JP2001185742A - 光記録媒体を読取る装置用光素子及びその製造方法 - Google Patents
光記録媒体を読取る装置用光素子及びその製造方法Info
- Publication number
- JP2001185742A JP2001185742A JP2000372718A JP2000372718A JP2001185742A JP 2001185742 A JP2001185742 A JP 2001185742A JP 2000372718 A JP2000372718 A JP 2000372718A JP 2000372718 A JP2000372718 A JP 2000372718A JP 2001185742 A JP2001185742 A JP 2001185742A
- Authority
- JP
- Japan
- Prior art keywords
- optical element
- transparent
- optical
- curable material
- platelets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 83
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000011241 protective layer Substances 0.000 claims abstract description 9
- 239000004848 polyfunctional curative Substances 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000010410 layer Substances 0.000 description 11
- 230000008901 benefit Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 201000009310 astigmatism Diseases 0.000 description 6
- 230000007613 environmental effect Effects 0.000 description 6
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000003351 stiffener Substances 0.000 description 3
- 230000001143 conditioned effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/407—Optical elements or arrangements indirectly associated with the devices
Landscapes
- Light Receiving Elements (AREA)
- Semiconductor Lasers (AREA)
- Optical Head (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19960055.4 | 1999-12-13 | ||
| DE19960055A DE19960055A1 (de) | 1999-12-13 | 1999-12-13 | Photoelement für ein Gerät zum Lesen optischer Aufzeichnungsträger und Verfahren zu dessen Herstellung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001185742A true JP2001185742A (ja) | 2001-07-06 |
| JP2001185742A5 JP2001185742A5 (enExample) | 2008-01-24 |
Family
ID=7932470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000372718A Abandoned JP2001185742A (ja) | 1999-12-13 | 2000-12-07 | 光記録媒体を読取る装置用光素子及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6919553B2 (enExample) |
| EP (1) | EP1109228A3 (enExample) |
| JP (1) | JP2001185742A (enExample) |
| CN (1) | CN1163875C (enExample) |
| DE (1) | DE19960055A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19960055A1 (de) | 1999-12-13 | 2001-06-21 | Thomson Brandt Gmbh | Photoelement für ein Gerät zum Lesen optischer Aufzeichnungsträger und Verfahren zu dessen Herstellung |
| ITBO20040412A1 (it) * | 2004-07-01 | 2004-10-01 | Eurodent Spa | Lampada dentale particolarmente per ambulatori medico-dentistici |
| DE102006038302A1 (de) * | 2006-08-16 | 2008-02-21 | Atmel Germany Gmbh | Sensoreinheit und optischer Aufnehmer für eine Abtasteinrichtung |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3622419A (en) * | 1969-10-08 | 1971-11-23 | Motorola Inc | Method of packaging an optoelectrical device |
| US4523102A (en) * | 1980-03-17 | 1985-06-11 | Matsushita Electric Industrial Co., Ltd. | Solid-state color-image sensor and process for fabricating the same |
| US4418284A (en) * | 1980-03-17 | 1983-11-29 | Matsushita Electric Industrial Co., Ltd. | Solid-state color-image sensor and process for fabricating the same |
| JPS58180310A (ja) * | 1982-04-15 | 1983-10-21 | Nissan Motor Co Ltd | 自動車高調整装置 |
| US4501493A (en) * | 1982-10-28 | 1985-02-26 | Sony Corporation | Apparatus for detecting a position of an optical pickup |
| JPS60413A (ja) * | 1983-06-16 | 1985-01-05 | Sumitomo Electric Ind Ltd | レンズ装荷方法 |
| DE3582031D1 (de) * | 1984-12-17 | 1991-04-11 | Sanyo Electric Co | Photodetektor. |
| GB8728342D0 (en) * | 1987-12-03 | 1988-01-06 | Bt & D Technologies Ltd | Light sources |
| JP3093244B2 (ja) * | 1989-07-24 | 2000-10-03 | キヤノン株式会社 | 照明系の改良された光電変換装置及び該装置を搭載した情報処理装置 |
| US5175016A (en) * | 1990-03-20 | 1992-12-29 | Minnesota Mining And Manufacturing Company | Method for making gas sensing element |
| JPH06289321A (ja) * | 1993-04-01 | 1994-10-18 | Seiko Epson Corp | 検光子及び光学素子及び受光素子及び光ヘッド及び光磁気信号検出手段及び位置誤差信号検出手段及び光学素子製造方法 |
| JP3412224B2 (ja) * | 1994-01-07 | 2003-06-03 | 住友電気工業株式会社 | レンズ実装方法と装置 |
| US5543612A (en) * | 1994-05-13 | 1996-08-06 | Texas Instruments Incorporated | Image pickup device with attached interference stripe noise prevention mechanism |
| US6246123B1 (en) * | 1998-05-04 | 2001-06-12 | Motorola, Inc. | Transparent compound and applications for its use |
| DE19958229B4 (de) * | 1998-12-09 | 2007-05-31 | Fuji Electric Co., Ltd., Kawasaki | Optisches Halbleiter-Sensorbauelement |
| DE19960055A1 (de) * | 1999-12-13 | 2001-06-21 | Thomson Brandt Gmbh | Photoelement für ein Gerät zum Lesen optischer Aufzeichnungsträger und Verfahren zu dessen Herstellung |
| US6515269B1 (en) * | 2000-01-25 | 2003-02-04 | Amkor Technology, Inc. | Integrally connected image sensor packages having a window support in contact with a window and the active area |
| JP3614776B2 (ja) * | 2000-12-19 | 2005-01-26 | シャープ株式会社 | チップ部品型ledとその製造方法 |
-
1999
- 1999-12-13 DE DE19960055A patent/DE19960055A1/de not_active Withdrawn
-
2000
- 2000-12-01 EP EP00126257A patent/EP1109228A3/en not_active Ceased
- 2000-12-06 CN CNB001348531A patent/CN1163875C/zh not_active Expired - Fee Related
- 2000-12-07 JP JP2000372718A patent/JP2001185742A/ja not_active Abandoned
- 2000-12-12 US US09/735,346 patent/US6919553B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6919553B2 (en) | 2005-07-19 |
| CN1301014A (zh) | 2001-06-27 |
| CN1163875C (zh) | 2004-08-25 |
| US20010004101A1 (en) | 2001-06-21 |
| DE19960055A1 (de) | 2001-06-21 |
| EP1109228A3 (en) | 2004-01-07 |
| EP1109228A2 (en) | 2001-06-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071204 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20071204 |
|
| A762 | Written abandonment of application |
Free format text: JAPANESE INTERMEDIATE CODE: A762 Effective date: 20100226 |