JP2000252243A5 - - Google Patents

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Publication number
JP2000252243A5
JP2000252243A5 JP1999352885A JP35288599A JP2000252243A5 JP 2000252243 A5 JP2000252243 A5 JP 2000252243A5 JP 1999352885 A JP1999352885 A JP 1999352885A JP 35288599 A JP35288599 A JP 35288599A JP 2000252243 A5 JP2000252243 A5 JP 2000252243A5
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JP
Japan
Prior art keywords
metal
protective film
forming agent
film forming
agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999352885A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000252243A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP35288599A priority Critical patent/JP2000252243A/ja
Priority claimed from JP35288599A external-priority patent/JP2000252243A/ja
Publication of JP2000252243A publication Critical patent/JP2000252243A/ja
Publication of JP2000252243A5 publication Critical patent/JP2000252243A5/ja
Pending legal-status Critical Current

Links

JP35288599A 1998-12-28 1999-12-13 金属用研磨液及びそれを用いた研磨方法 Pending JP2000252243A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35288599A JP2000252243A (ja) 1998-12-28 1999-12-13 金属用研磨液及びそれを用いた研磨方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP37260898 1998-12-28
JP10-372608 1998-12-28
JP35288599A JP2000252243A (ja) 1998-12-28 1999-12-13 金属用研磨液及びそれを用いた研磨方法

Publications (2)

Publication Number Publication Date
JP2000252243A JP2000252243A (ja) 2000-09-14
JP2000252243A5 true JP2000252243A5 (enExample) 2007-02-22

Family

ID=26579726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35288599A Pending JP2000252243A (ja) 1998-12-28 1999-12-13 金属用研磨液及びそれを用いた研磨方法

Country Status (1)

Country Link
JP (1) JP2000252243A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1833085A1 (en) * 1998-12-28 2007-09-12 Hitachi Chemical Company, Ltd. Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
EP1198534B1 (en) 1999-07-13 2004-10-13 Kao Corporation Polishing liquid composition
JP4614497B2 (ja) * 1999-07-13 2011-01-19 花王株式会社 研磨液組成物
TWI257126B (en) * 2002-07-25 2006-06-21 Hitachi Chemical Co Ltd Slurry and polishing method
JP4667013B2 (ja) * 2003-11-14 2011-04-06 昭和電工株式会社 研磨組成物および研磨方法
US7348276B2 (en) 2005-03-30 2008-03-25 Fujitsu, Limited Fabrication process of semiconductor device and polishing method
JP5433936B2 (ja) * 2006-10-11 2014-03-05 日立化成株式会社 金属用研磨液とその製造方法及び金属用研磨液を用いた被研磨膜の研磨方法
WO2010098734A1 (en) * 2009-02-26 2010-09-02 Ppt Research, Inc. Corrosion inhibiting compositions
CN108527012A (zh) * 2018-05-21 2018-09-14 浙江工业大学 一种利用液态金属抛光液进行大平面抛光的装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864594A (ja) * 1994-08-18 1996-03-08 Sumitomo Metal Ind Ltd 配線の形成方法
JPH10163141A (ja) * 1996-12-02 1998-06-19 Fujimi Inkooporeetetsudo:Kk 銅の研磨用組成物
US6309560B1 (en) * 1996-12-09 2001-10-30 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
KR100571892B1 (ko) * 1997-04-30 2006-04-18 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 반도체 웨이퍼 상부 표면의 평탄화 방법

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