|
US6203582B1
(en)
*
|
1996-07-15 |
2001-03-20 |
Semitool, Inc. |
Modular semiconductor workpiece processing tool
|
|
TW539918B
(en)
*
|
1997-05-27 |
2003-07-01 |
Tokyo Electron Ltd |
Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process
|
|
US6276072B1
(en)
|
1997-07-10 |
2001-08-21 |
Applied Materials, Inc. |
Method and apparatus for heating and cooling substrates
|
|
US6235634B1
(en)
|
1997-10-08 |
2001-05-22 |
Applied Komatsu Technology, Inc. |
Modular substrate processing system
|
|
EP0991795B1
(en)
|
1998-04-21 |
2006-02-22 |
Applied Materials, Inc. |
Electro-chemical deposition system and method of electroplating on substrates
|
|
US6206176B1
(en)
|
1998-05-20 |
2001-03-27 |
Applied Komatsu Technology, Inc. |
Substrate transfer shuttle having a magnetic drive
|
|
US6215897B1
(en)
|
1998-05-20 |
2001-04-10 |
Applied Komatsu Technology, Inc. |
Automated substrate processing system
|
|
US6213704B1
(en)
*
|
1998-05-20 |
2001-04-10 |
Applied Komatsu Technology, Inc. |
Method and apparatus for substrate transfer and processing
|
|
US6517303B1
(en)
*
|
1998-05-20 |
2003-02-11 |
Applied Komatsu Technology, Inc. |
Substrate transfer shuttle
|
|
TW484184B
(en)
|
1998-11-06 |
2002-04-21 |
Canon Kk |
Sample separating apparatus and method, and substrate manufacturing method
|
|
JP2000150611A
(ja)
*
|
1998-11-06 |
2000-05-30 |
Canon Inc |
試料の処理システム
|
|
US6672358B2
(en)
|
1998-11-06 |
2004-01-06 |
Canon Kabushiki Kaisha |
Sample processing system
|
|
US6883681B1
(en)
*
|
1998-12-10 |
2005-04-26 |
Scriptpro Llc |
Automatic dispensing system for unit medicament packages
|
|
US7192494B2
(en)
*
|
1999-03-05 |
2007-03-20 |
Applied Materials, Inc. |
Method and apparatus for annealing copper films
|
|
US6551488B1
(en)
|
1999-04-08 |
2003-04-22 |
Applied Materials, Inc. |
Segmenting of processing system into wet and dry areas
|
|
US7022211B2
(en)
*
|
2000-01-31 |
2006-04-04 |
Ebara Corporation |
Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
|
|
KR100702741B1
(ko)
*
|
1999-06-29 |
2007-04-03 |
어플라이드 머티어리얼스, 인코포레이티드 |
반도체 장치 제조를 위한 집적식 임계치수 제어
|
|
JP4248695B2
(ja)
*
|
1999-07-26 |
2009-04-02 |
東京エレクトロン株式会社 |
ウェハ移載装置の緊急停止装置
|
|
DE19952194A1
(de)
*
|
1999-10-29 |
2001-05-17 |
Infineon Technologies Ag |
Anlage zur Bearbeitung von Wafern
|
|
CN1192417C
(zh)
*
|
1999-11-02 |
2005-03-09 |
东京威力科创股份有限公司 |
工件的超临界处理的方法和装置
|
|
US6748960B1
(en)
*
|
1999-11-02 |
