JP2000315666A - 半導体集積回路装置の製造方法 - Google Patents

半導体集積回路装置の製造方法

Info

Publication number
JP2000315666A
JP2000315666A JP11123061A JP12306199A JP2000315666A JP 2000315666 A JP2000315666 A JP 2000315666A JP 11123061 A JP11123061 A JP 11123061A JP 12306199 A JP12306199 A JP 12306199A JP 2000315666 A JP2000315666 A JP 2000315666A
Authority
JP
Japan
Prior art keywords
manufacturing
circuit device
integrated circuit
semiconductor integrated
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11123061A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000315666A5 (https=
Inventor
Toshinori Imai
俊則 今井
Tadashi Ohashi
直史 大橋
Yoshio Honma
喜夫 本間
Seiichi Kondo
誠一 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11123061A priority Critical patent/JP2000315666A/ja
Priority to TW089103619A priority patent/TW517296B/zh
Priority to US09/527,751 priority patent/US6509273B1/en
Priority to KR1020000013857A priority patent/KR20000076913A/ko
Publication of JP2000315666A publication Critical patent/JP2000315666A/ja
Publication of JP2000315666A5 publication Critical patent/JP2000315666A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
JP11123061A 1999-04-28 1999-04-28 半導体集積回路装置の製造方法 Pending JP2000315666A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP11123061A JP2000315666A (ja) 1999-04-28 1999-04-28 半導体集積回路装置の製造方法
TW089103619A TW517296B (en) 1999-04-28 2000-03-01 Method for manufacturing a semiconductor device
US09/527,751 US6509273B1 (en) 1999-04-28 2000-03-17 Method for manufacturing a semiconductor device
KR1020000013857A KR20000076913A (ko) 1999-04-28 2000-03-18 반도체 집적회로 디바이스 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11123061A JP2000315666A (ja) 1999-04-28 1999-04-28 半導体集積回路装置の製造方法

Publications (2)

Publication Number Publication Date
JP2000315666A true JP2000315666A (ja) 2000-11-14
JP2000315666A5 JP2000315666A5 (https=) 2004-10-28

Family

ID=14851242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11123061A Pending JP2000315666A (ja) 1999-04-28 1999-04-28 半導体集積回路装置の製造方法

Country Status (4)

Country Link
US (1) US6509273B1 (https=)
JP (1) JP2000315666A (https=)
KR (1) KR20000076913A (https=)
TW (1) TW517296B (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001077062A (ja) * 1999-09-06 2001-03-23 Jsr Corp 半導体装置の製造に用いる化学機械研磨用水系分散体
JP2001185515A (ja) * 1999-12-27 2001-07-06 Hitachi Ltd 研磨方法、配線形成方法、半導体装置の製造方法及び半導体集積回路装置
JP2002166360A (ja) * 2000-12-04 2002-06-11 Nikon Corp 研磨状況モニタ方法及びその装置、研磨装置、半導体デバイス製造方法、並びに半導体デバイス
JP2002359223A (ja) * 2001-05-30 2002-12-13 Shibaura Mechatronics Corp 洗浄液
KR20030020847A (ko) * 2001-09-04 2003-03-10 엔이씨 일렉트로닉스 코포레이션 반도체 장치의 제조 방법
JP2003273045A (ja) * 2001-12-28 2003-09-26 Hynix Semiconductor Inc Ｃｍｐスラリー及びこれを利用する半導体素子の金属配線コンタクトプラグの形成方法
US6831014B2 (en) 2001-09-04 2004-12-14 Nec Electronics Corporation Method of manufacturing a semiconductor apparatus using chemical mechanical polishing
JP2008010835A (ja) * 2006-05-31 2008-01-17 Sumitomo Electric Ind Ltd 窒化物結晶の表面処理方法、窒化物結晶基板、エピタキシャル層付窒化物結晶基板および半導体デバイス、ならびにエピタキシャル層付窒化物結晶基板および半導体デバイスの製造方法
JP2008028411A (ja) * 2007-09-03 2008-02-07 Jsr Corp 半導体装置の製造に用いる化学機械研磨用水系分散体
JP2008147444A (ja) * 2006-12-11 2008-06-26 Fujitsu Ltd 配線形成方法
JP2010219406A (ja) * 2009-03-18 2010-09-30 Tokyo Electron Ltd 化学的機械研磨方法
JP2013055366A (ja) * 2006-05-31 2013-03-21 Sumitomo Electric Ind Ltd ＧａＮ結晶の表面処理方法、ＧａＮ結晶基板、エピタキシャル層付ＧａＮ結晶基板および半導体デバイス、ならびにエピタキシャル層付ＧａＮ結晶基板および半導体デバイスの製造方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4554011B2 (ja) 1999-08-10 2010-09-29 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP2002050595A (ja) * 2000-08-04 2002-02-15 Hitachi Ltd 研磨方法、配線形成方法及び半導体装置の製造方法
JP2002367996A (ja) * 2001-06-06 2002-12-20 Nec Corp 半導体装置の製造方法
SG115405A1 (en) * 2001-09-17 2005-10-28 Inst Of Microelectronics Method for reducing dishing in chemical mechanical polishing
US6638326B2 (en) * 2001-09-25 2003-10-28 Ekc Technology, Inc. Compositions for chemical mechanical planarization of tantalum and tantalum nitride
US6730592B2 (en) * 2001-12-21 2004-05-04 Micron Technology, Inc. Methods for planarization of metal-containing surfaces using halogens and halide salts
US20030119316A1 (en) * 2001-12-21 2003-06-26 Micron Technology, Inc. Methods for planarization of group VIII metal-containing surfaces using oxidizing agents
US7121926B2 (en) * 2001-12-21 2006-10-17 Micron Technology, Inc. Methods for planarization of group VIII metal-containing surfaces using a fixed abrasive article
US7049237B2 (en) * 2001-12-21 2006-05-23 Micron Technology, Inc. Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases
JP4063619B2 (ja) * 2002-03-13 2008-03-19 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
JP4050631B2 (ja) * 2003-02-21 2008-02-20 株式会社ルネサステクノロジ 電子デバイスの製造方法
TWI264620B (en) * 2003-03-07 2006-10-21 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US20040266185A1 (en) * 2003-06-30 2004-12-30 Texas Instruments Incorporated Method for reducing integrated circuit defects
US6936534B2 (en) * 2003-09-17 2005-08-30 Micron Technology, Inc. Method for the post-etch cleaning of multi-level damascene structures having underlying copper metallization
US20050092620A1 (en) * 2003-10-01 2005-05-05 Applied Materials, Inc. Methods and apparatus for polishing a substrate
KR100795364B1 (ko) * 2004-02-10 2008-01-17 삼성전자주식회사 반도체 기판용 세정액 조성물, 이를 이용한 세정 방법 및도전성 구조물의 제조 방법
KR20050110470A (ko) * 2004-05-19 2005-11-23 테크노세미켐 주식회사 반도체 기판용 세정액 조성물, 이를 이용한 반도체 기판세정방법 및 반도체 장치 제조 방법
CN102402635B (zh) * 2010-09-19 2014-03-05 复旦大学 一种针对耦合电容影响的化学机械抛光工艺哑元金属填充方法
JP2014027012A (ja) * 2012-07-24 2014-02-06 Toshiba Corp 半導体装置の製造方法および半導体装置の製造装置
CN106415145B (zh) 2014-04-11 2019-08-06 特灵国际有限公司 Hvac系统和控制

