JP2000517102A5 - - Google Patents

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Publication number
JP2000517102A5
JP2000517102A5 JP1998510718A JP51071898A JP2000517102A5 JP 2000517102 A5 JP2000517102 A5 JP 2000517102A5 JP 1998510718 A JP1998510718 A JP 1998510718A JP 51071898 A JP51071898 A JP 51071898A JP 2000517102 A5 JP2000517102 A5 JP 2000517102A5
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JP
Japan
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JP1998510718A
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JP2000517102A (ja
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Priority claimed from US08/699,249 external-priority patent/US5882993A/en
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Publication of JP2000517102A publication Critical patent/JP2000517102A/ja
Publication of JP2000517102A5 publication Critical patent/JP2000517102A5/ja
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Figure 2000517102
Figure 2000517102
Figure 2000517102
Figure 2000517102
Figure 2000517102
JP10510718A 1996-08-19 1997-05-29 異なるゲート酸化膜厚さの集積回路およびその生成のための処理方法 Pending JP2000517102A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/699,249 1996-08-19
US08/699,249 US5882993A (en) 1996-08-19 1996-08-19 Integrated circuit with differing gate oxide thickness and process for making same
PCT/US1997/009638 WO1998008254A1 (en) 1996-08-19 1997-05-29 Integrated circuit with differing gate oxide thickness and process for making same

Publications (2)

Publication Number Publication Date
JP2000517102A JP2000517102A (ja) 2000-12-19
JP2000517102A5 true JP2000517102A5 (ja) 2004-12-09

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JP10510718A Pending JP2000517102A (ja) 1996-08-19 1997-05-29 異なるゲート酸化膜厚さの集積回路およびその生成のための処理方法

Country Status (6)

Country Link
US (2) US5882993A (ja)
EP (1) EP0944921B1 (ja)
JP (1) JP2000517102A (ja)
KR (1) KR100517677B1 (ja)
DE (1) DE69710609T2 (ja)
WO (1) WO1998008254A1 (ja)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0136932B1 (ko) * 1994-07-30 1998-04-24 문정환 반도체 소자 및 그의 제조방법
US5882993A (en) 1996-08-19 1999-03-16 Advanced Micro Devices, Inc. Integrated circuit with differing gate oxide thickness and process for making same
US6033943A (en) * 1996-08-23 2000-03-07 Advanced Micro Devices, Inc. Dual gate oxide thickness integrated circuit and process for making same
US6080682A (en) 1997-12-18 2000-06-27 Advanced Micro Devices, Inc. Methodology for achieving dual gate oxide thicknesses
US5962914A (en) * 1998-01-14 1999-10-05 Advanced Micro Devices, Inc. Reduced bird's beak field oxidation process using nitrogen implanted into active region
US5963803A (en) * 1998-02-02 1999-10-05 Advanced Micro Devices, Inc. Method of making N-channel and P-channel IGFETs with different gate thicknesses and spacer widths
KR100273281B1 (ko) * 1998-02-27 2000-12-15 김영환 반도체 소자의 절연막 형성 방법
US6531364B1 (en) 1998-08-05 2003-03-11 Advanced Micro Devices, Inc. Advanced fabrication technique to form ultra thin gate dielectric using a sacrificial polysilicon seed layer
US6051865A (en) * 1998-11-09 2000-04-18 Advanced Micro Devices, Inc. Transistor having a barrier layer below a high permittivity gate dielectric
US6087236A (en) * 1998-11-24 2000-07-11 Intel Corporation Integrated circuit with multiple gate dielectric structures
DE19939597B4 (de) * 1999-08-20 2006-07-20 Infineon Technologies Ag Verfahren zur Herstellung einer mikroelektronischen Struktur mit verbesserter Gatedielektrikahomogenität
US6235591B1 (en) 1999-10-25 2001-05-22 Chartered Semiconductor Manufacturing Company Method to form gate oxides of different thicknesses on a silicon substrate
