JP3972481B2 - 感光性組成物 - Google Patents
感光性組成物 Download PDFInfo
- Publication number
- JP3972481B2 JP3972481B2 JP23638598A JP23638598A JP3972481B2 JP 3972481 B2 JP3972481 B2 JP 3972481B2 JP 23638598 A JP23638598 A JP 23638598A JP 23638598 A JP23638598 A JP 23638598A JP 3972481 B2 JP3972481 B2 JP 3972481B2
- Authority
- JP
- Japan
- Prior art keywords
- mol
- carboxyl group
- polyimide
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title claims description 15
- 229920001721 polyimide Polymers 0.000 claims description 63
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 55
- 239000004642 Polyimide Substances 0.000 claims description 52
- -1 diamine compounds Chemical class 0.000 claims description 31
- 239000007864 aqueous solution Substances 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 150000004985 diamines Chemical class 0.000 claims description 11
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 6
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 6
- 125000004018 acid anhydride group Chemical group 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims 1
- 125000002541 furyl group Chemical group 0.000 claims 1
- 239000010408 film Substances 0.000 description 13
- 239000003960 organic solvent Substances 0.000 description 13
- 239000000243 solution Substances 0.000 description 13
- 239000000047 product Substances 0.000 description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- UENRXLSRMCSUSN-UHFFFAOYSA-N 3,5-diaminobenzoic acid Chemical compound NC1=CC(N)=CC(C(O)=O)=C1 UENRXLSRMCSUSN-UHFFFAOYSA-N 0.000 description 8
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- GOJFAKBEASOYNM-UHFFFAOYSA-N 2-(2-aminophenoxy)aniline Chemical compound NC1=CC=CC=C1OC1=CC=CC=C1N GOJFAKBEASOYNM-UHFFFAOYSA-N 0.000 description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000006297 dehydration reaction Methods 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 239000002798 polar solvent Substances 0.000 description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 230000036211 photosensitivity Effects 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- KUMMBDBTERQYCG-UHFFFAOYSA-N 2,6-bis(hydroxymethyl)-4-methylphenol Chemical compound CC1=CC(CO)=C(O)C(CO)=C1 KUMMBDBTERQYCG-UHFFFAOYSA-N 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- QLBRROYTTDFLDX-UHFFFAOYSA-N [3-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCCC(CN)C1 QLBRROYTTDFLDX-UHFFFAOYSA-N 0.000 description 2
- 229960004050 aminobenzoic acid Drugs 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- KTDDZZHARWUQCJ-UHFFFAOYSA-N butan-2-one;2-methoxyethanol Chemical compound CCC(C)=O.COCCO KTDDZZHARWUQCJ-UHFFFAOYSA-N 0.000 description 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- GEKIOKHXXBFTEU-UHFFFAOYSA-N 1-benzyl-9,10-diethoxy-3-nitroanthracene-2-sulfonic acid Chemical compound OS(=O)(=O)C1=C([N+]([O-])=O)C=C2C(OCC)=C3C=CC=CC3=C(OCC)C2=C1CC1=CC=CC=C1 GEKIOKHXXBFTEU-UHFFFAOYSA-N 0.000 description 1
- YDBHSDRXUCPTQQ-UHFFFAOYSA-N 1-methylcyclohexan-1-amine Chemical compound CC1(N)CCCCC1 YDBHSDRXUCPTQQ-UHFFFAOYSA-N 0.000 description 1
- WIOZZYWDYUOMAY-UHFFFAOYSA-N 2,5-diaminoterephthalic acid Chemical compound NC1=CC(C(O)=O)=C(N)C=C1C(O)=O WIOZZYWDYUOMAY-UHFFFAOYSA-N 0.000 description 1
- MWGGRRBSDWVAEF-UHFFFAOYSA-N 2-(hydroxymethyl)-4,6-dimethylphenol Chemical compound CC1=CC(C)=C(O)C(CO)=C1 MWGGRRBSDWVAEF-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- WCXGOVYROJJXHA-UHFFFAOYSA-N 3-[4-[4-(3-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)S(=O)(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 WCXGOVYROJJXHA-UHFFFAOYSA-N 0.000 description 1