2004-06-15 |
Tokyo Electron Limited |
Apparatus for supercritical processing of multiple workpieces
|
|
US6699004B1
(en)
*
|
2000-03-08 |
2004-03-02 |
Advanced Micro Devices, Inc. |
Wafer rotation in wafer handling devices
|
|
AU2001245638A1
(en)
*
|
2000-03-13 |
2001-09-24 |
Laurier Inc. |
Automated feed mechanism for electronic components of silicon wafer
|
|
US20020027080A1
(en)
*
|
2000-03-17 |
2002-03-07 |
Junichiro Yoshioka |
Plating apparatus and method
|
|
EP1204139A4
(en)
*
|
2000-04-27 |
2010-04-28 |
Ebara Corp |
SUPPORT AND ROTATION DEVICE AND SEMICONDUCTOR SUBSTRATE PROCESSING DEVICE
|
|
US6913680B1
(en)
|
2000-05-02 |
2005-07-05 |
Applied Materials, Inc. |
Method of application of electrical biasing to enhance metal deposition
|
|
US6808612B2
(en)
|
2000-05-23 |
2004-10-26 |
Applied Materials, Inc. |
Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
|
|
EP1303870A2
(en)
*
|
2000-07-26 |
2003-04-23 |
Tokyo Electron Limited |
High pressure processing chamber for semiconductor substrate
|
|
EP1470268A2
(en)
*
|
2000-10-03 |
2004-10-27 |
Applied Materials, Inc. |
Method and associated apparatus for tilting a substrate upon entry for metal deposition
|
|
US6625497B2
(en)
*
|
2000-11-20 |
2003-09-23 |
Applied Materials Inc. |
Semiconductor processing module with integrated feedback/feed forward metrology
|
|
JP2002270667A
(ja)
*
|
2001-03-12 |
2002-09-20 |
Sony Corp |
半導体製造方法及び半導体製造装置
|
|
CN100392796C
(zh)
*
|
2001-04-10 |
2008-06-04 |
东京毅力科创株式会社 |
包含流量增强特征的半导体衬底高压加工室
|
|
US6692159B2
(en)
*
|
2001-04-14 |
2004-02-17 |
E20 Communications, Inc. |
De-latching mechanisms for fiber optic modules
|
|
FR2824543B1
(fr)
*
|
2001-05-14 |
2003-10-17 |
Semco Sa |
Dispositif de chargement et de dechargement de plaquettes de silicium dans des fours a partir d'une station multi-cassettes
|
|
AU2002327249A1
(en)
*
|
2001-07-13 |
2003-01-29 |
Brooks Automation, Inc. |
Substrate transport apparatus with multiple independent end effectors
|
|
US20040025901A1
(en)
*
|
2001-07-16 |
2004-02-12 |
Semitool, Inc. |
Stationary wafer spin/spray processor
|
|
US6427359B1
(en)
*
|
2001-07-16 |
2002-08-06 |
Semitool, Inc. |
Systems and methods for processing workpieces
|
|
JP3760437B2
(ja)
*
|
2001-10-16 |
2006-03-29 |
旭精工株式会社 |
紙葉類の重ね出し防止装置
|
|
MXPA04004241A
(es)
|
2001-11-09 |
2004-07-08 |
Basf Ag |
Procedimiento para la obtencion de formiatos de acido formico.
