JP2001210761A5 - - Google Patents

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Publication number
JP2001210761A5
JP2001210761A5 JP2000014809A JP2000014809A JP2001210761A5 JP 2001210761 A5 JP2001210761 A5 JP 2001210761A5 JP 2000014809 A JP2000014809 A JP 2000014809A JP 2000014809 A JP2000014809 A JP 2000014809A JP 2001210761 A5 JP2001210761 A5 JP 2001210761A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000014809A
Other languages
Japanese (ja)
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JP2001210761A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000014809A priority Critical patent/JP2001210761A/ja
Priority claimed from JP2000014809A external-priority patent/JP2001210761A/ja
Priority to US09/760,396 priority patent/US6713863B2/en
Priority to DE60140093T priority patent/DE60140093D1/de
Priority to KR1020010002822A priority patent/KR20010076329A/ko
Priority to EP01300405A priority patent/EP1120830B1/en
Publication of JP2001210761A publication Critical patent/JP2001210761A/ja
Priority to US10/777,232 priority patent/US6864120B2/en
Publication of JP2001210761A5 publication Critical patent/JP2001210761A5/ja
Pending legal-status Critical Current

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JP2000014809A 2000-01-24 2000-01-24 半導体装置及びその製造方法 Pending JP2001210761A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2000014809A JP2001210761A (ja) 2000-01-24 2000-01-24 半導体装置及びその製造方法
US09/760,396 US6713863B2 (en) 2000-01-24 2001-01-12 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion
DE60140093T DE60140093D1 (de) 2000-01-24 2001-01-18 Halbleiter mit kohlenfaserverstärkter Harz-Kühlplatte mit konkavem Teil
KR1020010002822A KR20010076329A (ko) 2000-01-24 2001-01-18 탄소섬유가 보강된 수지체를 오목부가 있는 방열판으로서구비하는 반도체 장치
EP01300405A EP1120830B1 (en) 2000-01-24 2001-01-18 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate with a concave portion
US10/777,232 US6864120B2 (en) 2000-01-24 2004-02-12 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000014809A JP2001210761A (ja) 2000-01-24 2000-01-24 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2001210761A JP2001210761A (ja) 2001-08-03
JP2001210761A5 true JP2001210761A5 (https=) 2007-01-18

Family

ID=18542206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000014809A Pending JP2001210761A (ja) 2000-01-24 2000-01-24 半導体装置及びその製造方法

Country Status (5)

Country Link
US (2) US6713863B2 (https=)
EP (1) EP1120830B1 (https=)
JP (1) JP2001210761A (https=)
KR (1) KR20010076329A (https=)
DE (1) DE60140093D1 (https=)

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US8362607B2 (en) * 2009-06-03 2013-01-29 Honeywell International Inc. Integrated circuit package including a thermally and electrically conductive package lid
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JP5572890B2 (ja) * 2010-06-08 2014-08-20 ミヨシ電子株式会社 半導体モジュールおよび半導体装置
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KR102186203B1 (ko) 2014-01-23 2020-12-04 삼성전자주식회사 패키지 온 패키지 장치 및 이의 제조 방법
JP2016092300A (ja) * 2014-11-07 2016-05-23 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
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JP7265321B2 (ja) * 2018-06-21 2023-04-26 デクセリアルズ株式会社 半導体装置及び半導体装置の製造方法
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CN115181505B (zh) * 2022-07-12 2024-02-27 东莞市兆科电子材料科技有限公司 导热垫片及其制备方法
WO2025094923A1 (ja) * 2023-11-02 2025-05-08 ローム株式会社 半導体装置

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