JP2000344940A5 - - Google Patents
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- Publication number
- JP2000344940A5 JP2000344940A5 JP1999314314A JP31431499A JP2000344940A5 JP 2000344940 A5 JP2000344940 A5 JP 2000344940A5 JP 1999314314 A JP1999314314 A JP 1999314314A JP 31431499 A JP31431499 A JP 31431499A JP 2000344940 A5 JP2000344940 A5 JP 2000344940A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- molding temperature
- requiring
- coupling agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 238000000465 moulding Methods 0.000 description 8
- 239000011342 resin composition Substances 0.000 description 7
- 239000007822 coupling agent Substances 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 229920005575 poly(amic acid) Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 229920002577 polybenzoxazole Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31431499A JP4462679B2 (ja) | 1999-03-30 | 1999-11-04 | シリコン系カップリング剤及びその用途 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9011999 | 1999-03-30 | ||
| JP11-90119 | 1999-03-30 | ||
| JP31431499A JP4462679B2 (ja) | 1999-03-30 | 1999-11-04 | シリコン系カップリング剤及びその用途 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009275205A Division JP5128574B2 (ja) | 1999-03-30 | 2009-12-03 | 感光性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000344940A JP2000344940A (ja) | 2000-12-12 |
| JP2000344940A5 true JP2000344940A5 (enExample) | 2006-12-14 |
| JP4462679B2 JP4462679B2 (ja) | 2010-05-12 |
Family
ID=18051869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31431499A Expired - Fee Related JP4462679B2 (ja) | 1999-03-30 | 1999-11-04 | シリコン系カップリング剤及びその用途 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4462679B2 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10053545A1 (de) * | 2000-10-27 | 2002-05-08 | Henkel Kgaa | Polymere mit Harnstoffgruppen und Silylgruppen, deren Herstellung und Verwendung |
| JP2002311574A (ja) * | 2001-04-13 | 2002-10-23 | Asahi Kasei Corp | 感光性樹脂組成物 |
| JP4836607B2 (ja) * | 2005-10-26 | 2011-12-14 | 旭化成イーマテリアルズ株式会社 | ポジ型感光性樹脂組成物 |
| JP4918313B2 (ja) * | 2006-09-01 | 2012-04-18 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
| JP4833040B2 (ja) * | 2006-11-22 | 2011-12-07 | 東京応化工業株式会社 | 感光性樹脂組成物及び液晶パネル用スペーサ |
| JP5419324B2 (ja) * | 2006-12-27 | 2014-02-19 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
| JP4931644B2 (ja) * | 2007-03-02 | 2012-05-16 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
| JP5241142B2 (ja) * | 2007-05-29 | 2013-07-17 | 旭化成イーマテリアルズ株式会社 | ポジ型感光性樹脂組成物 |
| KR101092114B1 (ko) | 2009-05-14 | 2011-12-12 | 단국대학교 산학협력단 | 아로마틱 그룹이 치환된 알콕시실란 화합물 및 이를 포함하는 소수성 코팅 조성물 |
| KR101384457B1 (ko) * | 2011-08-04 | 2014-04-14 | 주식회사 엘지화학 | 실란계 화합물 및 이를 포함하는 감광성 수지 조성물 |
| JP5867197B2 (ja) * | 2011-11-08 | 2016-02-24 | 東洋インキScホールディングス株式会社 | 感光性組成物、ならびにそれを用いた保護膜およびタッチパネル用絶縁膜 |
| JP5419952B2 (ja) * | 2011-12-02 | 2014-02-19 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
| JP6017301B2 (ja) * | 2012-12-20 | 2016-10-26 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置および有機el表示装置 |
| KR102174075B1 (ko) | 2012-12-21 | 2020-11-04 | 에이치디 마이크로시스템즈 가부시키가이샤 | 폴리이미드 전구체 수지 조성물 |
| JP6244871B2 (ja) * | 2013-12-13 | 2017-12-13 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体樹脂組成物 |
| CN106104381B (zh) * | 2014-03-17 | 2019-12-13 | 旭化成株式会社 | 感光性树脂组合物、固化浮雕图案的制造方法、以及半导体装置 |
| US9153357B1 (en) | 2014-03-27 | 2015-10-06 | Rohm And Haas Electronic Materials Llc | Adhesion promoter |
| US9136037B1 (en) | 2014-03-27 | 2015-09-15 | Rohm And Haas Electronic Materials Llc | Adhesion promoter |
| JP2017170410A (ja) * | 2016-03-25 | 2017-09-28 | 株式会社カネカ | 機能性フィルムの製造方法 |
| KR102402138B1 (ko) * | 2017-11-28 | 2022-05-25 | 아사히 가세이 가부시키가이샤 | 네거티브형 감광성 수지 조성물 및 그 제조 방법, 그리고 경화 릴리프 패턴의 제조 방법 |
| CN113512235B (zh) * | 2021-05-18 | 2023-05-02 | 广州市白云化工实业有限公司 | 改性填料、导热胶及其制备方法与应用 |
-
1999
- 1999-11-04 JP JP31431499A patent/JP4462679B2/ja not_active Expired - Fee Related
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