JP2001058259A - 半田付け方法及び半田付け装置 - Google Patents

半田付け方法及び半田付け装置

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Publication number
JP2001058259A
JP2001058259A JP2000183553A JP2000183553A JP2001058259A JP 2001058259 A JP2001058259 A JP 2001058259A JP 2000183553 A JP2000183553 A JP 2000183553A JP 2000183553 A JP2000183553 A JP 2000183553A JP 2001058259 A JP2001058259 A JP 2001058259A
Authority
JP
Japan
Prior art keywords
solder
chamber
soldering
vacuum chamber
free radical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000183553A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001058259A5 (enExample
Inventor
Yoshinobu Ono
義暢 小野
Kichiji Shinkai
吉治 新海
Takeshi Mori
武史 森
Takashi Hashimoto
孝 橋本
Hisao Iwasa
久夫 岩佐
Yoshimasa Nakano
賀正 中野
Joji Kagami
丈二 加々見
Koki Furumoto
幸喜 古本
Tatsuya Takeuchi
達也 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Seiki Co Ltd
Original Assignee
Shinko Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Seiki Co Ltd filed Critical Shinko Seiki Co Ltd
Priority to JP2000183553A priority Critical patent/JP2001058259A/ja
Publication of JP2001058259A publication Critical patent/JP2001058259A/ja
Publication of JP2001058259A5 publication Critical patent/JP2001058259A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2000183553A 1999-06-18 2000-06-19 半田付け方法及び半田付け装置 Pending JP2001058259A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000183553A JP2001058259A (ja) 1999-06-18 2000-06-19 半田付け方法及び半田付け装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP17238199 1999-06-18
JP11-172381 1999-06-18
JP2000183553A JP2001058259A (ja) 1999-06-18 2000-06-19 半田付け方法及び半田付け装置

Publications (2)

Publication Number Publication Date
JP2001058259A true JP2001058259A (ja) 2001-03-06
JP2001058259A5 JP2001058259A5 (enExample) 2007-08-02

Family

ID=26494755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000183553A Pending JP2001058259A (ja) 1999-06-18 2000-06-19 半田付け方法及び半田付け装置

Country Status (1)

Country Link
JP (1) JP2001058259A (enExample)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006818A (ja) * 2002-04-16 2004-01-08 Tadatomo Suga リフロー法とソルダペースト
US6887319B2 (en) 2002-04-16 2005-05-03 Senju Metal Industry Co., Ltd. Residue-free solder paste
US6935553B2 (en) 2002-04-16 2005-08-30 Senju Metal Industry Co., Ltd. Reflow soldering method
JP2005230830A (ja) * 2004-02-17 2005-09-02 Shinko Seiki Co Ltd はんだ付け方法
JP2006308748A (ja) * 2005-04-27 2006-11-09 Olympus Medical Systems Corp 光学ユニット組立方法
JP2008100235A (ja) * 2006-10-17 2008-05-01 Kyushu Institute Of Technology 鉛フリーはんだ合金の処理方法
WO2008155939A1 (ja) * 2007-06-19 2008-12-24 Tamura Corporation リフロー装置
JP2010000513A (ja) * 2008-06-18 2010-01-07 Sharp Corp 接合構造体の製造方法
GB2466865A (en) * 2009-01-08 2010-07-14 Fujitsu Ltd Joining method using lead free solder and reflow apparatus
US20130075455A1 (en) * 2011-09-28 2013-03-28 Renesas Electronics Corporation Reflow pretreatment apparatus and reflow pretreatment method
JP2013206980A (ja) * 2012-03-27 2013-10-07 Fujitsu Ltd 部品搭載方法及び部品搭載装置
US8765594B2 (en) 2010-06-24 2014-07-01 Yoshihiro Kitamura Method of fabricating semiconductor device allowing smooth bump surface
JP2014210279A (ja) * 2013-04-19 2014-11-13 昭和電工株式会社 ろう付け方法及びろう付け装置
JP2015179796A (ja) * 2014-03-18 2015-10-08 株式会社坂本電機製作所 リフロー方法および、その方法に用いるリフロー装置
EP3357629A4 (en) * 2015-09-30 2019-04-17 Origin Electric Company, Limited SOLDER PASTE FOR REDUCTION GAS AND METHOD FOR PRODUCING A SOLDERING PRODUCT
JP2020055011A (ja) * 2018-10-01 2020-04-09 株式会社弘輝 接合構造体の製造方法
CN110998813A (zh) * 2017-08-07 2020-04-10 波士顿制程技术有限公司 热壁无助焊剂焊球处理装置
JP2020064937A (ja) * 2018-10-16 2020-04-23 トヨタ自動車株式会社 半導体装置の製造方法
RU2725443C1 (ru) * 2019-06-07 2020-07-02 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") Устройство для пайки свч нагревом
CN113133305A (zh) * 2021-06-03 2021-07-16 常州井芯半导体设备有限公司 配备等离子发生装置的回流焊设备及回流焊方法
CN113385763A (zh) * 2021-07-14 2021-09-14 成都共益缘真空设备有限公司 一种真空回流焊正负压结合焊接工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293952A (ja) * 1987-05-27 1988-11-30 Hitachi Ltd 半導体素子接続端子形成方法
JPH02190489A (ja) * 1988-11-30 1990-07-26 Plessey Overseas Plc 金属表面の清浄化方法
JPH07142020A (ja) * 1993-11-19 1995-06-02 Rikagaku Kenkyusho 電子ビーム励起負イオン源及び負イオン発生方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293952A (ja) * 1987-05-27 1988-11-30 Hitachi Ltd 半導体素子接続端子形成方法
JPH02190489A (ja) * 1988-11-30 1990-07-26 Plessey Overseas Plc 金属表面の清浄化方法
JPH07142020A (ja) * 1993-11-19 1995-06-02 Rikagaku Kenkyusho 電子ビーム励起負イオン源及び負イオン発生方法

