WO2014091000A3 - Circuit imprimé comportant un insert caloporteur - Google Patents
Circuit imprimé comportant un insert caloporteur Download PDFInfo
- Publication number
- WO2014091000A3 WO2014091000A3 PCT/EP2013/076567 EP2013076567W WO2014091000A3 WO 2014091000 A3 WO2014091000 A3 WO 2014091000A3 EP 2013076567 W EP2013076567 W EP 2013076567W WO 2014091000 A3 WO2014091000 A3 WO 2014091000A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- printed circuit
- heat
- insert
- transport insert
- transport
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2072—Anchoring, i.e. one structure gripping into another
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Circuit imprimé comportant une première face, une deuxième face et au moins un insert d'un matériau caloporteur caractérisé en ce que : - l'insert est permanent, - une deuxième face de l'insert est saillante de la deuxième face du circuit imprimé.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1262093 | 2012-12-14 | ||
FR1262093A FR2999863B1 (fr) | 2012-12-14 | 2012-12-14 | Circuit imprime comportant un insert caloporteur |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2014091000A2 WO2014091000A2 (fr) | 2014-06-19 |
WO2014091000A3 true WO2014091000A3 (fr) | 2014-08-07 |
Family
ID=48468402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2013/076567 WO2014091000A2 (fr) | 2012-12-14 | 2013-12-13 | Circuit imprimé comportant un insert caloporteur |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2999863B1 (fr) |
WO (1) | WO2014091000A2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10785864B2 (en) | 2017-09-21 | 2020-09-22 | Amazon Technologies, Inc. | Printed circuit board with heat sink |
US10476188B2 (en) | 2017-11-14 | 2019-11-12 | Amazon Technologies, Inc. | Printed circuit board with embedded lateral connector |
CN111315113A (zh) * | 2019-12-17 | 2020-06-19 | 乐健科技(珠海)有限公司 | 内嵌陶瓷散热体的电路板 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5099395A (en) * | 1987-10-11 | 1992-03-24 | Ibiden Co. Ltd. | Circuit board for mounting electronic components |
US6295200B1 (en) * | 2000-02-23 | 2001-09-25 | Motorola, Inc. | Carrier assembly and method |
EP1528847A1 (fr) * | 2003-10-29 | 2005-05-04 | Magnetek S.p.A. | Insert dissipant la chaleur, circuit comprenant ledit insert et méthode de production |
US20050180111A1 (en) * | 2004-02-18 | 2005-08-18 | Bamesberger Brett E. | Low thermal stress composite heat sink assembly |
US20060061969A1 (en) * | 2004-09-20 | 2006-03-23 | Danaher Motion Stockholm Ab | Circuit arrangement for cooling of surface mounted semi-conductors |
US20120024575A1 (en) * | 2009-02-20 | 2012-02-02 | Telefonaktiebolaget Lm Ericsson (Publ) | Thermal pad and method of forming the same |
-
2012
- 2012-12-14 FR FR1262093A patent/FR2999863B1/fr active Active
-
2013
- 2013-12-13 WO PCT/EP2013/076567 patent/WO2014091000A2/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5099395A (en) * | 1987-10-11 | 1992-03-24 | Ibiden Co. Ltd. | Circuit board for mounting electronic components |
US6295200B1 (en) * | 2000-02-23 | 2001-09-25 | Motorola, Inc. | Carrier assembly and method |
EP1528847A1 (fr) * | 2003-10-29 | 2005-05-04 | Magnetek S.p.A. | Insert dissipant la chaleur, circuit comprenant ledit insert et méthode de production |
US20050180111A1 (en) * | 2004-02-18 | 2005-08-18 | Bamesberger Brett E. | Low thermal stress composite heat sink assembly |
US20060061969A1 (en) * | 2004-09-20 | 2006-03-23 | Danaher Motion Stockholm Ab | Circuit arrangement for cooling of surface mounted semi-conductors |
US20120024575A1 (en) * | 2009-02-20 | 2012-02-02 | Telefonaktiebolaget Lm Ericsson (Publ) | Thermal pad and method of forming the same |
Also Published As
Publication number | Publication date |
---|---|
WO2014091000A2 (fr) | 2014-06-19 |
FR2999863A1 (fr) | 2014-06-20 |
FR2999863B1 (fr) | 2019-05-17 |
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