JP2000199951A5 - - Google Patents

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Publication number
JP2000199951A5
JP2000199951A5 JP1999365146A JP36514699A JP2000199951A5 JP 2000199951 A5 JP2000199951 A5 JP 2000199951A5 JP 1999365146 A JP1999365146 A JP 1999365146A JP 36514699 A JP36514699 A JP 36514699A JP 2000199951 A5 JP2000199951 A5 JP 2000199951A5
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JP
Japan
Prior art keywords
norbornene
carboxylate
mol
butanediol diacrylate
hydroxyethyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999365146A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000199951A (ja
JP4001445B2 (ja
Filing date
Publication date
Priority claimed from KR10-1998-0063793A external-priority patent/KR100362937B1/ko
Application filed filed Critical
Publication of JP2000199951A publication Critical patent/JP2000199951A/ja
Publication of JP2000199951A5 publication Critical patent/JP2000199951A5/ja
Application granted granted Critical
Publication of JP4001445B2 publication Critical patent/JP4001445B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP36514699A 1998-12-31 1999-12-22 フォトレジスト共重合体、フォトレジスト組成物、フォトレジストパターンの形成方法、及び、半導体素子。 Expired - Fee Related JP4001445B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-1998-0063793A KR100362937B1 (ko) 1998-12-31 1998-12-31 신규의포토레지스트가교제,이를포함하는포토레지스트중합체및포토레지스트조성물
KR1998P-63793 1998-12-31

Publications (3)

Publication Number Publication Date
JP2000199951A JP2000199951A (ja) 2000-07-18
JP2000199951A5 true JP2000199951A5 (US20040106767A1-20040603-C00005.png) 2005-04-07
JP4001445B2 JP4001445B2 (ja) 2007-10-31

Family

ID=19570347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36514699A Expired - Fee Related JP4001445B2 (ja) 1998-12-31 1999-12-22 フォトレジスト共重合体、フォトレジスト組成物、フォトレジストパターンの形成方法、及び、半導体素子。

Country Status (9)

Country Link
JP (1) JP4001445B2 (US20040106767A1-20040603-C00005.png)
KR (1) KR100362937B1 (US20040106767A1-20040603-C00005.png)
CN (1) CN1303114C (US20040106767A1-20040603-C00005.png)
DE (1) DE19960506A1 (US20040106767A1-20040603-C00005.png)
FR (1) FR2788062B1 (US20040106767A1-20040603-C00005.png)
GB (1) GB2345286B (US20040106767A1-20040603-C00005.png)
IT (1) IT1308679B1 (US20040106767A1-20040603-C00005.png)
NL (1) NL1013916C2 (US20040106767A1-20040603-C00005.png)
TW (1) TWI222968B (US20040106767A1-20040603-C00005.png)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7208260B2 (en) * 1998-12-31 2007-04-24 Hynix Semiconductor Inc. Cross-linking monomers for photoresist, and process for preparing photoresist polymers using the same
KR100557608B1 (ko) * 1999-02-10 2006-03-10 주식회사 하이닉스반도체 신규의 포토레지스트 가교제 및 이를 이용한 포토레지스트 조성물
KR100557609B1 (ko) * 1999-02-22 2006-03-10 주식회사 하이닉스반도체 신규의 포토레지스트 가교제 및 이를 이용한 포토레지스트 조성물
KR100520183B1 (ko) * 1999-08-23 2005-10-10 주식회사 하이닉스반도체 두 개의 이중결합을 가지는 가교제를 단량체로 포함하는 포토레지스트용 공중합체
US6818376B2 (en) 1999-08-23 2004-11-16 Hynix Semiconductor Inc. Cross-linker monomer comprising double bond and photoresist copolymer containing the same
KR100546110B1 (ko) * 2000-01-21 2006-01-24 주식회사 하이닉스반도체 포토레지스트 가교제 및 이를 함유하는 포토레지스트 조성물
US6664022B1 (en) * 2000-08-25 2003-12-16 Shipley Company, L.L.C. Photoacid generators and photoresists comprising same
KR20020082006A (ko) * 2001-04-23 2002-10-30 금호석유화학 주식회사 신규한 산-민감성 중합체 및 이를 함유하는 레지스트 조성물
US7138218B2 (en) 2001-12-18 2006-11-21 Hynix Semiconductor Inc. Process for forming an ultra fine pattern using a bottom anti-reflective coating film containing an acid generator
US7338742B2 (en) 2003-10-08 2008-03-04 Hynix Semiconductor Inc. Photoresist polymer and photoresist composition containing the same
US7270937B2 (en) 2003-10-17 2007-09-18 Hynix Semiconductor Inc. Over-coating composition for photoresist and process for forming photoresist pattern using the same
KR100680405B1 (ko) 2003-11-19 2007-02-08 주식회사 하이닉스반도체 Euv용 포토레지스트 조성물 및 이를 이용한포토레지스트 패턴 형성 방법
JP4979477B2 (ja) * 2004-03-08 2012-07-18 三菱レイヨン株式会社 レジスト用重合体、レジスト組成物、およびパターン製造方法、並びにレジスト用重合体用原料化合物
EP1750176A3 (en) * 2005-08-03 2011-04-20 JSR Corporation Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material
KR100694412B1 (ko) 2006-02-24 2007-03-12 주식회사 하이닉스반도체 반도체소자의 미세패턴 형성방법
US7745339B2 (en) 2006-02-24 2010-06-29 Hynix Semiconductor Inc. Method for forming fine pattern of semiconductor device
KR20100014830A (ko) * 2007-02-26 2010-02-11 제이에스알 가부시끼가이샤 미세 패턴 형성용 수지 조성물 및 미세 패턴 형성 방법
KR20180061217A (ko) * 2015-09-28 2018-06-07 쓰리엠 이노베이티브 프로퍼티즈 캄파니 절단가능한 가교결합제를 포함하는 패턴화된 필름 물품 및 방법
CN116102938B (zh) * 2021-11-09 2023-10-20 上海新阳半导体材料股份有限公司 一种深紫外光刻用底部抗反射涂层及其制备方法和应用

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1275471A (en) * 1969-06-04 1972-05-24 Du Pont Improvements relating to photo-resists
GB1277674A (en) * 1969-08-04 1972-06-14 Ford Motor Co Painting of polyolefins
JPS5713444A (en) * 1980-06-27 1982-01-23 Tamura Kaken Kk Photosensitive composition
US4329419A (en) * 1980-09-03 1982-05-11 E. I. Du Pont De Nemours And Company Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors
WO1992007022A1 (en) * 1990-10-23 1992-04-30 Atomic Energy Of Canada Limited Process for the preparation of cellulosic fibre-reinforced thermoplastic composite materials
KR100384746B1 (ko) * 1994-09-13 2003-08-25 제온 코포레이션 감광성 폴리이미드 수지 조성물

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