CN1163875C - 光记录媒体读取设备用的光电元件及其制造方法 - Google Patents

光记录媒体读取设备用的光电元件及其制造方法 Download PDF

Info

Publication number
CN1163875C
CN1163875C CNB001348531A CN00134853A CN1163875C CN 1163875 C CN1163875 C CN 1163875C CN B001348531 A CNB001348531 A CN B001348531A CN 00134853 A CN00134853 A CN 00134853A CN 1163875 C CN1163875 C CN 1163875C
Authority
CN
China
Prior art keywords
photovalve
transparent element
platelet
curable material
transparent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB001348531A
Other languages
English (en)
Chinese (zh)
Other versions
CN1301014A (zh
Inventor
����ºն�ķ�����
弗里德赫尔姆·朱克
苏珊·阿亚利
雷纳·巴斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
French Thomson Broadband Co
Original Assignee
French Thomson Broadband Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by French Thomson Broadband Co filed Critical French Thomson Broadband Co
Publication of CN1301014A publication Critical patent/CN1301014A/zh
Application granted granted Critical
Publication of CN1163875C publication Critical patent/CN1163875C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
CNB001348531A 1999-12-13 2000-12-06 光记录媒体读取设备用的光电元件及其制造方法 Expired - Fee Related CN1163875C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19960055.4 1999-12-13
DE19960055A DE19960055A1 (de) 1999-12-13 1999-12-13 Photoelement für ein Gerät zum Lesen optischer Aufzeichnungsträger und Verfahren zu dessen Herstellung

Publications (2)

Publication Number Publication Date
CN1301014A CN1301014A (zh) 2001-06-27
CN1163875C true CN1163875C (zh) 2004-08-25

Family

ID=7932470

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB001348531A Expired - Fee Related CN1163875C (zh) 1999-12-13 2000-12-06 光记录媒体读取设备用的光电元件及其制造方法

Country Status (5)

Country Link
US (1) US6919553B2 (enExample)
EP (1) EP1109228A3 (enExample)
JP (1) JP2001185742A (enExample)
CN (1) CN1163875C (enExample)
DE (1) DE19960055A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19960055A1 (de) 1999-12-13 2001-06-21 Thomson Brandt Gmbh Photoelement für ein Gerät zum Lesen optischer Aufzeichnungsträger und Verfahren zu dessen Herstellung
ITBO20040412A1 (it) * 2004-07-01 2004-10-01 Eurodent Spa Lampada dentale particolarmente per ambulatori medico-dentistici
DE102006038302A1 (de) * 2006-08-16 2008-02-21 Atmel Germany Gmbh Sensoreinheit und optischer Aufnehmer für eine Abtasteinrichtung

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3622419A (en) * 1969-10-08 1971-11-23 Motorola Inc Method of packaging an optoelectrical device
US4523102A (en) * 1980-03-17 1985-06-11 Matsushita Electric Industrial Co., Ltd. Solid-state color-image sensor and process for fabricating the same
US4418284A (en) * 1980-03-17 1983-11-29 Matsushita Electric Industrial Co., Ltd. Solid-state color-image sensor and process for fabricating the same
JPS58180310A (ja) * 1982-04-15 1983-10-21 Nissan Motor Co Ltd 自動車高調整装置
US4501493A (en) * 1982-10-28 1985-02-26 Sony Corporation Apparatus for detecting a position of an optical pickup
JPS60413A (ja) * 1983-06-16 1985-01-05 Sumitomo Electric Ind Ltd レンズ装荷方法
DE3582031D1 (de) * 1984-12-17 1991-04-11 Sanyo Electric Co Photodetektor.
GB8728342D0 (en) * 1987-12-03 1988-01-06 Bt & D Technologies Ltd Light sources
JP3093244B2 (ja) * 1989-07-24 2000-10-03 キヤノン株式会社 照明系の改良された光電変換装置及び該装置を搭載した情報処理装置
US5175016A (en) * 1990-03-20 1992-12-29 Minnesota Mining And Manufacturing Company Method for making gas sensing element
JPH06289321A (ja) * 1993-04-01 1994-10-18 Seiko Epson Corp 検光子及び光学素子及び受光素子及び光ヘッド及び光磁気信号検出手段及び位置誤差信号検出手段及び光学素子製造方法
JP3412224B2 (ja) * 1994-01-07 2003-06-03 住友電気工業株式会社 レンズ実装方法と装置
US5543612A (en) * 1994-05-13 1996-08-06 Texas Instruments Incorporated Image pickup device with attached interference stripe noise prevention mechanism
US6246123B1 (en) * 1998-05-04 2001-06-12 Motorola, Inc. Transparent compound and applications for its use
DE19958229B4 (de) * 1998-12-09 2007-05-31 Fuji Electric Co., Ltd., Kawasaki Optisches Halbleiter-Sensorbauelement
DE19960055A1 (de) * 1999-12-13 2001-06-21 Thomson Brandt Gmbh Photoelement für ein Gerät zum Lesen optischer Aufzeichnungsträger und Verfahren zu dessen Herstellung
US6515269B1 (en) * 2000-01-25 2003-02-04 Amkor Technology, Inc. Integrally connected image sensor packages having a window support in contact with a window and the active area
JP3614776B2 (ja) * 2000-12-19 2005-01-26 シャープ株式会社 チップ部品型ｌｅｄとその製造方法

Also Published As

Publication number Publication date
US6919553B2 (en) 2005-07-19
JP2001185742A (ja) 2001-07-06
CN1301014A (zh) 2001-06-27
US20010004101A1 (en) 2001-06-21
DE19960055A1 (de) 2001-06-21
EP1109228A3 (en) 2004-01-07
EP1109228A2 (en) 2001-06-20

Similar Documents

Publication Publication Date Title
EP3274760B1 (en) Laser projection module
KR101660684B1 (ko) 광전자 칩-온-보드 모듈을 위한 코팅 방법
KR101862818B1 (ko) 광전자 컴포넌트 및 광전자 컴포넌트를 제조하기 위한 방법
KR101827180B1 (ko) 통합 구조화된 광 프로젝터
US10923640B2 (en) Optoelectronic component and method of producing same
JP4803641B2 (ja) 光学式エンコーダ
CN1163875C (zh) 光记录媒体读取设备用的光电元件及其制造方法
US5414293A (en) Encapsulated light emitting diodes
US8208359B2 (en) Optical head, optical information recording and reproducing device, and optical information system device
US20100321563A1 (en) Solid-state imaging unit
CN101595556A (zh) 半导体装置及其制造方法、拾光模块
KR20110036130A (ko) 광전 반도체 소자
CN101796435A (zh) 光学元件、用于制造该元件的方法以及具有该元件的光电部件
US20050121820A1 (en) Encapsulated optical package
CN1269276C (zh) 梯度薄膜楔形干扰滤波器和用于激光器调谐的方法
CN115336242B (zh) 图像读取装置
US12176444B2 (en) Optoelectronic component and method for producing same
CN1758073A (zh) 微镜及其制造方法
CN1929103A (zh) 数码相机模组的制程
US20230275194A1 (en) Method for producing a component, and optoelectronic component
US11206732B2 (en) Reliable interconnect for camera image sensors
CN1266687C (zh) 光学拾取装置及其制造方法
US20240371820A1 (en) Chip package structure and method for producing the same
US20240136386A1 (en) Chip package structure and method for producing the same
US20240234166A9 (en) Chip package structure and method for producing the same

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20040825

Termination date: 20101206