JP2001151867A - 封止用エポキシ樹脂成形材料及び電子部品装置 - Google Patents

封止用エポキシ樹脂成形材料及び電子部品装置

Info

Publication number
JP2001151867A
JP2001151867A JP33993399A JP33993399A JP2001151867A JP 2001151867 A JP2001151867 A JP 2001151867A JP 33993399 A JP33993399 A JP 33993399A JP 33993399 A JP33993399 A JP 33993399A JP 2001151867 A JP2001151867 A JP 2001151867A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin molding
sealing
molding material
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33993399A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001151867A5 (enExample
Inventor
Takeshi Oshita
毅 大下
Haruaki To
晴昭 陶
Ryoichi Ikezawa
良一 池沢
Shinsuke Hagiwara
伸介 萩原
Kazuyoshi Tendou
一良 天童
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP33993399A priority Critical patent/JP2001151867A/ja
Publication of JP2001151867A publication Critical patent/JP2001151867A/ja
Publication of JP2001151867A5 publication Critical patent/JP2001151867A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP33993399A 1999-11-30 1999-11-30 封止用エポキシ樹脂成形材料及び電子部品装置 Pending JP2001151867A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33993399A JP2001151867A (ja) 1999-11-30 1999-11-30 封止用エポキシ樹脂成形材料及び電子部品装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33993399A JP2001151867A (ja) 1999-11-30 1999-11-30 封止用エポキシ樹脂成形材料及び電子部品装置

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2004028111A Division JP2004143465A (ja) 2004-02-04 2004-02-04 封止用エポキシ樹脂成形材料及び電子部品装置
JP2004028138A Division JP2004143466A (ja) 2004-02-04 2004-02-04 封止用エポキシ樹脂成形材料及び電子部品装置
JP2006013632A Division JP2006161055A (ja) 2006-01-23 2006-01-23 封止用エポキシ樹脂成形材料及び電子部品装置

Publications (2)

Publication Number Publication Date
JP2001151867A true JP2001151867A (ja) 2001-06-05
JP2001151867A5 JP2001151867A5 (enExample) 2005-01-06

Family

ID=18332141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33993399A Pending JP2001151867A (ja) 1999-11-30 1999-11-30 封止用エポキシ樹脂成形材料及び電子部品装置

Country Status (1)

Country Link
JP (1) JP2001151867A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316565A (ja) * 2000-05-10 2001-11-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2001354839A (ja) * 2000-06-15 2001-12-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2002012741A (ja) * 2000-06-27 2002-01-15 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2003012897A (ja) * 2001-06-27 2003-01-15 Hitachi Chem Co Ltd 摩擦材用樹脂組成物
JP2003012890A (ja) * 2001-07-03 2003-01-15 Kyocera Chemical Corp 封止用樹脂組成物および電子部品封止装置
KR100600597B1 (ko) * 2001-12-28 2006-07-13 제일모직주식회사 반도체 봉지재용 에폭시 수지 조성물
KR100679491B1 (ko) 2005-02-03 2007-02-06 주식회사 케이씨씨 반도체소자 봉지용 친환경 에폭시수지 조성물
WO2007096945A1 (ja) * 2006-02-21 2007-08-30 Matsushita Electric Works, Ltd. 難燃性樹脂組成物、プリプレグ、樹脂シート、成形品
JP2012082159A (ja) * 2010-10-12 2012-04-26 Fushimi Pharm Co Ltd ヒドロキシ基含有環状ホスファゼン組成物
CN105153234A (zh) * 2014-06-13 2015-12-16 广东生益科技股份有限公司 一种苯氧基环三磷腈活性酯、无卤树脂组合物及其用途
EP3037475A4 (en) * 2014-06-13 2017-06-07 Shengyi Technology Co., Ltd. Phenoxy cyclotriphosphazene active ester, halogen-free resin composition and use thereof

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001316565A (ja) * 2000-05-10 2001-11-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2001354839A (ja) * 2000-06-15 2001-12-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2002012741A (ja) * 2000-06-27 2002-01-15 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2003012897A (ja) * 2001-06-27 2003-01-15 Hitachi Chem Co Ltd 摩擦材用樹脂組成物
JP2003012890A (ja) * 2001-07-03 2003-01-15 Kyocera Chemical Corp 封止用樹脂組成物および電子部品封止装置
KR100600597B1 (ko) * 2001-12-28 2006-07-13 제일모직주식회사 반도체 봉지재용 에폭시 수지 조성물
KR100679491B1 (ko) 2005-02-03 2007-02-06 주식회사 케이씨씨 반도체소자 봉지용 친환경 에폭시수지 조성물
WO2007096945A1 (ja) * 2006-02-21 2007-08-30 Matsushita Electric Works, Ltd. 難燃性樹脂組成物、プリプレグ、樹脂シート、成形品
JP2012082159A (ja) * 2010-10-12 2012-04-26 Fushimi Pharm Co Ltd ヒドロキシ基含有環状ホスファゼン組成物
CN105153234A (zh) * 2014-06-13 2015-12-16 广东生益科技股份有限公司 一种苯氧基环三磷腈活性酯、无卤树脂组合物及其用途
EP3037475A4 (en) * 2014-06-13 2017-06-07 Shengyi Technology Co., Ltd. Phenoxy cyclotriphosphazene active ester, halogen-free resin composition and use thereof

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