JP2001208616A - 温度検出素子 - Google Patents

温度検出素子

Info

Publication number
JP2001208616A
JP2001208616A JP2000020977A JP2000020977A JP2001208616A JP 2001208616 A JP2001208616 A JP 2001208616A JP 2000020977 A JP2000020977 A JP 2000020977A JP 2000020977 A JP2000020977 A JP 2000020977A JP 2001208616 A JP2001208616 A JP 2001208616A
Authority
JP
Japan
Prior art keywords
temperature
detecting element
wafer
small piece
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000020977A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001208616A5 (https=
Inventor
Yoshihiro Suzuki
義浩 鈴木
Hitoshi Nakane
斉 中根
Satoshi Oka
敏 岡
Kouyu Yaguchi
宏裕 矢口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ohkura Electric Co Ltd
Original Assignee
Ohkura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ohkura Electric Co Ltd filed Critical Ohkura Electric Co Ltd
Priority to JP2000020977A priority Critical patent/JP2001208616A/ja
Priority to TW090101301A priority patent/TW486564B/zh
Priority to US09/769,919 priority patent/US20010022803A1/en
Priority to KR10-2001-0003707A priority patent/KR100413646B1/ko
Publication of JP2001208616A publication Critical patent/JP2001208616A/ja
Publication of JP2001208616A5 publication Critical patent/JP2001208616A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2000020977A 2000-01-28 2000-01-28 温度検出素子 Pending JP2001208616A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000020977A JP2001208616A (ja) 2000-01-28 2000-01-28 温度検出素子
TW090101301A TW486564B (en) 2000-01-28 2001-01-19 Temperature-detecting element
US09/769,919 US20010022803A1 (en) 2000-01-28 2001-01-25 Temperature-detecting element
KR10-2001-0003707A KR100413646B1 (ko) 2000-01-28 2001-01-26 온도검출소자

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000020977A JP2001208616A (ja) 2000-01-28 2000-01-28 温度検出素子

Publications (2)

Publication Number Publication Date
JP2001208616A true JP2001208616A (ja) 2001-08-03
JP2001208616A5 JP2001208616A5 (https=) 2007-02-22

Family

ID=18547446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000020977A Pending JP2001208616A (ja) 2000-01-28 2000-01-28 温度検出素子

Country Status (4)

Country Link
US (1) US20010022803A1 (https=)
JP (1) JP2001208616A (https=)
KR (1) KR100413646B1 (https=)
TW (1) TW486564B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031449A1 (ja) * 2011-08-29 2013-03-07 三洋電機株式会社 光ピックアップ装置および温度検出装置
US8821014B2 (en) 2012-02-10 2014-09-02 Tokyo Electron Limited Temperature sensor and heat treating apparatus
JP2021513647A (ja) * 2018-02-06 2021-05-27 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ 温度センサ

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030231698A1 (en) * 2002-03-29 2003-12-18 Takatomo Yamaguchi Apparatus and method for fabricating a semiconductor device and a heat treatment apparatus
JP5451793B2 (ja) * 2012-02-10 2014-03-26 東京エレクトロン株式会社 温度センサ及び熱処理装置
CN104568196B (zh) * 2015-01-04 2019-06-11 安徽蓝德仪表有限公司 一种铂铑热电偶

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6465426A (en) * 1987-09-04 1989-03-10 Murata Manufacturing Co Platinum temperature sensor
JPH0563054A (ja) * 1991-08-29 1993-03-12 Nippon Steel Corp ウエハ温度測定方法及び装置
JPH07273057A (ja) * 1994-03-30 1995-10-20 Kokusai Electric Co Ltd 半導体製造装置
JPH08285699A (ja) * 1995-04-14 1996-11-01 Matsushita Electric Ind Co Ltd 加熱容器内温度センサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6465426A (en) * 1987-09-04 1989-03-10 Murata Manufacturing Co Platinum temperature sensor
JPH0563054A (ja) * 1991-08-29 1993-03-12 Nippon Steel Corp ウエハ温度測定方法及び装置
JPH07273057A (ja) * 1994-03-30 1995-10-20 Kokusai Electric Co Ltd 半導体製造装置
JPH08285699A (ja) * 1995-04-14 1996-11-01 Matsushita Electric Ind Co Ltd 加熱容器内温度センサ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031449A1 (ja) * 2011-08-29 2013-03-07 三洋電機株式会社 光ピックアップ装置および温度検出装置
US8821014B2 (en) 2012-02-10 2014-09-02 Tokyo Electron Limited Temperature sensor and heat treating apparatus
JP2021513647A (ja) * 2018-02-06 2021-05-27 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ 温度センサ
JP7009641B2 (ja) 2018-02-06 2022-01-25 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフト 温度センサ

Also Published As

Publication number Publication date
KR20010078070A (ko) 2001-08-20
TW486564B (en) 2002-05-11
US20010022803A1 (en) 2001-09-20
KR100413646B1 (ko) 2003-12-31

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