JP2000252244A5 - - Google Patents
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- Publication number
- JP2000252244A5 JP2000252244A5 JP1999368848A JP36884899A JP2000252244A5 JP 2000252244 A5 JP2000252244 A5 JP 2000252244A5 JP 1999368848 A JP1999368848 A JP 1999368848A JP 36884899 A JP36884899 A JP 36884899A JP 2000252244 A5 JP2000252244 A5 JP 2000252244A5
- Authority
- JP
- Japan
- Prior art keywords
- water
- metal
- solubility
- weight
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 39
- 239000003795 chemical substances by application Substances 0.000 description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 35
- 238000005498 polishing Methods 0.000 description 31
- 230000001681 protective effect Effects 0.000 description 26
- 238000000034 method Methods 0.000 description 11
- 229910044991 metal oxide Inorganic materials 0.000 description 10
- 150000004706 metal oxides Chemical class 0.000 description 10
- 239000007800 oxidant agent Substances 0.000 description 10
- 239000007864 aqueous solution Substances 0.000 description 9
- 239000012141 concentrate Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 150000001412 amines Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 150000003851 azoles Chemical class 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36884899A JP2000252244A (ja) | 1998-12-28 | 1999-12-27 | 金属用研磨液及びそれを用いた研磨方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10-372606 | 1998-12-28 | ||
| JP37260698 | 1998-12-28 | ||
| JP36884899A JP2000252244A (ja) | 1998-12-28 | 1999-12-27 | 金属用研磨液及びそれを用いた研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000252244A JP2000252244A (ja) | 2000-09-14 |
| JP2000252244A5 true JP2000252244A5 (enExample) | 2007-02-15 |
Family
ID=26582043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36884899A Pending JP2000252244A (ja) | 1998-12-28 | 1999-12-27 | 金属用研磨液及びそれを用いた研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000252244A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000039844A1 (fr) | 1998-12-28 | 2000-07-06 | Hitachi Chemical Company, Ltd. | Materiaux pour liquide de polissage de metal, liquide de polissage de metal, procede de preparation et procede de polissage connexes |
| JP2004127327A (ja) * | 1999-12-27 | 2004-04-22 | Showa Denko Kk | 磁気ディスク基板研磨用組成物 |
| EP1828333B1 (en) * | 2004-12-22 | 2011-10-19 | Showa Denko K.K. | Polishing composition and polishing method |
-
1999
- 1999-12-27 JP JP36884899A patent/JP2000252244A/ja active Pending
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