|
|
KR100436656B1
(ko)
*
|
2001-12-17 |
2004-06-22 |
미래산업 주식회사 |
반도체 소자 테스트 핸들러의 소자 이송장치의 작업위치 인식방법
|
|
US7001468B1
(en)
|
2002-02-15 |
2006-02-21 |
Tokyo Electron Limited |
Pressure energized pressure vessel opening and closing device and method of providing therefor
|
|
JP2005517884A
(ja)
*
|
2002-02-15 |
2005-06-16 |
東京エレクトロン株式会社 |
圧力強化ダイヤフラム弁
|
|
US7387868B2
(en)
|
2002-03-04 |
2008-06-17 |
Tokyo Electron Limited |
Treatment of a dielectric layer using supercritical CO2
|
|
US6688838B2
(en)
|
2002-03-04 |
2004-02-10 |
Applied Materials, Inc. |
Cleanroom lift having an articulated arm
|
|
US6911136B2
(en)
*
|
2002-04-29 |
2005-06-28 |
Applied Materials, Inc. |
Method for regulating the electrical power applied to a substrate during an immersion process
|
|
US20040118694A1
(en)
*
|
2002-12-19 |
2004-06-24 |
Applied Materials, Inc. |
Multi-chemistry electrochemical processing system
|
|
US7506746B2
(en)
|
2002-08-31 |
2009-03-24 |
Applied Materials, Inc. |
System for transporting substrate carriers
|
|
US7684895B2
(en)
|
2002-08-31 |
2010-03-23 |
Applied Materials, Inc. |
Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event
|
|
US7243003B2
(en)
|
2002-08-31 |
2007-07-10 |
Applied Materials, Inc. |
Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
|
|
US7234584B2
(en)
|
2002-08-31 |
2007-06-26 |
Applied Materials, Inc. |
System for transporting substrate carriers
|
|
US7930061B2
(en)
|
2002-08-31 |
2011-04-19 |
Applied Materials, Inc. |
Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback
|
|
US6699380B1
(en)
*
|
2002-10-18 |
2004-03-02 |
Applied Materials Inc. |
Modular electrochemical processing system
|
|
US6752547B2
(en)
*
|
2002-10-28 |
2004-06-22 |
Applied Materials Inc. |
Liquid delivery system and method
|
|
US7038279B2
(en)
*
|
2002-10-28 |
2006-05-02 |
Credence Technologies, Inc. |
Process parameter event monitoring system and method for process
|
|
US6722642B1
(en)
|
2002-11-06 |
2004-04-20 |
Tokyo Electron Limited |
High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism
|
|
US20040099283A1
(en)
*
|
2002-11-26 |
2004-05-27 |
Axcelis Technologies, Inc. |
Drying process for low-k dielectric films
|
|
US7289734B2
(en)
*
|
2002-12-24 |
2007-10-30 |
Tropic Networks Inc. |
Method and system for multi-level power management in an optical network
|
|
US7021635B2
(en)
|
2003-02-06 |
2006-04-04 |
Tokyo Electron Limited |
Vacuum chuck utilizing sintered material and method of providing thereof
|
|
US7225820B2
(en)
|
2003-02-10 |
2007-06-05 |
Tokyo Electron Limited |
High-pressure processing chamber for a semiconductor wafer
|
|
US7077917B2
(en)
|
2003-02-10 |
2006-07-18 |
Tokyo Electric Limited |
High-pressure processing chamber for a semiconductor wafer
|
|
TW200422443A
(en)
*
|
2003-02-18 |
2004-11-01 |
Applied Materials Inc |
Method for immersing a substrate
|
|
JP2004356606A
(ja)
*
|
2003-04-03 |
2004-12-16 |
Seiko Epson Corp |
製造装置及び製造方法
|
|
US7311810B2
(en)
*
|
2003-04-18 |
2007-12-25 |
Applied Materials, Inc. |
Two position anneal chamber
|
|
US7473339B2
(en)
*
|
2003-04-18 |
2009-01-06 |
Applied Materials, Inc. |