US20030235936A1 (en) * 1999-12-16 2003-12-25 Snyder John P. Schottky barrier CMOS device and method
US6303479B1 (en) * 1999-12-16 2001-10-16 Spinnaker Semiconductor, Inc. Method of manufacturing a short-channel FET with Schottky-barrier source and drain contacts
US6583011B1 (en) 2000-01-11 2003-06-24 Chartered Semiconductor Manufacturing Ltd. Method for forming damascene dual gate for improved oxide uniformity and control
US6407008B1 (en) 2000-05-05 2002-06-18 Integrated Device Technology, Inc. Method of forming an oxide layer
US6352885B1 (en) 2000-05-25 2002-03-05 Advanced Micro Devices, Inc. Transistor having a peripherally increased gate insulation thickness and a method of fabricating the same
JP2001351989A (ja) * 2000-06-05 2001-12-21 Nec Corp 半導体装置の製造方法
US6339001B1 (en) 2000-06-16 2002-01-15 International Business Machines Corporation Formulation of multiple gate oxides thicknesses without exposing gate oxide or silicon surface to photoresist
US6417037B1 (en) 2000-07-18 2002-07-09 Chartered Semiconductor Manufacturing Ltd. Method of dual gate process
US6503851B2 (en) 2000-08-31 2003-01-07 Micron Technology, Inc. Use of linear injectors to deposit uniform selective ozone TEOS oxide film by pulsing reactants on and off
US6368986B1 (en) 2000-08-31 2002-04-09 Micron Technology, Inc. Use of selective ozone TEOS oxide to create variable thickness layers and spacers
DE10052680C2 (de) 2000-10-24 2002-10-24 Advanced Micro Devices Inc Verfahren zum Einstellen einer Form einer auf einem Substrat gebildeten Oxidschicht
TW580730B (en) * 2001-03-09 2004-03-21 Macronix Int Co Ltd Method of forming a silicon oxide layer with different thickness using pulsed nitrogen plasma implantation
KR100400253B1 (ko) 2001-09-04 2003-10-01 주식회사 하이닉스반도체 반도체소자의 박막 트랜지스터 제조방법
DE10207122B4 (de) 2002-02-20 2007-07-05 Advanced Micro Devices, Inc., Sunnyvale Ein Verfahren zur Herstellung von Schichten aus Oxid auf einer Oberfläche eines Substrats
US6974737B2 (en) * 2002-05-16 2005-12-13 Spinnaker Semiconductor, Inc. Schottky barrier CMOS fabrication method
US20030218218A1 (en) * 2002-05-21 2003-11-27 Samir Chaudhry SRAM cell with reduced standby leakage current and method for forming the same
KR20040010303A (ko) * 2002-07-23 2004-01-31 가부시끼가이샤 도시바 반도체 장치 및 그 제조 방법, 불휘발성 반도체 기억 장치및 그 제조 방법, 및 불휘발성 반도체 기억 장치를구비하는 전자 장치
US6759302B1 (en) * 2002-07-30 2004-07-06 Taiwan Semiconductor Manufacturing Company Method of generating multiple oxides by plasma nitridation on oxide
KR100464852B1 (ko) * 2002-08-07 2005-01-05 삼성전자주식회사 반도체 장치의 게이트 산화막 형성방법
US6670682B1 (en) * 2002-08-29 2003-12-30 Micron Technology, Inc. Multilayered doped conductor
JP4887604B2 (ja) * 2003-08-29 2012-02-29 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US7037786B2 (en) * 2003-11-18 2006-05-02 Atmel Corporation Method of forming a low voltage gate oxide layer and tunnel oxide layer in an EEPROM cell
US8735297B2 (en) 2004-05-06 2014-05-27 Sidense Corporation Reverse optical proximity correction method
US7755162B2 (en) * 2004-05-06 2010-07-13 Sidense Corp. Anti-fuse memory cell
JP4981661B2 (ja) * 2004-05-06 2012-07-25 サイデンス コーポレーション 分割チャネルアンチヒューズアレイ構造
US9123572B2 (en) 2004-05-06 2015-09-01 Sidense Corporation Anti-fuse memory cell
US7060568B2 (en) * 2004-06-30 2006-06-13 Intel Corporation Using different gate dielectrics with NMOS and PMOS transistors of a complementary metal oxide semiconductor integrated circuit
US7402480B2 (en) * 2004-07-01 2008-07-22 Linear Technology Corporation Method of fabricating a semiconductor device with multiple gate oxide thicknesses
