JP2000053934A - 接着剤組成物およびその前駆体 - Google Patents

接着剤組成物およびその前駆体

Info

Publication number
JP2000053934A
JP2000053934A JP10212505A JP21250598A JP2000053934A JP 2000053934 A JP2000053934 A JP 2000053934A JP 10212505 A JP10212505 A JP 10212505A JP 21250598 A JP21250598 A JP 21250598A JP 2000053934 A JP2000053934 A JP 2000053934A
Authority
JP
Japan
Prior art keywords
resin
adhesive
adhesive composition
epoxy resin
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10212505A
Other languages
English (en)
Japanese (ja)
Inventor
Koichiro Kawate
恒一郎 川手
Yorinobu Takamatsu
頼信 高松
Akito Muramatsu
昭人 村松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Priority to JP10212505A priority Critical patent/JP2000053934A/ja
Priority to PCT/US1999/013486 priority patent/WO2000006661A1/en
Priority to EP99933514A priority patent/EP1117747A1/en
Priority to KR1020017001177A priority patent/KR100609804B1/ko
Priority to CNB99810521XA priority patent/CN1156549C/zh
Priority to BR9912488-2A priority patent/BR9912488A/pt
Publication of JP2000053934A publication Critical patent/JP2000053934A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
JP10212505A 1998-07-28 1998-07-28 接着剤組成物およびその前駆体 Pending JP2000053934A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP10212505A JP2000053934A (ja) 1998-07-28 1998-07-28 接着剤組成物およびその前駆体
PCT/US1999/013486 WO2000006661A1 (en) 1998-07-28 1999-06-15 Adhesive compositions and their precursors
EP99933514A EP1117747A1 (en) 1998-07-28 1999-06-15 Adhesive compositions and their precursors
KR1020017001177A KR100609804B1 (ko) 1998-07-28 1999-06-15 접착제 조성물 및 그의 전구체
CNB99810521XA CN1156549C (zh) 1998-07-28 1999-06-15 粘合剂组合物及其前体
BR9912488-2A BR9912488A (pt) 1998-07-28 1999-06-15 Composição adesiva, e, precursor de composição adesiva

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10212505A JP2000053934A (ja) 1998-07-28 1998-07-28 接着剤組成物およびその前駆体

Publications (1)

Publication Number Publication Date
JP2000053934A true JP2000053934A (ja) 2000-02-22

Family

ID=16623788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10212505A Pending JP2000053934A (ja) 1998-07-28 1998-07-28 接着剤組成物およびその前駆体

Country Status (6)

Country Link
EP (1) EP1117747A1 (ko)
JP (1) JP2000053934A (ko)
KR (1) KR100609804B1 (ko)
CN (1) CN1156549C (ko)
BR (1) BR9912488A (ko)
WO (1) WO2000006661A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000144082A (ja) * 1998-11-16 2000-05-26 Minnesota Mining & Mfg Co <3M> 熱硬化性接着剤組成物、接着剤、および接着剤の製造方法
JP2000303046A (ja) * 1999-04-20 2000-10-31 Nitto Denko Corp ポリエステルフイルム接着用のアクリル系感圧性接着剤組成物とその接着シ―ト類

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005217369A (ja) 2004-02-02 2005-08-11 Three M Innovative Properties Co 発光ダイオード装置用接着シート及び発光ダイオード装置
US20060063015A1 (en) 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
US7491287B2 (en) 2006-06-09 2009-02-17 3M Innovative Properties Company Bonding method with flowable adhesive composition
TWI427130B (zh) * 2010-07-14 2014-02-21 Benq Materials Corp 黏著劑組成物及黏著層
TWI491638B (zh) * 2010-11-16 2015-07-11 Ind Tech Res Inst 熱硬化型組成物
CN102888199B (zh) * 2012-09-17 2014-06-18 北京京东方光电科技有限公司 封框胶及其制备方法和应用
KR102330885B1 (ko) * 2014-07-04 2021-11-24 린텍 가부시키가이샤 보호막 형성용 필름

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3515578A (en) * 1969-03-14 1970-06-02 Minnesota Mining & Mfg Pressure-sensitive-adhesive tape
US3765972A (en) * 1969-07-14 1973-10-16 Monsanto Co Process for adhering preformed resinous coverings to architectural surfaces
EP0475592A3 (en) * 1990-09-10 1992-08-19 Minnesota Mining And Manufacturing Company Coated article having improved adhesion to organic coatings
JP3716507B2 (ja) * 1996-03-27 2005-11-16 ぺんてる株式会社 滑り止め性を有する塗膜を被覆した物品
JPH09316306A (ja) * 1996-05-31 1997-12-09 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
DE69727714T2 (de) * 1996-07-15 2004-11-25 Sekisui Kagaku Kogyo K.K. Verfahren zum Verbinden von Teilen

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000144082A (ja) * 1998-11-16 2000-05-26 Minnesota Mining & Mfg Co <3M> 熱硬化性接着剤組成物、接着剤、および接着剤の製造方法
JP2000303046A (ja) * 1999-04-20 2000-10-31 Nitto Denko Corp ポリエステルフイルム接着用のアクリル系感圧性接着剤組成物とその接着シ―ト類

Also Published As

Publication number Publication date
KR100609804B1 (ko) 2006-08-09
KR20010071044A (ko) 2001-07-28
CN1156549C (zh) 2004-07-07
WO2000006661A1 (en) 2000-02-10
CN1317039A (zh) 2001-10-10
BR9912488A (pt) 2001-04-17
EP1117747A1 (en) 2001-07-25

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