- YERRQNKNDLEKMT-UHFFFAOYSA-N 3-amino-2-[(2-amino-6-carboxyphenyl)methyl]benzoic acid Chemical compound C(C1=C(C(=O)O)C=CC=C1N)C1=C(C(=O)O)C=CC=C1N YERRQNKNDLEKMT-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- UZXAVZACBLNJTH-UHFFFAOYSA-N 5-(2,5-dioxooxolan-3-yl)-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound O=C1OC(=O)CC1C1C=CC(C(=O)OC2=O)C2C1 UZXAVZACBLNJTH-UHFFFAOYSA-N 0.000 description 1
- JYCTWJFSRDBYJX-UHFFFAOYSA-N 5-(2,5-dioxooxolan-3-yl)-3a,4,5,9b-tetrahydrobenzo[e][2]benzofuran-1,3-dione Chemical compound O=C1OC(=O)CC1C1C2=CC=CC=C2C(C(=O)OC2=O)C2C1 JYCTWJFSRDBYJX-UHFFFAOYSA-N 0.000 description 1
- DGQOZCNCJKEVOA-UHFFFAOYSA-N 5-(2,5-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1CC(=O)OC1=O DGQOZCNCJKEVOA-UHFFFAOYSA-N 0.000 description 1
- LCTQFDHZQGFUQY-UHFFFAOYSA-N 5-(2,5-dioxooxolan-3-yl)cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound O=C1OC(CC1C1C=CC(C(C1)C(=O)O)C(=O)O)=O LCTQFDHZQGFUQY-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- SQAMZFDWYRVIMG-UHFFFAOYSA-N [3,5-bis(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC(CO)=CC(CO)=C1 SQAMZFDWYRVIMG-UHFFFAOYSA-N 0.000 description 1
- IFGNAVHGUKSSOI-UHFFFAOYSA-N [3-(hydroxymethyl)-2-methoxy-5-methylphenyl]methanol Chemical compound COC1=C(CO)C=C(C)C=C1CO IFGNAVHGUKSSOI-UHFFFAOYSA-N 0.000 description 1
- CRPGWWFTEMIUQJ-UHFFFAOYSA-M [I+](c1ccccc1)c1ccccc1.COc1cccc2cc3cccc(c3c(OC)c12)S([O-])(=O)=O Chemical compound [I+](c1ccccc1)c1ccccc1.COc1cccc2cc3cccc(c3c(OC)c12)S([O-])(=O)=O CRPGWWFTEMIUQJ-UHFFFAOYSA-M 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005802 health problem Effects 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000003586 protic polar solvent Substances 0.000 description 1
- 229940024463 silicone emollient and protective product Drugs 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
- C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/128—Radiation-activated cross-linking agent containing
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23638598A JP3972481B2 (ja) | 1998-05-14 | 1998-08-07 | 感光性組成物 |
| US09/259,069 US6486290B1 (en) | 1998-05-14 | 1999-02-26 | Polyimides, process for producing the same and photosensitive composition containing the same |
| EP99104024A EP0957125B1 (en) | 1998-05-14 | 1999-03-15 | Polyimides, process for producing the same and photosensitive composition containing the same |
| DE69908487T DE69908487T2 (de) | 1998-05-14 | 1999-03-15 | Polyimide, Verfahren zu ihrer Herstellung und diese enthaltende photoempfindliche Zusammensetzungen |
| US09/496,098 US6245484B1 (en) | 1998-05-14 | 2000-02-01 | Polymides, process for producing the same and photosensitive composition the same |
| US09/982,634 US6582885B2 (en) | 1998-05-14 | 2001-10-18 | Polyimides, process for producing the same and photosensitive composition containing the same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15074298 | 1998-05-14 | ||
| JP10-150742 | 1998-05-14 | ||
| JP23638598A JP3972481B2 (ja) | 1998-05-14 | 1998-08-07 | 感光性組成物 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006199422A Division JP4811162B2 (ja) | 1998-05-14 | 2006-07-21 | ポリイミドおよびその製造法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000034347A JP2000034347A (ja) | 2000-02-02 |
| JP2000034347A5 JP2000034347A5 (enExample) | 2005-03-17 |
| JP3972481B2 true JP3972481B2 (ja) | 2007-09-05 |
Family
ID=26480238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23638598A Expired - Fee Related JP3972481B2 (ja) | 1998-05-14 | 1998-08-07 | 感光性組成物 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US6486290B1 (enExample) |
| EP (1) | EP0957125B1 (enExample) |
| JP (1) | JP3972481B2 (enExample) |
| DE (1) | DE69908487T2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4811162B2 (ja) * | 1998-05-14 | 2011-11-09 | 日本メクトロン株式会社 | ポリイミドおよびその製造法 |
| JP3972481B2 (ja) * | 1998-05-14 | 2007-09-05 | 日本メクトロン株式会社 | 感光性組成物 |
| WO2000073853A1 (en) * | 1999-05-31 | 2000-12-07 | Pi R&D Co., Ltd. | Method for forming polyimide pattern using photosensitive polyimide and composition for use therein |