US7858458B2 (en) 2005-06-14 2010-12-28 Micron Technology, Inc. CMOS fabrication
US7923373B2 (en) 2007-06-04 2011-04-12 Micron Technology, Inc. Pitch multiplication using self-assembling materials
KR100924549B1 (ko) * 2007-11-14 2009-11-02 주식회사 하이닉스반도체 반도체 소자 및 그의 제조방법
DE102008035805B4 (de) * 2008-07-31 2013-01-31 Advanced Micro Devices, Inc. Herstellung von Gatedielektrika in PMOS- und NMOS-Transistoren
US8211778B2 (en) * 2008-12-23 2012-07-03 Micron Technology, Inc. Forming isolation regions for integrated circuits
US7915129B2 (en) * 2009-04-22 2011-03-29 Polar Semiconductor, Inc. Method of fabricating high-voltage metal oxide semiconductor transistor devices
US9082905B2 (en) * 2012-02-15 2015-07-14 Texas Instruments Incorporated Photodiode employing surface grating to enhance sensitivity
US8809150B2 (en) * 2012-08-16 2014-08-19 Globalfoundries Singapore Pte. Ltd. MOS with recessed lightly-doped drain
US10050147B2 (en) * 2015-07-24 2018-08-14 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and manufacturing method thereof
US10714486B2 (en) 2018-09-13 2020-07-14 Sandisk Technologies Llc Static random access memory cell employing n-doped PFET gate electrodes and methods of manufacturing the same

Family Cites Families (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4098618A (en) * 1977-06-03 1978-07-04 International Business Machines Corporation Method of manufacturing semiconductor devices in which oxide regions are formed by an oxidation mask disposed directly on a substrate damaged by ion implantation
JPS5637635A (en) * 1979-09-05 1981-04-11 Mitsubishi Electric Corp Manufacture of semiconductor device
US4287661A (en) 1980-03-26 1981-09-08 International Business Machines Corporation Method for making an improved polysilicon conductor structure utilizing reactive-ion etching and thermal oxidation
IT1213230B (it) 1984-10-23 1989-12-14 Ates Componenti Elettron Processo planox a becco ridotto per la formazione di componenti elettronici integrati.
US4551910A (en) * 1984-11-27 1985-11-12 Intel Corporation MOS Isolation processing
US4578128A (en) 1984-12-03 1986-03-25 Ncr Corporation Process for forming retrograde dopant distributions utilizing simultaneous outdiffusion of dopants
NL8501720A (nl) 1985-06-14 1987-01-02 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting waarbij een siliciumplak plaatselijk wordt voorzien van veldoxide met kanaalonderbreker.
JPS6258673A (ja) * 1985-09-09 1987-03-14 Fujitsu Ltd 半導体記憶装置
US4866002A (en) * 1985-11-26 1989-09-12 Fuji Photo Film Co., Ltd. Complementary insulated-gate field effect transistor integrated circuit and manufacturing method thereof
US4701423A (en) * 1985-12-20 1987-10-20 Ncr Corporation Totally self-aligned CMOS process
US4682407A (en) * 1986-01-21 1987-07-28 Motorola, Inc. Means and method for stabilizing polycrystalline semiconductor layers
US4707721A (en) * 1986-02-20 1987-11-17 Texas Instruments Incorporated Passivated dual dielectric gate system and method for fabricating same
US4729009A (en) * 1986-02-20 1988-03-01 Texas Instruments Incorporated Gate dielectric including undoped amorphous silicon
IT1191755B (it) * 1986-04-29 1988-03-23 Sgs Microelettronica Spa Processo di fabbricazione per celle eprom con dielettrico ossido-nitruro-ossido
US4774197A (en) * 1986-06-17 1988-09-27 Advanced Micro Devices, Inc. Method of improving silicon dioxide
US5066995A (en) 1987-03-13 1991-11-19 Harris Corporation Double level conductor structure
US4851257A (en) * 1987-03-13 1989-07-25 Harris Corporation Process for the fabrication of a vertical contact