Slim cell platform plumbing
|
|
US20040206628A1
(en)
*
|
2003-04-18 |
2004-10-21 |
Applied Materials, Inc. |
Electrical bias during wafer exit from electrolyte bath
|
|
US7270137B2
(en)
*
|
2003-04-28 |
2007-09-18 |
Tokyo Electron Limited |
Apparatus and method of securing a workpiece during high-pressure processing
|
|
TWI290901B
(en)
*
|
2003-06-23 |
2007-12-11 |
Au Optronics Corp |
Warehousing conveyor system
|
|
US20050016857A1
(en)
*
|
2003-07-24 |
2005-01-27 |
Applied Materials, Inc. |
Stabilization of additives concentration in electroplating baths for interconnect formation
|
|
US7163380B2
(en)
|
2003-07-29 |
2007-01-16 |
Tokyo Electron Limited |
Control of fluid flow in the processing of an object with a fluid
|
|
US20050034660A1
(en)
*
|
2003-08-11 |
2005-02-17 |
Supercritical Systems, Inc. |
Alignment means for chamber closure to reduce wear on surfaces
|
|
US7150820B2
(en)
*
|
2003-09-22 |
2006-12-19 |
Semitool, Inc. |
Thiourea- and cyanide-free bath and process for electrolytic etching of gold
|
|
US20050077182A1
(en)
*
|
2003-10-10 |
2005-04-14 |
Applied Materials, Inc. |
Volume measurement apparatus and method
|
|
US20050223837A1
(en)
*
|
2003-11-10 |
2005-10-13 |
Blueshift Technologies, Inc. |
Methods and systems for driving robotic components of a semiconductor handling system
|
|
US20070269297A1
(en)
|
2003-11-10 |
2007-11-22 |
Meulen Peter V D |
Semiconductor wafer handling and transport
|
|
US10086511B2
(en)
|
2003-11-10 |
2018-10-02 |
Brooks Automation, Inc. |
Semiconductor manufacturing systems
|
|
US7458763B2
(en)
|
2003-11-10 |
2008-12-02 |
Blueshift Technologies, Inc. |
Mid-entry load lock for semiconductor handling system
|
|
US7323695B2
(en)
*
|
2004-04-05 |
2008-01-29 |
Axcelis Technologies, Inc. |
Reciprocating drive for scanning a workpiece
|
|
KR100564622B1
(ko)
*
|
2004-04-09 |
2006-03-28 |
삼성전자주식회사 |
반도체 웨이퍼의 린스 및 건조장치 및 방법
|
|
TW200604060A
(en)
*
|
2004-06-11 |
2006-02-01 |
Assembleon Nv |
Component placement apparatus, component feeding apparatus and method
|
|
US7250374B2
(en)
*
|
2004-06-30 |
2007-07-31 |
Tokyo Electron Limited |
System and method for processing a substrate using supercritical carbon dioxide processing
|
|
US7307019B2
(en)
*
|
2004-09-29 |
2007-12-11 |
Tokyo Electron Limited |
Method for supercritical carbon dioxide processing of fluoro-carbon films
|
|
US20060065288A1
(en)
*
|
2004-09-30 |
2006-03-30 |
Darko Babic |
Supercritical fluid processing system having a coating on internal members and a method of using
|
|
US20060102590A1
(en)
*
|
2004-11-12 |
2006-05-18 |
Tokyo Electron Limited |
Method for treating a substrate with a high pressure fluid using a preoxide-based process chemistry
|
|
US20060102208A1
(en)
*
|
2004-11-12 |
2006-05-18 |
Tokyo Electron Limited |
System for removing a residue from a substrate using supercritical carbon dioxide processing
|
|
US7491036B2
(en)
*
|
2004-11-12 |
2009-02-17 |
Tokyo Electron Limited |
Method and system for cooling a pump
|
|
US20060102204A1
(en)
*
|
2004-11-12 |
2006-05-18 |
Tokyo Electron Limited |
