JP2000034347A5 - - Google Patents

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Publication number
JP2000034347A5
JP2000034347A5 JP1998236385A JP23638598A JP2000034347A5 JP 2000034347 A5 JP2000034347 A5 JP 2000034347A5 JP 1998236385 A JP1998236385 A JP 1998236385A JP 23638598 A JP23638598 A JP 23638598A JP 2000034347 A5 JP2000034347 A5 JP 2000034347A5
Authority
JP
Japan
Prior art keywords
carboxyl group
alkaline solution
aqueous alkaline
soluble
developed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998236385A
Other languages
English (en)
Japanese (ja)
Other versions
JP3972481B2 (ja
JP2000034347A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP23638598A external-priority patent/JP3972481B2/ja
Priority to JP23638598A priority Critical patent/JP3972481B2/ja
Priority to US09/259,069 priority patent/US6486290B1/en
Priority to EP99104024A priority patent/EP0957125B1/en
Priority to DE69908487T priority patent/DE69908487T2/de
Priority to US09/496,098 priority patent/US6245484B1/en
Publication of JP2000034347A publication Critical patent/JP2000034347A/ja
Priority to US09/982,634 priority patent/US6582885B2/en
Publication of JP2000034347A5 publication Critical patent/JP2000034347A5/ja
Publication of JP3972481B2 publication Critical patent/JP3972481B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP23638598A 1998-05-14 1998-08-07 感光性組成物 Expired - Fee Related JP3972481B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP23638598A JP3972481B2 (ja) 1998-05-14 1998-08-07 感光性組成物
US09/259,069 US6486290B1 (en) 1998-05-14 1999-02-26 Polyimides, process for producing the same and photosensitive composition containing the same
EP99104024A EP0957125B1 (en) 1998-05-14 1999-03-15 Polyimides, process for producing the same and photosensitive composition containing the same
DE69908487T DE69908487T2 (de) 1998-05-14 1999-03-15 Polyimide, Verfahren zu ihrer Herstellung und diese enthaltende photoempfindliche Zusammensetzungen
US09/496,098 US6245484B1 (en) 1998-05-14 2000-02-01 Polymides, process for producing the same and photosensitive composition the same
US09/982,634 US6582885B2 (en) 1998-05-14 2001-10-18 Polyimides, process for producing the same and photosensitive composition containing the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP15074298 1998-05-14
JP10-150742 1998-05-14
JP23638598A JP3972481B2 (ja) 1998-05-14 1998-08-07 感光性組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006199422A Division JP4811162B2 (ja) 1998-05-14 2006-07-21 ポリイミドおよびその製造法

Publications (3)

Publication Number Publication Date
JP2000034347A JP2000034347A (ja) 2000-02-02
JP2000034347A5 true JP2000034347A5 (enExample) 2005-03-17
JP3972481B2 JP3972481B2 (ja) 2007-09-05

Family

ID=26480238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23638598A Expired - Fee Related JP3972481B2 (ja) 1998-05-14 1998-08-07 感光性組成物

Country Status (4)

Country Link
US (3) US6486290B1 (enExample)
EP (1) EP0957125B1 (enExample)
JP (1) JP3972481B2 (enExample)
DE (1) DE69908487T2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4811162B2 (ja) * 1998-05-14 2011-11-09 日本メクトロン株式会社 ポリイミドおよびその製造法
JP3972481B2 (ja) * 1998-05-14 2007-09-05 日本メクトロン株式会社 感光性組成物
WO2000073853A1 (en) * 1999-05-31 2000-12-07 Pi R&D Co., Ltd. Method for forming polyimide pattern using photosensitive polyimide and composition for use therein
JP3982296B2 (ja) * 2002-03-27 2007-09-26 日本メクトロン株式会社 新規ポリイミド共重合体
TWI265377B (en) * 2005-12-19 2006-11-01 Ind Tech Res Inst Negative photoresist composition
WO2016124493A1 (en) 2015-02-02 2016-08-11 Basf Se Latent acids and their use
JP7209809B2 (ja) 2019-03-27 2023-01-20 株式会社カネカ アルカリ可溶性ポリイミドおよびその製造方法、ネガ型感光性樹脂組成物、硬化膜、ならびにパターン硬化膜の製造方法
CN110804181B (zh) * 2019-11-06 2021-04-20 中山大学 一种透明光敏聚酰亚胺树脂、聚酰亚胺薄膜及其制备方法
CN119798106A (zh) * 2024-12-04 2025-04-11 中山大学 一种二胺单体、聚酰亚胺及其制备方法与应用

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57131227A (en) 1981-02-09 1982-08-14 Nippon Telegr & Teleph Corp <Ntt> Photopolymer and its production
JPS59145216A (ja) 1983-02-07 1984-08-20 Ube Ind Ltd 有機溶媒可溶性の感光性ポリアミドイミド
US4826886A (en) * 1988-05-26 1989-05-02 Ethyl Corporation Polyimide foams and their production
US5194518A (en) * 1989-09-01 1993-03-16 Nitto Denko Corporation Thermosetting resin composition comprising perfluoro containing amine terminated oligomer and polymaleimide
US5477360A (en) * 1993-04-23 1995-12-19 Kabushiki Kaisha Toshiba Liquid crystal display device
US5693379A (en) * 1994-10-20 1997-12-02 Chisso Corporation Polyimide
US5643986A (en) 1995-03-17 1997-07-01 Ube Industries, Ltd. Polyimidosiloxane compositions
US6071667A (en) * 1995-04-13 2000-06-06 Hitachi Chemical Co., Ltd. Photosensitive resin composition containing a photosensitive polyamide resin
US6096480A (en) * 1995-07-28 2000-08-01 Ube Industries, Ltd. Photosensitive polyimidosiloxane compositions and insulating films made thereof
JP3550913B2 (ja) 1995-10-31 2004-08-04 宇部興産株式会社 ポリイミドシロキサンおよびその製法
JP3321548B2 (ja) * 1996-06-17 2002-09-03 株式会社日立製作所 感光性ポリイミド前駆体組成物、およびそれを用いたパターン形成方法
US6117510A (en) * 1996-07-30 2000-09-12 Ube Industries, Ltd. Adhesive-applied tape
JP3968835B2 (ja) * 1996-12-20 2007-08-29 日本メクトロン株式会社 シロキサンポリイミドを含有する耐熱性接着剤
JP3700311B2 (ja) * 1997-02-05 2005-09-28 日本メクトロン株式会社 シロキサンポリイミドおよびそれを含有する耐熱性接着剤
US6025461A (en) * 1997-09-26 2000-02-15 Nippon Mektron, Limited Photosensitive polyimide
JP4016226B2 (ja) * 1998-01-14 2007-12-05 味の素株式会社 変成ポリイミド樹脂及びこれを含有する熱硬化性樹脂組成物
JP3968884B2 (ja) * 1998-05-01 2007-08-29 日本メクトロン株式会社 感光性組成物
JP3972481B2 (ja) * 1998-05-14 2007-09-05 日本メクトロン株式会社 感光性組成物
JP3950560B2 (ja) * 1998-08-14 2007-08-01 株式会社巴川製紙所 電子部品用接着剤および電子部品用接着テープ
US6686106B2 (en) * 2000-06-26 2004-02-03 Ube Industries, Ltd. Photosensitive resin compositions, insulating films, and processes for formation of the films
JP2002012667A (ja) * 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜

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