US4776925A (en) * 1987-04-30 1988-10-11 The Trustees Of Columbia University In The City Of New York Method of forming dielectric thin films on silicon by low energy ion beam bombardment
JPH01183844A (ja) * 1988-01-19 1989-07-21 Toshiba Corp 半導体装置
US5141882A (en) 1989-04-05 1992-08-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor field effect device having channel stop and channel region formed in a well and manufacturing method therefor
US5043780A (en) * 1990-01-03 1991-08-27 Micron Technology, Inc. DRAM cell having a texturized polysilicon lower capacitor plate for increased capacitance
US5172200A (en) * 1990-01-12 1992-12-15 Mitsubishi Denki Kabushiki Kaisha MOS memory device having a LDD structure and a visor-like insulating layer
US5208176A (en) * 1990-01-16 1993-05-04 Micron Technology, Inc. Method of fabricating an enhanced dynamic random access memory (DRAM) cell capacitor using multiple polysilicon texturization
CA2045773A1 (en) 1990-06-29 1991-12-30 Compaq Computer Corporation Byte-compare operation for high-performance processor
US5286992A (en) * 1990-09-28 1994-02-15 Actel Corporation Low voltage device in a high voltage substrate
US5254489A (en) * 1990-10-18 1993-10-19 Nec Corporation Method of manufacturing semiconductor device by forming first and second oxide films by use of nitridation
JPH07118522B2 (ja) * 1990-10-24 1995-12-18 インターナショナル・ビジネス・マシーンズ・コーポレイション 基板表面を酸化処理するための方法及び半導体の構造
JP3006098B2 (ja) * 1991-01-21 2000-02-07 ブラザー工業株式会社 印字データ処理装置
US5082797A (en) * 1991-01-22 1992-01-21 Micron Technology, Inc. Method of making stacked textured container capacitor
US5102832A (en) * 1991-02-11 1992-04-07 Micron Technology, Inc. Methods for texturizing polysilicon
KR940009357B1 (ko) 1991-04-09 1994-10-07 삼성전자주식회사 반도체 장치 및 그 제조방법
KR950000103B1 (ko) 1991-04-15 1995-01-09 금성일렉트론 주식회사 반도체 장치 및 그 제조방법
US5138411A (en) * 1991-05-06 1992-08-11 Micron Technology, Inc. Anodized polysilicon layer lower capacitor plate of a dram to increase capacitance
EP1526446A3 (en) 1991-07-08 2007-04-04 Seiko Epson Corporation Extensible RISC microprocessor architecture
US5250456A (en) * 1991-09-13 1993-10-05 Sgs-Thomson Microelectronics, Inc. Method of forming an integrated circuit capacitor dielectric and a capacitor formed thereby
US5191509A (en) * 1991-12-11 1993-03-02 International Business Machines Corporation Textured polysilicon stacked trench capacitor
US5358894A (en) * 1992-02-06 1994-10-25 Micron Technology, Inc. Oxidation enhancement in narrow masked field regions of a semiconductor wafer
JPH05283678A (ja) * 1992-03-31 1993-10-29 Matsushita Electron Corp Ｍｉｓ型半導体装置
US5340764A (en) * 1993-02-19 1994-08-23 Atmel Corporation Integration of high performance submicron CMOS and dual-poly non-volatile memory devices using a third polysilicon layer
US5330920A (en) * 1993-06-15 1994-07-19 Digital Equipment Corporation Method of controlling gate oxide thickness in the fabrication of semiconductor devices
US5316965A (en) 1993-07-29 1994-05-31 Digital Equipment Corporation Method of decreasing the field oxide etch rate in isolation technology
JPH0758212A (ja) * 1993-08-19 1995-03-03 Sony Corp Ｃｍｏｓ集積回路
US5308787A (en) * 1993-10-22 1994-05-03 United Microelectronics Corporation Uniform field oxidation for locos isolation
EP0651321B1 (en) 1993-10-29 2001-11-14 Advanced Micro Devices, Inc. Superscalar microprocessors
FR2718864B1 (fr) 1994-04-19 1996-05-15 Sgs Thomson Microelectronics Dispositif de traitement numérique avec instructions de recherche du minimum et du maximum.
