JP2000252244A - 金属用研磨液及びそれを用いた研磨方法 - Google Patents

金属用研磨液及びそれを用いた研磨方法

Info

Publication number
JP2000252244A
JP2000252244A JP36884899A JP36884899A JP2000252244A JP 2000252244 A JP2000252244 A JP 2000252244A JP 36884899 A JP36884899 A JP 36884899A JP 36884899 A JP36884899 A JP 36884899A JP 2000252244 A JP2000252244 A JP 2000252244A
Authority
JP
Japan
Prior art keywords
water
metal
polishing
weight
solubility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP36884899A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000252244A5 (enExample
Inventor
Takeshi Uchida
剛 内田
Tetsuya Hoshino
鉄哉 星野
Hiroki Terasaki
裕樹 寺崎
Yasuo Kamigata
康雄 上方
Naoyuki Koyama
直之 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP36884899A priority Critical patent/JP2000252244A/ja
Publication of JP2000252244A publication Critical patent/JP2000252244A/ja
Publication of JP2000252244A5 publication Critical patent/JP2000252244A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP36884899A 1998-12-28 1999-12-27 金属用研磨液及びそれを用いた研磨方法 Pending JP2000252244A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36884899A JP2000252244A (ja) 1998-12-28 1999-12-27 金属用研磨液及びそれを用いた研磨方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-372606 1998-12-28
JP37260698 1998-12-28
JP36884899A JP2000252244A (ja) 1998-12-28 1999-12-27 金属用研磨液及びそれを用いた研磨方法

Publications (2)

Publication Number Publication Date
JP2000252244A true JP2000252244A (ja) 2000-09-14
JP2000252244A5 JP2000252244A5 (enExample) 2007-02-15

Family

ID=26582043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36884899A Pending JP2000252244A (ja) 1998-12-28 1999-12-27 金属用研磨液及びそれを用いた研磨方法

Country Status (1)

Country Link
JP (1) JP2000252244A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001048114A1 (en) * 1999-12-27 2001-07-05 Showa Denko K.K. Composition for polishing magnetic disk substrate and polishing method, and magnetic disk substrate polished thereby
JP2006203188A (ja) * 2004-12-22 2006-08-03 Showa Denko Kk 研磨組成物及び研磨方法
US7250369B1 (en) * 1998-12-28 2007-07-31 Hitachi, Ltd. Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7250369B1 (en) * 1998-12-28 2007-07-31 Hitachi, Ltd. Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
US7799686B2 (en) 1998-12-28 2010-09-21 Hitachi, Ltd. Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
US8226849B2 (en) 1998-12-28 2012-07-24 Hitachi, Ltd. Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
WO2001048114A1 (en) * 1999-12-27 2001-07-05 Showa Denko K.K. Composition for polishing magnetic disk substrate and polishing method, and magnetic disk substrate polished thereby
JP2006203188A (ja) * 2004-12-22 2006-08-03 Showa Denko Kk 研磨組成物及び研磨方法

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