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1301173C (zh) * 2002-04-16 2007-02-21 须贺唯知 回流钎焊方法
US6887319B2 (en) 2002-04-16 2005-05-03 Senju Metal Industry Co., Ltd. Residue-free solder paste
US6935553B2 (en) 2002-04-16 2005-08-30 Senju Metal Industry Co., Ltd. Reflow soldering method
JP2004006818A (ja) * 2002-04-16 2004-01-08 Tadatomo Suga リフロー法とソルダペースト
JP2009111399A (ja) * 2002-04-16 2009-05-21 Tadatomo Suga リフロー法
JP2005230830A (ja) * 2004-02-17 2005-09-02 Shinko Seiki Co Ltd はんだ付け方法
CN100455394C (zh) * 2004-02-17 2009-01-28 神港精机株式会社 焊接方法
JP2006308748A (ja) * 2005-04-27 2006-11-09 Olympus Medical Systems Corp 光学ユニット組立方法
JP2008100235A (ja) * 2006-10-17 2008-05-01 Kyushu Institute Of Technology 鉛フリーはんだ合金の処理方法
WO2008155939A1 (ja) * 2007-06-19 2008-12-24 Tamura Corporation リフロー装置
JP2010000513A (ja) * 2008-06-18 2010-01-07 Sharp Corp 接合構造体の製造方法
GB2466865A (en) * 2009-01-08 2010-07-14 Fujitsu Ltd Joining method using lead free solder and reflow apparatus
US7975898B2 (en) 2009-01-08 2011-07-12 Fujitsu Limited Joining method and reflow apparatus
GB2466865B (en) * 2009-01-08 2014-09-24 Fujitsu Ltd Joining method and reflow apparatus
US8434658B2 (en) 2009-01-08 2013-05-07 Fujitsu Limited Joining method and reflow apparatus
US8765594B2 (en) 2010-06-24 2014-07-01 Yoshihiro Kitamura Method of fabricating semiconductor device allowing smooth bump surface
US20130075455A1 (en) * 2011-09-28 2013-03-28 Renesas Electronics Corporation Reflow pretreatment apparatus and reflow pretreatment method
JP2013206980A (ja) * 2012-03-27 2013-10-07 Fujitsu Ltd 部品搭載方法及び部品搭載装置
JP2014210279A (ja) * 2013-04-19 2014-11-13 昭和電工株式会社 ろう付け方法及びろう付け装置
JP2015179796A (ja) * 2014-03-18 2015-10-08 株式会社坂本電機製作所 リフロー方法および、その方法に用いるリフロー装置
EP3357629A4 (en) * 2015-09-30 2019-04-17 Origin Electric Company, Limited SOLDER PASTE FOR REDUCTION GAS AND METHOD FOR PRODUCING A SOLDERING PRODUCT
US10610981B2 (en) 2015-09-30 2020-04-07 Origin Company, Limited Solder paste for reduction gas, and method for producing soldered product
CN110998813A (zh) * 2017-08-07 2020-04-10 波士顿制程技术有限公司 热壁无助焊剂焊球处理装置
CN110998813B (zh) * 2017-08-07 2023-12-01 柏锐科技有限公司 热壁无助焊剂焊球处理装置
US11446752B2 (en) 2018-10-01 2022-09-20 Koki Company Limited Method for producing joined structure
JP2020055011A (ja) * 2018-10-01 2020-04-09 株式会社弘輝 接合構造体の製造方法
KR20210029820A (ko) * 2018-10-01 2021-03-16 가부시키가이샤 코키 접합 구조체의 제조 방법
KR102259122B1 (ko) 2018-10-01 2021-06-01 가부시키가이샤 코키 접합 구조체의 제조 방법
JP2020064937A (ja) * 2018-10-16 2020-04-23 トヨタ自動車株式会社 半導体装置の製造方法
RU2725443C1 (ru) * 2019-06-07 2020-07-02 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") Устройство для пайки свч нагревом
CN113133305A (zh) * 2021-06-03 2021-07-16 常州井芯半导体设备有限公司 配备等离子发生装置的回流焊设备及回流焊方法
CN113133305B (zh) * 2021-06-03 2023-11-10 常州井芯半导体设备有限公司 配备等离子发生装置的回流焊设备及回流焊方法
CN113385763A (zh) * 2021-07-14 2021-09-14 成都共益缘真空设备有限公司 一种真空回流焊正负压结合焊接工艺

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