JP2001196529A5 - - Google Patents

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Publication number
JP2001196529A5
JP2001196529A5 JP2000007923A JP2000007923A JP2001196529A5 JP 2001196529 A5 JP2001196529 A5 JP 2001196529A5 JP 2000007923 A JP2000007923 A JP 2000007923A JP 2000007923 A JP2000007923 A JP 2000007923A JP 2001196529 A5 JP2001196529 A5 JP 2001196529A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000007923A
Other versions
JP2001196529A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000007923A priority Critical patent/JP2001196529A/ja
Priority claimed from JP2000007923A external-priority patent/JP2001196529A/ja
Priority to US09/654,875 priority patent/US7071574B1/en
Priority to KR10-2000-0059073A priority patent/KR100386995B1/ko
Priority to TW089121084A priority patent/TW462097B/zh
Publication of JP2001196529A publication Critical patent/JP2001196529A/ja
Priority to US11/402,944 priority patent/US7288837B2/en
Publication of JP2001196529A5 publication Critical patent/JP2001196529A5/ja
Priority to US11/902,826 priority patent/US7547963B2/en
Priority to US11/902,827 priority patent/US20080023848A1/en
Pending legal-status Critical Current

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JP2000007923A 2000-01-17 2000-01-17 半導体装置及びその配線方法 Pending JP2001196529A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2000007923A JP2001196529A (ja) 2000-01-17 2000-01-17 半導体装置及びその配線方法
US09/654,875 US7071574B1 (en) 2000-01-17 2000-09-05 Semiconductor device and its wiring method
KR10-2000-0059073A KR100386995B1 (ko) 2000-01-17 2000-10-07 반도체 장치 및 그 배선 방법
TW089121084A TW462097B (en) 2000-01-17 2000-10-09 Semiconductor device and its wiring method
US11/402,944 US7288837B2 (en) 2000-01-17 2006-04-13 Semiconductor device and its writing method
US11/902,826 US7547963B2 (en) 2000-01-17 2007-09-26 Semiconductor device and its wiring method
US11/902,827 US20080023848A1 (en) 2000-01-17 2007-09-26 Semiconductor device and its wiring method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000007923A JP2001196529A (ja) 2000-01-17 2000-01-17 半導体装置及びその配線方法

Publications (2)

Publication Number Publication Date
JP2001196529A JP2001196529A (ja) 2001-07-19
JP2001196529A5 true JP2001196529A5 (ja) 2007-03-01

Family

ID=18536276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000007923A Pending JP2001196529A (ja) 2000-01-17 2000-01-17 半導体装置及びその配線方法

Country Status (4)

Country Link
US (4) US7071574B1 (ja)
JP (1) JP2001196529A (ja)
KR (1) KR100386995B1 (ja)
TW (1) TW462097B (ja)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
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JP2001196529A (ja) * 2000-01-17 2001-07-19 Mitsubishi Electric Corp 半導体装置及びその配線方法
JP3631120B2 (ja) 2000-09-28 2005-03-23 沖電気工業株式会社 半導体装置
JP4189154B2 (ja) 2001-04-02 2008-12-03 本田技研工業株式会社 自動二輪車の盗難対策装置設置構造
US6979894B1 (en) * 2001-09-27 2005-12-27 Marvell International Ltd. Integrated chip package having intermediate substrate
DE10251527B4 (de) * 2002-11-04 2007-01-25 Infineon Technologies Ag Verfahren zur Herstellung einer Stapelanordnung eines Speichermoduls
EP1434264A3 (en) * 2002-12-27 2017-01-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method using the transfer technique
JP2005123542A (ja) 2003-10-20 2005-05-12 Genusion:Kk 半導体装置のパッケージ構造およびパッケージ化方法
JP3880572B2 (ja) 2003-10-31 2007-02-14 沖電気工業株式会社 半導体チップ及び半導体装置
JP4103796B2 (ja) 2003-12-25 2008-06-18 沖電気工業株式会社 半導体チップパッケージ及びマルチチップパッケージ
JP2006032871A (ja) * 2004-07-22 2006-02-02 Toshiba Corp 半導体装置
US20060202317A1 (en) * 2005-03-14 2006-09-14 Farid Barakat Method for MCP packaging for balanced performance
US7535110B2 (en) 2006-06-15 2009-05-19 Marvell World Trade Ltd. Stack die packages
US7420206B2 (en) 2006-07-12 2008-09-02 Genusion Inc. Interposer, semiconductor chip mounted sub-board, and semiconductor package
TWI352416B (en) * 2006-09-12 2011-11-11 Chipmos Technologies Inc Stacked chip package structure with unbalanced lea
US7750450B2 (en) * 2006-12-20 2010-07-06 Intel Corporation Stacked die package with stud spacers
JP5191688B2 (ja) * 2007-05-18 2013-05-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20100219532A1 (en) * 2007-06-01 2010-09-02 Kenji Yamasaki Semiconductor device
JP5126002B2 (ja) * 2008-11-11 2013-01-23 セイコーエプソン株式会社 半導体装置及び半導体装置の製造方法
KR20100117977A (ko) 2009-04-27 2010-11-04 삼성전자주식회사 반도체 패키지
US20110084374A1 (en) * 2009-10-08 2011-04-14 Jen-Chung Chen Semiconductor package with sectioned bonding wire scheme
US8536716B1 (en) * 2009-12-31 2013-09-17 Micron Technology, Inc. Supply voltage or ground connections for integrated circuit device
US8531849B1 (en) 2010-03-31 2013-09-10 Micron Technology, Inc. Supply voltage or ground connections including bond pad interconnects for integrated circuit device
KR20120024099A (ko) * 2010-09-06 2012-03-14 삼성전자주식회사 멀티-칩 패키지 및 그의 제조 방법
US20120133381A1 (en) * 2010-11-30 2012-05-31 Electro Scientific Industries, Inc. Stackable semiconductor chip with edge features and methods of fabricating and processing same
KR20130019290A (ko) * 2011-08-16 2013-02-26 삼성전자주식회사 유니버설 인쇄 회로 기판 및 그것을 포함하는 메모리 카드
JP5472557B1 (ja) * 2012-07-26 2014-04-16 株式会社村田製作所 複合電子部品及びそれを備える電子装置
KR102037866B1 (ko) * 2013-02-05 2019-10-29 삼성전자주식회사 전자장치
JP2015002308A (ja) * 2013-06-18 2015-01-05 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 半導体装置及びその製造方法
KR102108325B1 (ko) * 2013-10-14 2020-05-08 삼성전자주식회사 반도체 패키지
WO2016046339A1 (en) * 2014-09-24 2016-03-31 Koninklijke Philips N.V. Printed circuit board and printed circuit board arrangement

