JP2000269366A - 不揮発性半導体メモリ - Google Patents
不揮発性半導体メモリInfo
- Publication number
- JP2000269366A JP2000269366A JP7606199A JP7606199A JP2000269366A JP 2000269366 A JP2000269366 A JP 2000269366A JP 7606199 A JP7606199 A JP 7606199A JP 7606199 A JP7606199 A JP 7606199A JP 2000269366 A JP2000269366 A JP 2000269366A
- Authority
- JP
- Japan
- Prior art keywords
- memory cell
- potential
- select gate
- transistor
- channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Read Only Memory (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7606199A JP2000269366A (ja) | 1999-03-19 | 1999-03-19 | 不揮発性半導体メモリ |
| US09/526,849 US6243295B1 (en) | 1999-03-19 | 2000-03-16 | Nonvolatile semiconductor memory |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7606199A JP2000269366A (ja) | 1999-03-19 | 1999-03-19 | 不揮発性半導体メモリ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000269366A true JP2000269366A (ja) | 2000-09-29 |
| JP2000269366A5 JP2000269366A5 (https=) | 2005-07-07 |
Family
ID=13594266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7606199A Pending JP2000269366A (ja) | 1999-03-19 | 1999-03-19 | 不揮発性半導体メモリ |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6243295B1 (https=) |
| JP (1) | JP2000269366A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009065154A (ja) * | 2007-09-07 | 2009-03-26 | Dongbu Hitek Co Ltd | フラッシュメモリ及びその製造方法 |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6901006B1 (en) * | 1999-07-14 | 2005-05-31 | Hitachi, Ltd. | Semiconductor integrated circuit device including first, second and third gates |
| US20030030123A1 (en) * | 2001-08-10 | 2003-02-13 | Masayuki Ichige | Semiconductor memory device equipped with memory transistor and peripheral transistor and method of manufacturing the same |
| JP2003346484A (ja) * | 2002-05-23 | 2003-12-05 | Mitsubishi Electric Corp | 不揮発性半導体記憶装置 |
| JP4005895B2 (ja) | 2002-09-30 | 2007-11-14 | 株式会社東芝 | 不揮発性半導体メモリ装置 |
| JP2005056989A (ja) * | 2003-08-01 | 2005-03-03 | Toshiba Corp | 不揮発性半導体記憶装置及びその製造方法 |
| JP2005079165A (ja) * | 2003-08-28 | 2005-03-24 | Toshiba Corp | 不揮発性半導体記憶装置とその製造方法、電子カードおよび電子装置 |
| JP4398750B2 (ja) * | 2004-02-17 | 2010-01-13 | 株式会社東芝 | Nand型フラッシュメモリ |
| US7170793B2 (en) * | 2004-04-13 | 2007-01-30 | Sandisk Corporation | Programming inhibit for non-volatile memory |
| JP2006039966A (ja) * | 2004-07-27 | 2006-02-09 | Toshiba Corp | メモリカードおよびメモリカードに搭載されるカード用コントローラ並びにメモリカードの処理装置 |
| KR100583968B1 (ko) * | 2004-08-03 | 2006-05-26 | 삼성전자주식회사 | 스페이스 트랜치들을 갖는 불 휘발성 메모리 장치들 및 그형성방법들 |
| KR100680455B1 (ko) * | 2005-06-30 | 2007-02-08 | 주식회사 하이닉스반도체 | Nand형 플래쉬 메모리 소자, 그 제조 방법 및 그 구동방법 |
| KR100697294B1 (ko) * | 2006-01-04 | 2007-03-20 | 삼성전자주식회사 | 트랜지스터 및 상기 트랜지스터가 구비된 비휘발성 기억장치 |
| US7551467B2 (en) * | 2006-08-04 | 2009-06-23 | Micron Technology, Inc. | Memory device architectures and operation |
| US7440326B2 (en) * | 2006-09-06 | 2008-10-21 | Sandisk Corporation | Programming non-volatile memory with improved boosting |
| US7596031B2 (en) * | 2006-10-30 | 2009-09-29 | Sandisk Corporation | Faster programming of highest multi-level state for non-volatile memory |
| US7978520B2 (en) | 2007-09-27 | 2011-07-12 | Sandisk Corporation | Compensation of non-volatile memory chip non-idealities by program pulse adjustment |
| JP2010205944A (ja) * | 2009-03-04 | 2010-09-16 | Toshiba Corp | 不揮発性半導体記憶装置 |
| US20100322006A1 (en) * | 2009-06-22 | 2010-12-23 | Ming Sang Kwan | Nand memory cell string having a stacked select gate structure and process for for forming same |
| US10038004B2 (en) | 2009-06-22 | 2018-07-31 | Cypress Semiconductor Corporation | NAND memory cell string having a stacked select gate structure and process for for forming same |
| US20120008419A1 (en) * | 2010-07-09 | 2012-01-12 | Ha Joo Yun | Semiconductor memory device and method of operating the same |