Method for removing a residue from a substrate using supercritical carbon dioxide processing
|
|
US20060102591A1
(en)
*
|
2004-11-12 |
2006-05-18 |
Tokyo Electron Limited |
Method and system for treating a substrate using a supercritical fluid
|
|
US20060130966A1
(en)
*
|
2004-12-20 |
2006-06-22 |
Darko Babic |
Method and system for flowing a supercritical fluid in a high pressure processing system
|
|
US7140393B2
(en)
*
|
2004-12-22 |
2006-11-28 |
Tokyo Electron Limited |
Non-contact shuttle valve for flow diversion in high pressure systems
|
|
US20060135047A1
(en)
*
|
2004-12-22 |
2006-06-22 |
Alexei Sheydayi |
Method and apparatus for clamping a substrate in a high pressure processing system
|
|
US7434590B2
(en)
*
|
2004-12-22 |
2008-10-14 |
Tokyo Electron Limited |
Method and apparatus for clamping a substrate in a high pressure processing system
|
|
US20060134332A1
(en)
*
|
2004-12-22 |
2006-06-22 |
Darko Babic |
Precompressed coating of internal members in a supercritical fluid processing system
|
|
US20060175201A1
(en)
*
|
2005-02-07 |
2006-08-10 |
Hooman Hafezi |
Immersion process for electroplating applications
|
|
US7435447B2
(en)
*
|
2005-02-15 |
2008-10-14 |
Tokyo Electron Limited |
Method and system for determining flow conditions in a high pressure processing system
|
|
US20060180174A1
(en)
*
|
2005-02-15 |
2006-08-17 |
Tokyo Electron Limited |
Method and system for treating a substrate with a high pressure fluid using a peroxide-based process chemistry in conjunction with an initiator
|
|
US7291565B2
(en)
*
|
2005-02-15 |
2007-11-06 |
Tokyo Electron Limited |
Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid
|
|
US20060180572A1
(en)
*
|
2005-02-15 |
2006-08-17 |
Tokyo Electron Limited |
Removal of post etch residue for a substrate with open metal surfaces
|
|
US20080207005A1
(en)
*
|
2005-02-15 |
2008-08-28 |
Freescale Semiconductor, Inc. |
Wafer Cleaning After Via-Etching
|
|
US20060191784A1
(en)
*
|
2005-02-28 |
2006-08-31 |
Hitachi Global Storage Technologies |
Methods and systems for electroplating wafers
|
|
US7767145B2
(en)
|
2005-03-28 |
2010-08-03 |
Toyko Electron Limited |
High pressure fourier transform infrared cell
|
|
US7380984B2
(en)
|
2005-03-28 |
2008-06-03 |
Tokyo Electron Limited |
Process flow thermocouple
|
|
US7494107B2
(en)
|
2005-03-30 |
2009-02-24 |
Supercritical Systems, Inc. |
Gate valve for plus-atmospheric pressure semiconductor process vessels
|
|
EP2273279A1
(en)
*
|
2005-04-27 |
2011-01-12 |
Aehr Test Systems, Inc. |
Apparatus for testing electronic devices
|
|
US20060255012A1
(en)
*
|
2005-05-10 |
2006-11-16 |
Gunilla Jacobson |
Removal of particles from substrate surfaces using supercritical processing
|
|
US7789971B2
(en)
*
|
2005-05-13 |
2010-09-07 |
Tokyo Electron Limited |
Treatment of substrate using functionalizing agent in supercritical carbon dioxide
|
|
US7524383B2
(en)
*
|
2005-05-25 |
2009-04-28 |
Tokyo Electron Limited |
Method and system for passivating a processing chamber
|
|
US9457442B2
(en)
*
|
2005-06-18 |
2016-10-04 |
Futrfab, Inc. |
Method and apparatus to support process tool modules in a cleanspace fabricator