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JPS57103322A (en) 1980-12-18 1982-06-26 Nec Corp Sealing case for semiconductor device
JP2809945B2 (ja) * 1992-11-05 1998-10-15 株式会社東芝 半導体装置
US5528083A (en) * 1994-10-04 1996-06-18 Sun Microsystems, Inc. Thin film chip capacitor for electrical noise reduction in integrated circuits
US5665996A (en) * 1994-12-30 1997-09-09 Siliconix Incorporated Vertical power mosfet having thick metal layer to reduce distributed resistance
KR0156334B1 (ko) * 1995-10-14 1998-10-15 김광호 차폐 본딩 와이어를 구비하는 고주파, 고밀도용 반도체 칩 패키지
KR100438256B1 (ko) * 1995-12-18 2004-08-25 마츠시타 덴끼 산교 가부시키가이샤 반도체장치 및 그 제조방법
JPH09186289A (ja) 1995-12-28 1997-07-15 Lucent Technol Inc 多層積層化集積回路チップ組立体
US5696031A (en) * 1996-11-20 1997-12-09 Micron Technology, Inc. Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
JPH1070153A (ja) * 1996-08-26 1998-03-10 Hitachi Ltd 電子部品の接続方法
US5847445A (en) * 1996-11-04 1998-12-08 Micron Technology, Inc. Die assemblies using suspended bond wires, carrier substrates and dice having wire suspension structures, and methods of fabricating same
KR100467946B1 (ko) * 1997-01-24 2005-01-24 로무 가부시키가이샤 반도체 칩의 제조방법
US6271598B1 (en) * 1997-07-29 2001-08-07 Cubic Memory, Inc. Conductive epoxy flip-chip on chip
US5898223A (en) * 1997-10-08 1999-04-27 Lucent Technologies Inc. Chip-on-chip IC packages
JP3481444B2 (ja) * 1998-01-14 2003-12-22 シャープ株式会社 半導体装置及びその製造方法
US6159765A (en) * 1998-03-06 2000-12-12 Microchip Technology, Incorporated Integrated circuit package having interchip bonding and method therefor
US5977640A (en) * 1998-06-26 1999-11-02 International Business Machines Corporation Highly integrated chip-on-chip packaging
US6376914B2 (en) * 1999-12-09 2002-04-23 Atmel Corporation Dual-die integrated circuit package
JP2001196529A (ja) * 2000-01-17 2001-07-19 Mitsubishi Electric Corp 半導体装置及びその配線方法
US6252305B1 (en) * 2000-02-29 2001-06-26 Advanced Semiconductor Engineering, Inc. Multichip module having a stacked chip arrangement
JP4454181B2 (ja) * 2001-05-15 2010-04-21 富士通マイクロエレクトロニクス株式会社 半導体装置

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