| JP3982296B2 (ja) * | 2002-03-27 | 2007-09-26 | 日本メクトロン株式会社 | 新規ポリイミド共重合体 |
| TWI265377B (en) * | 2005-12-19 | 2006-11-01 | Ind Tech Res Inst | Negative photoresist composition |
| WO2016124493A1 (en) | 2015-02-02 | 2016-08-11 | Basf Se | Latent acids and their use |
| JP7209809B2 (ja) | 2019-03-27 | 2023-01-20 | 株式会社カネカ | アルカリ可溶性ポリイミドおよびその製造方法、ネガ型感光性樹脂組成物、硬化膜、ならびにパターン硬化膜の製造方法 |
| CN110804181B (zh) * | 2019-11-06 | 2021-04-20 | 中山大学 | 一种透明光敏聚酰亚胺树脂、聚酰亚胺薄膜及其制备方法 |
| CN119798106A (zh) * | 2024-12-04 | 2025-04-11 | 中山大学 | 一种二胺单体、聚酰亚胺及其制备方法与应用 |
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| JPS57131227A (en) | 1981-02-09 | 1982-08-14 | Nippon Telegr & Teleph Corp <Ntt> | Photopolymer and its production |
| JPS59145216A (ja) | 1983-02-07 | 1984-08-20 | Ube Ind Ltd | 有機溶媒可溶性の感光性ポリアミドイミド |
| US4826886A (en) * | 1988-05-26 | 1989-05-02 | Ethyl Corporation | Polyimide foams and their production |
| US5194518A (en) * | 1989-09-01 | 1993-03-16 | Nitto Denko Corporation | Thermosetting resin composition comprising perfluoro containing amine terminated oligomer and polymaleimide |
| US5477360A (en) * | 1993-04-23 | 1995-12-19 | Kabushiki Kaisha Toshiba | Liquid crystal display device |
| US5693379A (en) * | 1994-10-20 | 1997-12-02 | Chisso Corporation | Polyimide |
| US5643986A (en) | 1995-03-17 | 1997-07-01 | Ube Industries, Ltd. | Polyimidosiloxane compositions |
| US6071667A (en) * | 1995-04-13 | 2000-06-06 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition containing a photosensitive polyamide resin |
| US6096480A (en) * | 1995-07-28 | 2000-08-01 | Ube Industries, Ltd. | Photosensitive polyimidosiloxane compositions and insulating films made thereof |
| JP3550913B2 (ja) | 1995-10-31 | 2004-08-04 | 宇部興産株式会社 | ポリイミドシロキサンおよびその製法 |
| JP3321548B2 (ja) * | 1996-06-17 | 2002-09-03 | 株式会社日立製作所 | 感光性ポリイミド前駆体組成物、およびそれを用いたパターン形成方法 |
| US6117510A (en) * | 1996-07-30 | 2000-09-12 | Ube Industries, Ltd. | Adhesive-applied tape |
| JP3968835B2 (ja) * | 1996-12-20 | 2007-08-29 | 日本メクトロン株式会社 | シロキサンポリイミドを含有する耐熱性接着剤 |
| JP3700311B2 (ja) * | 1997-02-05 | 2005-09-28 | 日本メクトロン株式会社 | シロキサンポリイミドおよびそれを含有する耐熱性接着剤 |
| US6025461A (en) * | 1997-09-26 | 2000-02-15 | Nippon Mektron, Limited | Photosensitive polyimide |
| JP4016226B2 (ja) * | 1998-01-14 | 2007-12-05 | 味の素株式会社 | 変成ポリイミド樹脂及びこれを含有する熱硬化性樹脂組成物 |
| JP3968884B2 (ja) * | 1998-05-01 | 2007-08-29 | 日本メクトロン株式会社 | 感光性組成物 |
| JP3972481B2 (ja) * | 1998-05-14 | 2007-09-05 | 日本メクトロン株式会社 | 感光性組成物 |
| JP3950560B2 (ja) * | 1998-08-14 | 2007-08-01 | 株式会社巴川製紙所 | 電子部品用接着剤および電子部品用接着テープ |
| US6686106B2 (en) * | 2000-06-26 | 2004-02-03 | Ube Industries, Ltd. | Photosensitive resin compositions, insulating films, and processes for formation of the films |
| JP2002012667A (ja) * | 2000-06-29 | 2002-01-15 | Shin Etsu Chem Co Ltd | ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜 |
-
1998
- 1998-08-07 JP JP23638598A patent/JP3972481B2/ja not_active Expired - Fee Related
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1999
- 1999-02-26 US US09/259,069 patent/US6486290B1/en not_active Expired - Fee Related
- 1999-03-15 EP EP99104024A patent/EP0957125B1/en not_active Expired - Lifetime
- 1999-03-15 DE DE69908487T patent/DE69908487T2/de not_active Expired - Lifetime
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2000
- 2000-02-01 US US09/496,098 patent/US6245484B1/en not_active Expired - Lifetime
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2000034347A (ja) | 2000-02-02 |
| US20020045127A1 (en) | 2002-04-18 |
| US6486290B1 (en) | 2002-11-26 |
| EP0957125B1 (en) | 2003-06-04 |
| US6582885B2 (en) | 2003-06-24 |
| DE69908487D1 (de) | 2003-07-10 |
| EP0957125A1 (en) | 1999-11-17 |
| US6245484B1 (en) | 2001-06-12 |
| DE69908487T2 (de) | 2004-05-13 |
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