JP2001023111A - 磁気ヘッド - Google Patents
磁気ヘッドInfo
- Publication number
- JP2001023111A JP2001023111A JP18815199A JP18815199A JP2001023111A JP 2001023111 A JP2001023111 A JP 2001023111A JP 18815199 A JP18815199 A JP 18815199A JP 18815199 A JP18815199 A JP 18815199A JP 2001023111 A JP2001023111 A JP 2001023111A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- magnetic head
- substrate
- metal
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000002184 metal Substances 0.000 claims abstract description 70
- 229910052751 metal Inorganic materials 0.000 claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000010409 thin film Substances 0.000 claims abstract description 45
- 238000005304 joining Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 description 124
- 238000004519 manufacturing process Methods 0.000 description 43
- 239000011521 glass Substances 0.000 description 23
- 238000005498 polishing Methods 0.000 description 20
- 238000004804 winding Methods 0.000 description 20
- 239000004020 conductor Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 238000000926 separation method Methods 0.000 description 11
- 102000010970 Connexin Human genes 0.000 description 7
- 108050001175 Connexin Proteins 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 7
- 210000003976 gap junction Anatomy 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910000702 sendust Inorganic materials 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 1
- 102100035793 CD83 antigen Human genes 0.000 description 1
- 101100321670 Fagopyrum esculentum FA18 gene Proteins 0.000 description 1
- 101000946856 Homo sapiens CD83 antigen Proteins 0.000 description 1
- 101001024616 Homo sapiens Neuroblastoma breakpoint family member 9 Proteins 0.000 description 1
- 102100037013 Neuroblastoma breakpoint family member 9 Human genes 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910001004 magnetic alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18815199A JP2001023111A (ja) | 1999-07-01 | 1999-07-01 | 磁気ヘッド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18815199A JP2001023111A (ja) | 1999-07-01 | 1999-07-01 | 磁気ヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001023111A true JP2001023111A (ja) | 2001-01-26 |
JP2001023111A5 JP2001023111A5 (enrdf_load_stackoverflow) | 2006-04-20 |
Family
ID=16218651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18815199A Abandoned JP2001023111A (ja) | 1999-07-01 | 1999-07-01 | 磁気ヘッド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001023111A (enrdf_load_stackoverflow) |
-
1999
- 1999-07-01 JP JP18815199A patent/JP2001023111A/ja not_active Abandoned
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060307 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060307 |
|
A762 | Written abandonment of application |
Free format text: JAPANESE INTERMEDIATE CODE: A762 Effective date: 20070629 |