|
|
US20070012337A1
(en)
*
|
2005-07-15 |
2007-01-18 |
Tokyo Electron Limited |
In-line metrology for supercritical fluid processing
|
|
TWI275814B
(en)
*
|
2005-07-22 |
2007-03-11 |
King Yuan Electronics Co Ltd |
Electronic component testing apparatus
|
|
WO2007025565A1
(en)
*
|
2005-09-01 |
2007-03-08 |
Freescale Semiconductor, Inc. |
Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device
|
|
US7501809B2
(en)
*
|
2005-09-22 |
2009-03-10 |
King Yuan Electronics Co., Ltd. |
Electronic component handling and testing apparatus and method for electronic component handling and testing
|
|
US20090045164A1
(en)
*
|
2006-02-03 |
2009-02-19 |
Freescale Semiconductor, Inc. |
"universal" barrier cmp slurry for use with low dielectric constant interlayer dielectrics
|
|
US20090301867A1
(en)
*
|
2006-02-24 |
2009-12-10 |
Citibank N.A. |
Integrated system for semiconductor substrate processing using liquid phase metal deposition
|
|
JP4767783B2
(ja)
*
|
2006-07-26 |
2011-09-07 |
東京エレクトロン株式会社 |
液処理装置
|
|
KR101410706B1
(ko)
*
|
2006-08-22 |
2014-06-25 |
노드슨 코포레이션 |
처리 시스템에서 피가공물을 취급하기 위한 장치 및 방법
|
|
US7901539B2
(en)
*
|
2006-09-19 |
2011-03-08 |
Intevac, Inc. |
Apparatus and methods for transporting and processing substrates
|
|
US8419341B2
(en)
*
|
2006-09-19 |
2013-04-16 |
Brooks Automation, Inc. |
Linear vacuum robot with Z motion and articulated arm
|
|
US8293066B2
(en)
*
|
2006-09-19 |
2012-10-23 |
Brooks Automation, Inc. |
Apparatus and methods for transporting and processing substrates
|
|
US9524896B2
(en)
*
|
2006-09-19 |
2016-12-20 |
Brooks Automation Inc. |
Apparatus and methods for transporting and processing substrates
|
|
EP1903157A3
(de)
*
|
2006-09-19 |
2008-05-14 |
Integrated Dynamics Engineering GmbH |
Umgebungslärmabschirmvorrichtung
|
|
US8182198B2
(en)
*
|
2006-10-06 |
2012-05-22 |
Dynamic Micro Systems Semiconductor Equipment Gmbh |
Redundantable robot assembly for workpiece transfer
|
|
WO2008041169A2
(en)
*
|
2006-10-06 |
2008-04-10 |
Dynamic Micro Systems |
Redundantable robot assembly for workpiece transfer
|
|
US9122272B2
(en)
|
2006-10-06 |
2015-09-01 |
Dynamic Micro Systems |
Redundantable robot assembly for workpiece transfer
|
|
US20080178460A1
(en)
*
|
2007-01-29 |
2008-07-31 |
Woodruff Daniel J |
Protected magnets and magnet shielding for processing microfeature workpieces, and associated systems and methods
|
|
JP5247094B2
(ja)
*
|
2007-09-14 |
2013-07-24 |
インテヴァック インコーポレイテッド |
基板処理システム
|
|
JP5387412B2
(ja)
*
|
2007-11-21 |
2014-01-15 |
株式会社安川電機 |
搬送ロボット、筐体、半導体製造装置およびソータ装置
|
|
US7800382B2
(en)
|
2007-12-19 |
2010-09-21 |
AEHR Test Ststems |
System for testing an integrated circuit of a device and its method of use
|
|
US20100051502A1
(en)
*
|
2008-09-04 |
2010-03-04 |
3M Innovative Properties Company |
Carrier having integral detection and measurement of environmental parameters
|
|
US8030957B2
(en)
|
2009-03-25 |
2011-10-04 |
Aehr Test Systems |
System for testing an integrated circuit of a device and its method of use
|
|
US7969175B2
(en)
*
|
2009-05-07 |
2011-06-28 |
Aehr Test Systems |
