JP2001185580A5 - - Google Patents
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- Publication number
- JP2001185580A5 JP2001185580A5 JP2000330981A JP2000330981A JP2001185580A5 JP 2001185580 A5 JP2001185580 A5 JP 2001185580A5 JP 2000330981 A JP2000330981 A JP 2000330981A JP 2000330981 A JP2000330981 A JP 2000330981A JP 2001185580 A5 JP2001185580 A5 JP 2001185580A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- electrode
- thermosetting resin
- resin sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 8
- 229920005989 resin Polymers 0.000 claims 8
- 229920001187 thermosetting polymer Polymers 0.000 claims 7
- 238000000034 method Methods 0.000 claims 6
- 239000002245 particle Substances 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims 1
- 238000002161 passivation Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000330981A JP3923248B2 (ja) | 1996-12-27 | 2000-10-30 | 回路基板への電子部品の実装方法及び回路基板 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35073896 | 1996-12-27 | ||
| JP8-350738 | 1996-12-27 | ||
| JP2000330981A JP3923248B2 (ja) | 1996-12-27 | 2000-10-30 | 回路基板への電子部品の実装方法及び回路基板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52985998A Division JP3150347B2 (ja) | 1996-12-27 | 1997-12-26 | 回路基板への電子部品の実装方法及びその装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001185580A JP2001185580A (ja) | 2001-07-06 |
| JP2001185580A5 true JP2001185580A5 (enExample) | 2005-07-28 |
| JP3923248B2 JP3923248B2 (ja) | 2007-05-30 |
Family
ID=26579263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000330981A Expired - Fee Related JP3923248B2 (ja) | 1996-12-27 | 2000-10-30 | 回路基板への電子部品の実装方法及び回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3923248B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100604334B1 (ko) * | 2003-11-25 | 2006-08-08 | (주)케이나인 | 플립칩 패키징 공정에서 접합력이 향상된 플립칩 접합 방법 |
| KR100905642B1 (ko) | 2007-12-13 | 2009-06-30 | 삼성전기주식회사 | 칩 내장형 인쇄회로기판 및 그 제조방법 |
| JP5104687B2 (ja) * | 2008-09-19 | 2012-12-19 | 日本電気株式会社 | 接合シート及び電子回路装置並びに製造方法 |
| CN112486892B (zh) * | 2020-12-15 | 2024-07-26 | 泰和电路科技(惠州)有限公司 | 邦定ic管控计算器的计算方法 |
| CN114823648A (zh) * | 2021-01-28 | 2022-07-29 | 成都辰显光电有限公司 | 显示面板及显示装置 |
-
2000
- 2000-10-30 JP JP2000330981A patent/JP3923248B2/ja not_active Expired - Fee Related
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