KR0136935B1 (ko) * 1994-04-21 1998-04-24 문정환 메모리 소자의 제조방법
US5429972A (en) 1994-05-09 1995-07-04 Advanced Micro Devices, Inc. Method of fabricating a capacitor with a textured polysilicon interface and an enhanced dielectric
US6498376B1 (en) * 1994-06-03 2002-12-24 Seiko Instruments Inc Semiconductor device and manufacturing method thereof
US5480828A (en) * 1994-09-30 1996-01-02 Taiwan Semiconductor Manufacturing Corp. Ltd. Differential gate oxide process by depressing or enhancing oxidation rate for mixed 3/5 V CMOS process
US5432114A (en) * 1994-10-24 1995-07-11 Analog Devices, Inc. Process for integration of gate dielectric layers having different parameters in an IGFET integrated circuit
TW344897B (en) * 1994-11-30 1998-11-11 At&T Tcorporation A process for forming gate oxides possessing different thicknesses on a semiconductor substrate
IL116210A0 (en) 1994-12-02 1996-01-31 Intel Corp Microprocessor having a compare operation and a method of comparing packed data in a processor
US5515306A (en) 1995-02-14 1996-05-07 Ibm Processing system and method for minimum/maximum number determination
US5502009A (en) * 1995-02-16 1996-03-26 United Microelectronics Corp. Method for fabricating gate oxide layers of different thicknesses
US5597754A (en) 1995-05-25 1997-01-28 Industrial Technology Research Institute Increased surface area for DRAM, storage node capacitors, using a novel polysilicon deposition and anneal process
US5576266A (en) * 1996-02-12 1996-11-19 Eastman Kodak Company Magnetic layer in dye-donor element for thermal dye transfer
KR970013402A (ko) * 1995-08-28 1997-03-29 김광호 플래쉬 메모리장치 및 그 제조방법
US5937310A (en) * 1996-04-29 1999-08-10 Advanced Micro Devices, Inc. Reduced bird's beak field oxidation process using nitrogen implanted into active region
US5786256A (en) 1996-07-19 1998-07-28 Advanced Micro Devices, Inc. Method of reducing MOS transistor gate beyond photolithographically patterned dimension
US5882993A (en) 1996-08-19 1999-03-16 Advanced Micro Devices, Inc. Integrated circuit with differing gate oxide thickness and process for making same
US6033943A (en) * 1996-08-23 2000-03-07 Advanced Micro Devices, Inc. Dual gate oxide thickness integrated circuit and process for making same
US5789305A (en) 1997-01-27 1998-08-04 Chartered Semiconductor Manufacturing Ltd. Locos with bird's beak suppression by a nitrogen implantation
US6117736A (en) * 1997-01-30 2000-09-12 Lsi Logic Corporation Method of fabricating insulated-gate field-effect transistors having different gate capacitances
US5872376A (en) 1997-03-06 1999-02-16 Advanced Micro Devices, Inc. Oxide formation technique using thin film silicon deposition
US5962914A (en) 1998-01-14 1999-10-05 Advanced Micro Devices, Inc. Reduced bird's beak field oxidation process using nitrogen implanted into active region
US5963803A (en) * 1998-02-02 1999-10-05 Advanced Micro Devices, Inc. Method of making N-channel and P-channel IGFETs with different gate thicknesses and spacer widths
US6093659A (en) * 1998-03-25 2000-07-25 Texas Instruments Incorporated Selective area halogen doping to achieve dual gate oxide thickness on a wafer
JP3194370B2 (ja) * 1998-05-11 2001-07-30 日本電気株式会社 半導体装置とその製造方法
US6165849A (en) * 1998-12-04 2000-12-26 Advanced Micro Devices, Inc. Method of manufacturing mosfet with differential gate oxide thickness on the same IC chip
US6147008A (en) * 1999-11-19 2000-11-14 Chartered Semiconductor Manufacturing Ltd. Creation of multiple gate oxide with high thickness ratio in flash memory process

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