JP2000252242A5 - - Google Patents

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Publication number
JP2000252242A5
JP2000252242A5 JP1999352884A JP35288499A JP2000252242A5 JP 2000252242 A5 JP2000252242 A5 JP 2000252242A5 JP 1999352884 A JP1999352884 A JP 1999352884A JP 35288499 A JP35288499 A JP 35288499A JP 2000252242 A5 JP2000252242 A5 JP 2000252242A5
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JP
Japan
Prior art keywords
metal
polishing
component
agent
surfactant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999352884A
Other languages
English (en)
Japanese (ja)
Other versions
JP4816836B2 (ja
JP2000252242A (ja
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Publication date
Application filed filed Critical
Priority to JP35288499A priority Critical patent/JP4816836B2/ja
Priority claimed from JP35288499A external-priority patent/JP4816836B2/ja
Publication of JP2000252242A publication Critical patent/JP2000252242A/ja
Publication of JP2000252242A5 publication Critical patent/JP2000252242A5/ja
Application granted granted Critical
Publication of JP4816836B2 publication Critical patent/JP4816836B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP35288499A 1998-12-28 1999-12-13 金属用研磨液及びそれを用いた研磨方法 Expired - Lifetime JP4816836B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35288499A JP4816836B2 (ja) 1998-12-28 1999-12-13 金属用研磨液及びそれを用いた研磨方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1998372605 1998-12-28
JP37260598 1998-12-28
JP10-372605 1998-12-28
JP35288499A JP4816836B2 (ja) 1998-12-28 1999-12-13 金属用研磨液及びそれを用いた研磨方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010181851A Division JP5429104B2 (ja) 1998-12-28 2010-08-16 金属用研磨液及びそれを用いた研磨方法

Publications (3)

Publication Number Publication Date
JP2000252242A JP2000252242A (ja) 2000-09-14
JP2000252242A5 true JP2000252242A5 (enExample) 2006-12-28
JP4816836B2 JP4816836B2 (ja) 2011-11-16

Family

ID=26579725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35288499A Expired - Lifetime JP4816836B2 (ja) 1998-12-28 1999-12-13 金属用研磨液及びそれを用いた研磨方法

Country Status (1)

Country Link
JP (1) JP4816836B2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100597449B1 (ko) 1998-12-28 2006-07-06 히다치 가세고교 가부시끼가이샤 금속용 연마액 재료, 금속용 연마액, 그 제조방법 및그것을 사용한 연마방법
JP3463045B2 (ja) 2000-03-03 2003-11-05 Ｎｅｃエレクトロニクス株式会社 防食処理原液
TWI229123B (en) 2000-03-03 2005-03-11 Nec Electronics Corp Anticorrosive treating concentrate
JP4951808B2 (ja) * 2000-10-26 2012-06-13 日立化成工業株式会社 金属用研磨液及び研磨方法
SG144688A1 (en) * 2001-07-23 2008-08-28 Fujimi Inc Polishing composition and polishing method employing it
KR20030013146A (ko) * 2001-08-07 2003-02-14 에이스하이텍 주식회사 실리콘 웨이퍼 연마제 조성물과 그 제조방법
KR100432637B1 (ko) * 2001-08-07 2004-05-22 제일모직주식회사 구리배선 연마용 ｃｍｐ 슬러리
US6936543B2 (en) * 2002-06-07 2005-08-30 Cabot Microelectronics Corporation CMP method utilizing amphiphilic nonionic surfactants
JP4608196B2 (ja) * 2003-09-30 2011-01-05 株式会社フジミインコーポレーテッド 研磨用組成物
EP1670047B1 (en) * 2003-09-30 2010-04-07 Fujimi Incorporated Polishing composition and polishing method
JP2006121001A (ja) * 2004-10-25 2006-05-11 Matsushita Electric Ind Co Ltd 半導体装置の製造方法および研磨剤
US7348276B2 (en) 2005-03-30 2008-03-25 Fujitsu, Limited Fabrication process of semiconductor device and polishing method
JP2007184395A (ja) * 2006-01-06 2007-07-19 Fujifilm Corp 金属用研磨液
JP5725145B2 (ja) * 2006-10-11 2015-05-27 日立化成株式会社 金属用研磨液とその製造方法及び金属用研磨液を用いた被研磨膜の研磨方法
JP2008124222A (ja) * 2006-11-10 2008-05-29 Fujifilm Corp 研磨液
JP5094112B2 (ja) * 2006-12-28 2012-12-12 富士フイルム株式会社 研磨液
JP5094139B2 (ja) * 2007-01-23 2012-12-12 富士フイルム株式会社 研磨液
JP5285866B2 (ja) * 2007-03-26 2013-09-11 富士フイルム株式会社 研磨液
JP5403922B2 (ja) 2008-02-26 2014-01-29 富士フイルム株式会社 研磨液および研磨方法
WO2015060610A1 (ko) * 2013-10-23 2015-04-30 주식회사 동진쎄미켐 금속막 연마 슬러리 조성물 및 이를 이용한 금속막 연마 시 발생하는 스크래치의 감소 방법
CN108581814A (zh) * 2018-05-21 2018-09-28 浙江工业大学 用于医用钛合金螺钉的气囊液态金属抛光机

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3800834A1 (de) * 1988-01-14 1989-07-27 Henkel Kgaa Verfahren und mittel zum gleichzeitigen gleitschleifen, reinigen und passivieren metallischer werkstuecke
JP3435698B2 (ja) * 1992-03-11 2003-08-11 三菱瓦斯化学株式会社 半導体基板の洗浄液
US5863838A (en) * 1996-07-22 1999-01-26 Motorola, Inc. Method for chemically-mechanically polishing a metal layer
JP3291205B2 (ja) * 1996-08-27 2002-06-10 松下電工株式会社 磁気研磨方法
KR19980032145A (ko) * 1996-10-04 1998-07-25 포만제프리엘 알루미늄 구리 합금의 화학기계적 연마시 구리 도금을 방지하는 방법
US6309560B1 (en) * 1996-12-09 2001-10-30 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
JPH10273648A (ja) * 1997-03-28 1998-10-13 Fuji Photo Film Co Ltd 研磨液
JPH10310766A (ja) * 1997-05-14 1998-11-24 Fujimi Inkooporeetetsudo:Kk 研磨用組成物
US6063306A (en) * 1998-06-26 2000-05-16 Cabot Corporation Chemical mechanical polishing slurry useful for copper/tantalum substrate
US6217416B1 (en) * 1998-06-26 2001-04-17 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper/tantalum substrates
JP4053165B2 (ja) * 1998-12-01 2008-02-27 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
JP2000160139A (ja) * 1998-12-01 2000-06-13 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法

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