ITMI20120164A1 - Supporto di componente e parte costruttiva con un componente mems su un tale supporto di componente - Google Patents
Supporto di componente e parte costruttiva con un componente mems su un tale supporto di componenteInfo
- Publication number
- ITMI20120164A1 ITMI20120164A1 IT000164A ITMI20120164A ITMI20120164A1 IT MI20120164 A1 ITMI20120164 A1 IT MI20120164A1 IT 000164 A IT000164 A IT 000164A IT MI20120164 A ITMI20120164 A IT MI20120164A IT MI20120164 A1 ITMI20120164 A1 IT MI20120164A1
- Authority
- IT
- Italy
- Prior art keywords
- component
- support
- component support
- mems
- construction part
- Prior art date
Links
- 238000010276 construction Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/141—Monolithic housings, e.g. molded or one-piece housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
- B81B2207/094—Feed-through, via
- B81B2207/096—Feed-through, via through the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
- B81B2207/097—Interconnects arranged on the substrate or the lid, and covered by the package seal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0109—Bonding an individual cap on the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0154—Moulding a cap over the MEMS device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
- H04R1/086—Protective screens, e.g. all weather or wind screens
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011004577.5A DE102011004577B4 (de) | 2011-02-23 | 2011-02-23 | Bauelementträger, Verfahren zur Herstellung eines solchen Bauelementträgers sowie Bauteil mit einem MEMS-Bauelement auf einem solchen Bauelementträger |
Publications (1)
Publication Number | Publication Date |
---|---|
ITMI20120164A1 true ITMI20120164A1 (it) | 2012-08-24 |
Family
ID=46604799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT000164A ITMI20120164A1 (it) | 2011-02-23 | 2012-02-07 | Supporto di componente e parte costruttiva con un componente mems su un tale supporto di componente |
Country Status (4)
Country | Link |
---|---|
US (1) | US8902604B2 (it) |
CN (1) | CN102649535B (it) |
DE (1) | DE102011004577B4 (it) |
IT (1) | ITMI20120164A1 (it) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012209235B4 (de) * | 2012-05-31 | 2023-08-10 | Robert Bosch Gmbh | Sensormodul mit zwei mikromechanischen Sensorelementen |
US20140003632A1 (en) * | 2012-06-28 | 2014-01-02 | Ams Ag | Microphone arrangement |
US20140150560A1 (en) * | 2012-11-30 | 2014-06-05 | Robert Bosch Gmbh | MEMS Pressure Sensor Assembly with Electromagnetic Shield |
EP2932218B1 (en) * | 2012-12-17 | 2018-09-19 | Danfoss A/S | A sensor comprising a substrate |
DE102013204234A1 (de) | 2013-03-12 | 2014-09-18 | Robert Bosch Gmbh | Sensor und Verfahren zum Herstellen einer Lötverbindung zwischen einem Sensor und einer Leiterplatte |
CN105393099B (zh) | 2013-06-11 | 2018-06-19 | 丹佛斯有限公司 | 薄膜传感器 |
US9090454B2 (en) | 2013-08-27 | 2015-07-28 | Freescale Semiconductor, Inc. | Sequential wafer bonding |
US9254995B2 (en) * | 2013-09-17 | 2016-02-09 | Analog Devices, Inc. | Multi-port device package |
CN104517944A (zh) | 2013-09-30 | 2015-04-15 | 日月光半导体制造股份有限公司 | 封装结构及其制造方法 |
US9676611B2 (en) | 2013-10-18 | 2017-06-13 | Nxp Usa, Inc. | Sensor device packages and related fabrication methods |
