JP2001240281A - テープ状部材搬送装置 - Google Patents

テープ状部材搬送装置

Info

Publication number
JP2001240281A
JP2001240281A JP2000052776A JP2000052776A JP2001240281A JP 2001240281 A JP2001240281 A JP 2001240281A JP 2000052776 A JP2000052776 A JP 2000052776A JP 2000052776 A JP2000052776 A JP 2000052776A JP 2001240281 A JP2001240281 A JP 2001240281A
Authority
JP
Japan
Prior art keywords
tape
tab tape
shaped member
tab
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000052776A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001240281A5 (enExample
Inventor
Mitsuhiro Furuta
光弘 古田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ando Electric Co Ltd
Original Assignee
Ando Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ando Electric Co Ltd filed Critical Ando Electric Co Ltd
Priority to JP2000052776A priority Critical patent/JP2001240281A/ja
Priority to US09/766,313 priority patent/US20010017547A1/en
Priority to KR1020010005811A priority patent/KR100688684B1/ko
Publication of JP2001240281A publication Critical patent/JP2001240281A/ja
Publication of JP2001240281A5 publication Critical patent/JP2001240281A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H20/00—Advancing webs
    • B65H20/02—Advancing webs by friction roller
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/50—Auxiliary process performed during handling process
    • B65H2301/51—Modifying a characteristic of handled material
    • B65H2301/512—Changing form of handled material
    • B65H2301/5124—Stretching; Tentering
    • B65H2301/51242—Stretching transversely; Tentering
    • B65H2301/512422—Stretching transversely; Tentering involving roller pair acting on edge of web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/13—Parts concerned of the handled material
    • B65H2701/132—Side portions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/171—Physical features of handled article or web
    • B65H2701/1719—Photosensitive, e.g. exposure, photographic or phosphor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
JP2000052776A 2000-02-29 2000-02-29 テープ状部材搬送装置 Withdrawn JP2001240281A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000052776A JP2001240281A (ja) 2000-02-29 2000-02-29 テープ状部材搬送装置
US09/766,313 US20010017547A1 (en) 2000-02-29 2001-01-18 Tape-like member transfer system
KR1020010005811A KR100688684B1 (ko) 2000-02-29 2001-02-07 테이프형상부재 반송장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000052776A JP2001240281A (ja) 2000-02-29 2000-02-29 テープ状部材搬送装置

Publications (2)

Publication Number Publication Date
JP2001240281A true JP2001240281A (ja) 2001-09-04
JP2001240281A5 JP2001240281A5 (enExample) 2005-08-25

Family

ID=18574238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000052776A Withdrawn JP2001240281A (ja) 2000-02-29 2000-02-29 テープ状部材搬送装置

Country Status (3)

Country Link
US (1) US20010017547A1 (enExample)
JP (1) JP2001240281A (enExample)
KR (1) KR100688684B1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014049627A (ja) * 2012-08-31 2014-03-17 Nitto Denko Corp 粘着テープ貼付け方法および粘着テープ貼付け装置
WO2024095816A1 (ja) * 2022-11-04 2024-05-10 ブラザー工業株式会社 缶製品作製装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100861506B1 (ko) * 2002-04-12 2008-10-02 삼성테크윈 주식회사 필름 이송장치
US20120039651A1 (en) * 2004-09-24 2012-02-16 Brother Kogyo Kabushiki Kaisha Tape cassette
CN109823887B (zh) * 2019-02-22 2021-04-20 武汉飞帛丝科技有限公司 一种自动化导电布检测设备
KR102884706B1 (ko) * 2021-12-27 2025-11-11 세메스 주식회사 조향 휠 검사 장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014049627A (ja) * 2012-08-31 2014-03-17 Nitto Denko Corp 粘着テープ貼付け方法および粘着テープ貼付け装置
WO2024095816A1 (ja) * 2022-11-04 2024-05-10 ブラザー工業株式会社 缶製品作製装置

Also Published As

Publication number Publication date
KR20010085342A (ko) 2001-09-07
US20010017547A1 (en) 2001-08-30
KR100688684B1 (ko) 2007-02-28

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