| JP5017480B1 (ja) * | 2011-05-02 | 2012-09-05 | 株式会社東芝 | 半導体記憶装置 |
| US8526233B2 (en) | 2011-05-23 | 2013-09-03 | Sandisk Technologies Inc. | Ramping pass voltage to enhance channel boost in memory device, with optional temperature compensation |
| US9076544B2 (en) * | 2011-11-18 | 2015-07-07 | Sandisk Technologies Inc. | Operation for non-volatile storage system with shared bit lines |
| JP6071524B2 (ja) * | 2012-12-19 | 2017-02-01 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| WO2016044345A1 (en) | 2014-09-15 | 2016-03-24 | NEO Semiconductor, Inc. | Method and apparatus for providing multi-page read and write using sram and nonvolatile memory devices |
| JP2017111847A (ja) * | 2015-12-17 | 2017-06-22 | 株式会社東芝 | 半導体記憶装置 |
| WO2021261744A1 (ko) * | 2020-06-23 | 2021-12-30 | 한양대학교 산학협력단 | 백 게이트를 포함하는 3차원 플래시 메모리 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5088060A (en) * | 1989-03-08 | 1992-02-11 | Kabushiki Kaisha Toshiba | Electrically erasable programmable read-only memory with NAND memory cell structure |
| JP3354418B2 (ja) * | 1997-01-20 | 2002-12-09 | 株式会社東芝 | 半導体記憶装置 |
| JP3519583B2 (ja) | 1997-09-19 | 2004-04-19 | 株式会社東芝 | 不揮発性半導体記憶装置およびその製造方法 |
-
1999
- 1999-03-19 JP JP7606199A patent/JP2000269366A/ja active Pending
-
2000
- 2000-03-16 US US09/526,849 patent/US6243295B1/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009065154A (ja) * | 2007-09-07 | 2009-03-26 | Dongbu Hitek Co Ltd | フラッシュメモリ及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6243295B1 (en) | 2001-06-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000269366A (ja) | 不揮発性半導体メモリ | |
| US7045423B2 (en) | Non-volatile semiconductor memory device with multi-layer gate structure | |
| US7372736B2 (en) | Monolithic, combo nonvolatile memory allowing byte, page and block write with no disturb and divided-well in the cell array using a unified cell structure and technology with a new scheme of decoder and layout | |
| JP5317742B2 (ja) | 半導体装置 | |
| USRE39697E1 (en) | Method of making floating-gate memory-cell array with digital logic transistors | |
| US6819590B2 (en) | Semiconductor memory | |
| KR101026588B1 (ko) | 메모리 셀이 공유하는 측면 전극을 구비한 nand 타입 비휘발성 반도체 메모리 디바이스 | |
| JP3540579B2 (ja) | 半導体記憶装置及びその製造方法 | |
| KR20050016108A (ko) | 불휘발성 반도체 기억 장치 및 그 동작 방법, 제조 방법,반도체 집적 회로 및 시스템 | |
| JPH1154732A (ja) | 不揮発性半導体記憶装置 | |
| US7362615B2 (en) | Methods for active boosting to minimize capacitive coupling effect between adjacent gates of flash memory devices | |
| KR100379553B1 (ko) | 플래쉬 메모리 셀의 어레이 및 이를 이용한 데이터프로그램방법 및 소거방법 | |
| US6222769B1 (en) | Nonvolatile semiconductor storage device having buried electrode within shallow trench | |
| US7808826B2 (en) | Non-volatile storage with individually controllable shield plates between storage elements | |
| US8062944B2 (en) | Method for fabricating non-volatile storage with individually controllable shield plates between storage elements | |
| US20070147119A1 (en) | Active boosting to minimize capacitive coupling effect between adjacent gates of flash memory devices | |
| US7636260B2 (en) | Method for operating non-volatile storage with individually controllable shield plates between storage elements | |
| JP2011192898A (ja) | 半導体記憶装置及びその製造方法 | |
| CN101711413B (zh) | 具有位于存储元件之间的可单独控制的屏蔽板的非易失性存储装置 | |
| JP2001015717A (ja) | 不揮発性半導体記憶装置 | |
| JP2001160618A (ja) | 不揮発性半導体記憶装置及びその製造方法 | |
| JPH05259413A (ja) | 不揮発性半導体記憶装置およびその製造方法 | |
| JP2001284554A (ja) | 不揮発性半導体メモリ | |
| JPH10189781A (ja) | 不揮発性半導体記憶装置 | |
| JP2001015615A (ja) | 不揮発性半導体記憶装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041101 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041101 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050527 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080624 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20081021 |