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4954142A (en) 1989-03-07 1990-09-04 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
JPH0794455A (ja) 1993-09-24 1995-04-07 Sumitomo Metal Ind Ltd 配線の形成方法
JP3556978B2 (ja) 1993-12-14 2004-08-25 株式会社東芝 銅系金属の研磨方法
JP3397501B2 (ja) 1994-07-12 2003-04-14 株式会社東芝 研磨剤および研磨方法
JPH0864594A (ja) 1994-08-18 1996-03-08 Sumitomo Metal Ind Ltd 配線の形成方法
JPH0955362A (ja) * 1995-08-09 1997-02-25 Cypress Semiconductor Corp スクラッチを減少する集積回路の製造方法
JP3160545B2 (ja) 1997-01-28 2001-04-25 松下電器産業株式会社 埋め込み配線の形成方法
JP3371775B2 (ja) * 1997-10-31 2003-01-27 株式会社日立製作所 研磨方法
US6153043A (en) 1998-02-06 2000-11-28 International Business Machines Corporation Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing
US6261157B1 (en) * 1999-05-25 2001-07-17 Applied Materials, Inc. Selective damascene chemical mechanical polishing

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001077062A (ja) * 1999-09-06 2001-03-23 Jsr Corp 半導体装置の製造に用いる化学機械研磨用水系分散体
JP2001185515A (ja) * 1999-12-27 2001-07-06 Hitachi Ltd 研磨方法、配線形成方法、半導体装置の製造方法及び半導体集積回路装置
JP2002166360A (ja) * 2000-12-04 2002-06-11 Nikon Corp 研磨状況モニタ方法及びその装置、研磨装置、半導体デバイス製造方法、並びに半導体デバイス
JP2002359223A (ja) * 2001-05-30 2002-12-13 Shibaura Mechatronics Corp 洗浄液
US6831014B2 (en) 2001-09-04 2004-12-14 Nec Electronics Corporation Method of manufacturing a semiconductor apparatus using chemical mechanical polishing
KR20030020847A (ko) * 2001-09-04 2003-03-10 엔이씨 일렉트로닉스 코포레이션 반도체 장치의 제조 방법
JP2003077918A (ja) * 2001-09-04 2003-03-14 Nec Corp 半導体装置の製造方法
US6723626B2 (en) 2001-09-04 2004-04-20 Nec Electronics Corporation Method of manufacturing semiconductor device
JP2003273045A (ja) * 2001-12-28 2003-09-26 Hynix Semiconductor Inc Ｃｍｐスラリー及びこれを利用する半導体素子の金属配線コンタクトプラグの形成方法
JP2008010835A (ja) * 2006-05-31 2008-01-17 Sumitomo Electric Ind Ltd 窒化物結晶の表面処理方法、窒化物結晶基板、エピタキシャル層付窒化物結晶基板および半導体デバイス、ならびにエピタキシャル層付窒化物結晶基板および半導体デバイスの製造方法
JP2013055366A (ja) * 2006-05-31 2013-03-21 Sumitomo Electric Ind Ltd ＧａＮ結晶の表面処理方法、ＧａＮ結晶基板、エピタキシャル層付ＧａＮ結晶基板および半導体デバイス、ならびにエピタキシャル層付ＧａＮ結晶基板および半導体デバイスの製造方法
JP2008147444A (ja) * 2006-12-11 2008-06-26 Fujitsu Ltd 配線形成方法
JP2008028411A (ja) * 2007-09-03 2008-02-07 Jsr Corp 半導体装置の製造に用いる化学機械研磨用水系分散体
JP2010219406A (ja) * 2009-03-18 2010-09-30 Tokyo Electron Ltd 化学的機械研磨方法

Also Published As

Publication number Publication date
KR20000076913A (ko) 2000-12-26
TW517296B (en) 2003-01-11
US6509273B1 (en) 2003-01-21

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