US20150117681A1 (en) * | 2013-10-30 | 2015-04-30 | Knowles Electronics, Llc | Acoustic Assembly and Method of Manufacturing The Same |
EP2871152B1 (en) * | 2013-11-06 | 2017-05-24 | Sensirion AG | Sensor device |
US9628918B2 (en) * | 2013-11-25 | 2017-04-18 | Infineon Technologies Ag | Semiconductor device and a method for forming a semiconductor device |
KR20150060469A (ko) * | 2013-11-26 | 2015-06-03 | 삼성전기주식회사 | 멤스 마이크로폰 패키지 및 멤스 마이크로폰 패키지의 제조 방법 |
US9018029B1 (en) | 2013-12-06 | 2015-04-28 | Freescale Semiconductor, Inc. | Vent hole sealing in multiple die sensor device |
CN103674399B (zh) * | 2013-12-25 | 2016-04-27 | 北京必创科技有限公司 | 一种应力分散mems塑封压力传感器及其制备方法 |
CN203708424U (zh) * | 2013-12-30 | 2014-07-09 | 瑞声声学科技(深圳)有限公司 | 麦克风 |
CN203708484U (zh) * | 2013-12-30 | 2014-07-09 | 瑞声声学科技(深圳)有限公司 | 麦克风 |
US9108841B1 (en) | 2014-03-05 | 2015-08-18 | Freescale Semiconductor, Inc. | Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof |
JP6311376B2 (ja) * | 2014-03-14 | 2018-04-18 | オムロン株式会社 | マイクロフォン |
US9499397B2 (en) | 2014-03-31 | 2016-11-22 | Freescale Semiconductor, Inc. | Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof |
US10442685B2 (en) | 2014-03-31 | 2019-10-15 | Nxp Usa, Inc. | Microelectronic packages having hermetic cavities and methods for the production thereof |
US9617144B2 (en) | 2014-05-09 | 2017-04-11 | Invensense, Inc. | Integrated package containing MEMS acoustic sensor and environmental sensor and methodology for fabricating same |
GB2526846B (en) * | 2014-06-05 | 2020-03-25 | Nokia Technologies Oy | An apparatus and method for providing an apparatus comprising an audio transducer |
US9319772B2 (en) * | 2014-06-20 | 2016-04-19 | Merry Electronics (Shenzhen) Co., Ltd. | Multi-floor type MEMS microphone |
TWI623486B (zh) * | 2017-03-28 | 2018-05-11 | 思鷺科技股份有限公司 | 封裝結構 |
US9955246B2 (en) * | 2014-07-03 | 2018-04-24 | Harman International Industries, Incorporated | Gradient micro-electro-mechanical systems (MEMS) microphone with varying height assemblies |
US9351084B2 (en) * | 2014-07-14 | 2016-05-24 | Invensense, Inc. | Packaging concept to improve performance of a micro-electro mechanical (MEMS) microphone |
US9891244B2 (en) | 2014-08-15 | 2018-02-13 | Nxp Usa, Inc. | Microelectronic packages having split gyroscope structures and methods for the fabrication thereof |
EP3032227B1 (en) | 2014-12-08 | 2020-10-21 | Sensirion AG | Flow sensor package |
JP6387540B2 (ja) * | 2014-12-19 | 2018-09-12 | 株式会社オーディオテクニカ | マイクロホン |
KR101554364B1 (ko) * | 2014-12-30 | 2015-09-21 | (주)이미지스테크놀로지 | 리드프레임을 이용한 멤스 마이크로폰 패키지 |
US20160353212A1 (en) * | 2015-05-26 | 2016-12-01 | Knowles Electronics, Llc | Raised shoulder micro electro mechanical system (mems) microphone |
KR101684526B1 (ko) * | 2015-08-28 | 2016-12-08 | 현대자동차 주식회사 | 마이크로폰 및 그 제조 방법 |
TWI633290B (zh) * | 2015-11-26 | 2018-08-21 | 李美燕 | 微型回饋腔感測器及其製造方法 |
US10861796B2 (en) * | 2016-05-10 | 2020-12-08 | Texas Instruments Incorporated | Floating die package |
DE102016113347A1 (de) * | 2016-07-20 | 2018-01-25 | Infineon Technologies Ag | Verfahren zum produzieren eines halbleitermoduls |
US11204346B2 (en) | 2016-09-21 | 2021-12-21 | Sensirion Ag | Gas sensor with filter |
FR3056978B1 (fr) * | 2016-10-05 | 2019-08-16 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Capteur de pression, en particulier microphone a agencement ameliore |
