B1 FR2999863 B1 FR 2999863B1 FR 1262093 A FR1262093 A FR 1262093A FR 1262093 A FR1262093 A FR 1262093A FR 2999863 B1 FR2999863 B1 FR 2999863B1
- Authority
- FR
- France
- Prior art keywords
- insert
- printed circuit
- caloporator
- face
- permanent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2072—Anchoring, i.e. one structure gripping into another
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Circuit imprimé comportant une première face, une deuxième face et au moins un insert d'un matériau caloporteur caractérisé en ce que : - l'insert est permanent, - une deuxième face de l'insert est saillante de la deuxième face du circuit imprimé.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1262093A FR2999863B1 (fr) | 2012-12-14 | 2012-12-14 | Circuit imprime comportant un insert caloporteur |
PCT/EP2013/076567 WO2014091000A2 (fr) | 2012-12-14 | 2013-12-13 | Circuit imprimé comportant un insert caloporteur |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1262093 | 2012-12-14 | ||
FR1262093A FR2999863B1 (fr) | 2012-12-14 | 2012-12-14 | Circuit imprime comportant un insert caloporteur |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2999863A1 FR2999863A1 (fr) | 2014-06-20 |
FR2999863B1 true FR2999863B1 (fr) | 2019-05-17 |
Family
ID=48468402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1262093A Active FR2999863B1 (fr) | 2012-12-14 | 2012-12-14 | Circuit imprime comportant un insert caloporteur |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2999863B1 (fr) |
WO (1) | WO2014091000A2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10785864B2 (en) | 2017-09-21 | 2020-09-22 | Amazon Technologies, Inc. | Printed circuit board with heat sink |
US10476188B2 (en) | 2017-11-14 | 2019-11-12 | Amazon Technologies, Inc. | Printed circuit board with embedded lateral connector |
CN111315113A (zh) * | 2019-12-17 | 2020-06-19 | 乐健科技(珠海)有限公司 | 内嵌陶瓷散热体的电路板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5099395A (en) * | 1987-10-11 | 1992-03-24 | Ibiden Co. Ltd. | Circuit board for mounting electronic components |
US6295200B1 (en) * | 2000-02-23 | 2001-09-25 | Motorola, Inc. | Carrier assembly and method |
DE60315469T2 (de) * | 2003-10-29 | 2008-04-24 | Power One Italy S.P.A. | Wärmeableiteinsatz, Schaltung mit einem solchen Einsatz und Verfahren zur Herstellung |
US20050180111A1 (en) * | 2004-02-18 | 2005-08-18 | Bamesberger Brett E. | Low thermal stress composite heat sink assembly |
SE529673C2 (sv) * | 2004-09-20 | 2007-10-16 | Danaher Motion Stockholm Ab | Kretsarrangemang för kylning av ytmonterade halvledare |
US8927872B2 (en) * | 2009-02-20 | 2015-01-06 | Telefonaktiebolaget L M Ericsson (Publ) | Thermal pad and method of forming the same |
-
2012
- 2012-12-14 FR FR1262093A patent/FR2999863B1/fr active Active
-
2013
- 2013-12-13 WO PCT/EP2013/076567 patent/WO2014091000A2/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2014091000A2 (fr) | 2014-06-19 |
FR2999863A1 (fr) | 2014-06-20 |
WO2014091000A3 (fr) | 2014-08-07 |
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Legal Events
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PLFP | Fee payment |
Year of fee payment: 4 |
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PLFP | Fee payment |
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PLFP | Fee payment |
Year of fee payment: 12 |