Separate test electronics and blower modules in an apparatus for testing an integrated circuit
|
|
US8160731B2
(en)
*
|
2009-08-18 |
2012-04-17 |
Empire Technology Development Llc |
Stabilized platform system
|
|
CN102094228B
(zh)
*
|
2009-12-09 |
2013-09-18 |
鸿富锦精密工业(深圳)有限公司 |
阳极处理的生产线
|
|
US8359768B2
(en)
*
|
2010-06-15 |
2013-01-29 |
Tsan-Hsiung Cheng |
Air inlet and outlet passage module for desiccation
|
|
JP5511536B2
(ja)
*
|
2010-06-17 |
2014-06-04 |
株式会社日立国際電気 |
基板処理装置及び半導体装置の製造方法
|
|
TWI469849B
(zh)
*
|
2010-11-12 |
2015-01-21 |
Ind Tech Res Inst |
工具機之加工法
|
|
JP5146526B2
(ja)
*
|
2010-12-28 |
2013-02-20 |
東京エレクトロン株式会社 |
液処理装置
|
|
US9421617B2
(en)
|
2011-06-22 |
2016-08-23 |
Tel Nexx, Inc. |
Substrate holder
|
|
US8967935B2
(en)
|
2011-07-06 |
2015-03-03 |
Tel Nexx, Inc. |
Substrate loader and unloader
|
|
US8963552B2
(en)
|
2012-04-26 |
2015-02-24 |
3M Innovative Properties Company |
Electrostatic discharge event detector
|
|
US9385017B2
(en)
|
2012-08-06 |
2016-07-05 |
Nordson Corporation |
Apparatus and methods for handling workpieces of different sizes
|
|
US9245783B2
(en)
*
|
2013-05-24 |
2016-01-26 |
Novellus Systems, Inc. |
Vacuum robot with linear translation carriage
|
|
US10424498B2
(en)
|
2013-09-09 |
2019-09-24 |
Persimmon Technologies Corporation |
Substrate transport vacuum platform
|
|
US10043689B2
(en)
*
|
2015-06-05 |
2018-08-07 |
Hirata Corporation |
Chamber apparatus and processing system
|
|
KR102842851B1
(ko)
|
2016-01-08 |
2025-08-05 |
에어 테스트 시스템즈 |
일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
|
|
US9827678B1
(en)
*
|
2016-05-16 |
2017-11-28 |
X Development Llc |
Kinematic design for robotic arm
|
|
US9827677B1
(en)
*
|
2016-05-16 |
2017-11-28 |
X Development Llc |
Robotic device with coordinated sweeping tool and shovel tool
|
|
TWI629116B
(zh)
*
|
2016-06-28 |
2018-07-11 |
荏原製作所股份有限公司 |
清洗裝置、具備該清洗裝置之鍍覆裝置、以及清洗方法
|
|
KR20240146697A
(ko)
|
2017-03-03 |
2024-10-08 |
에어 테스트 시스템즈 |
카트리지, 테스트 피스 및 하나 이상의 전자 디바이스들을 테스팅하는 방법
|
|
KR102400186B1
(ko)
*
|
2017-06-19 |
2022-05-20 |
삼성전자주식회사 |
공정 챔버 및 이를 포함하는 기판 처리 장치
|
|
CA3090210A1
(en)
*
|
2018-02-14 |
2019-08-22 |
Langenstein & Schemann Gmbh |
Production system, production module, method for operating and setting up a production line, and method for producing a workpiece
|
|
WO2019182916A1
(en)
|
2018-03-20 |
2019-09-26 |
Tokyo Electron Limited |
Substrate processing tool with integrated metrology and method of using
|
|
CN112074940A
(zh)
|
2018-03-20 |
2020-12-11 |
东京毅力科创株式会社 |
结合有集成半导体加工模块的自感知校正异构平台及其使用方法
|
|
KR102656981B1
(ko)
*
|
2018-03-27 |
2024-04-11 |
가부시키가이샤 에바라 세이사꾸쇼 |
세정 장치, 이를 구비한 도금 장치 및 세정 방법
|
|
TWI706501B
(zh)
*
|
2019-01-25 |
2020-10-01 |
鴻勁精密股份有限公司 |
承載裝置及其應用之電子元件作業設備
|
|
US11633848B2
(en)
|
2019-07-31 |
2023-04-25 |
X Development Llc |
Independent pan of coaxial robotic arm and perception housing
|
|
KR20250011721A
(ko)
|
2020-10-07 |
2025-01-21 |
에어 테스트 시스템즈 |
일렉트로닉스 테스터
|
|
KR20240144217A
(ko)
*
|
2022-01-27 |
2024-10-02 |
퍼시몬 테크놀로지스 코포레이션 |
다수의 엔드-이펙터들을 가진 횡단 로봇
|
|
JP2024052004A
(ja)
*
|
2022-09-30 |
2024-04-11 |
株式会社安川電機 |
搬送システムおよび搬送方法
|