DE102016220055A1 (de) * | 2016-10-14 | 2018-04-19 | Robert Bosch Gmbh | Mikromechanische Drucksensorvorrichtung und entsprechendes Verfahren zum Herstellen einer mikromechanischen Drucksensorvorrichtung |
CN106946213B (zh) * | 2017-05-26 | 2019-04-23 | 芜湖恒铭电子科技有限公司 | 一种压力传感器及其制作方法 |
DE102017114142A1 (de) | 2017-06-26 | 2018-12-27 | USound GmbH | Schallwandleranordnung mit einer MEMS-Einheit |
DE102017212422B4 (de) * | 2017-07-20 | 2024-06-27 | Robert Bosch Gmbh | Drucksensoranordnung und Verfahren zu deren Herstellung |
DE102017214558B9 (de) * | 2017-08-21 | 2021-02-25 | Infineon Technologies Ag | Verfahren zur erzeugung eines mems-sensors |
CN112020865B (zh) * | 2018-04-26 | 2022-06-17 | 美商楼氏电子有限公司 | 具有透声隔膜的声学组件 |
US10728674B2 (en) * | 2018-08-27 | 2020-07-28 | Solid State System Co., Ltd. | Microphone package |
CN209326840U (zh) | 2018-12-27 | 2019-08-30 | 热敏碟公司 | 压力传感器及压力变送器 |
US11945714B2 (en) * | 2020-07-30 | 2024-04-02 | Stmicroelectronics S.R.L. | Electronic device and corresponding method |
US11721551B2 (en) * | 2021-01-26 | 2023-08-08 | Tokyo Electron Limited | Localized stress regions for three-dimension chiplet formation |
CN113371668B (zh) * | 2021-04-29 | 2024-05-14 | 北京航天控制仪器研究所 | 一种mems加速度计低应力集成封装结构及方法 |
CN113788451B (zh) * | 2021-08-10 | 2024-04-02 | 北京自动化控制设备研究所 | 一种复合量程压力传感系统的封装方法 |
CN114401479A (zh) * | 2021-12-28 | 2022-04-26 | 荣成歌尔微电子有限公司 | 骨声纹传感器及电子设备 |
CN115412820A (zh) * | 2022-07-29 | 2022-11-29 | 荣成歌尔微电子有限公司 | Mems麦克风及电子装置 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6031922A (en) * | 1995-12-27 | 2000-02-29 | Tibbetts Industries, Inc. | Microphone systems of reduced in situ acceleration sensitivity |
US7434305B2 (en) * | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
US7166910B2 (en) * | 2000-11-28 | 2007-01-23 | Knowles Electronics Llc | Miniature silicon condenser microphone |
US6469909B2 (en) | 2001-01-09 | 2002-10-22 | 3M Innovative Properties Company | MEMS package with flexible circuit interconnect |
JP3905334B2 (ja) * | 2001-07-25 | 2007-04-18 | シャープ株式会社 | 受信装置 |
DE60311982T2 (de) * | 2002-04-11 | 2007-11-08 | Koninklijke Philips Electronics N.V. | Hertsellungsverfahren einer elektronischen vorrichtung in einem hohlraum mit einer bedeckung |
DE10238523B4 (de) * | 2002-08-22 | 2014-10-02 | Epcos Ag | Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung |
US7072482B2 (en) * | 2002-09-06 | 2006-07-04 | Sonion Nederland B.V. | Microphone with improved sound inlet port |
US6822326B2 (en) * | 2002-09-25 | 2004-11-23 | Ziptronix | Wafer bonding hermetic encapsulation |
US20040084208A1 (en) | 2002-10-30 | 2004-05-06 | Ives Thomas W. | Article and method for reducing external excitation of MEMS devices |
JP4033830B2 (ja) * | 2002-12-03 | 2008-01-16 | ホシデン株式会社 | マイクロホン |
KR200330089Y1 (ko) * | 2003-07-29 | 2003-10-11 | 주식회사 비에스이 | 통합 베이스 및 이를 이용한 일렉트릿 콘덴서마이크로폰 |
WO2005086535A1 (ja) * | 2004-03-09 | 2005-09-15 | Matsushita Electric Industrial Co., Ltd. | エレクトレットコンデンサーマイクロホン |
DE102005008512B4 (de) * | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
JP4049160B2 (ja) * | 2005-03-16 | 2008-02-20 | ヤマハ株式会社 | 蓋体フレーム、半導体装置、及びその製造方法 |
JP2007081614A (ja) * | 2005-09-13 | 2007-03-29 | Star Micronics Co Ltd | コンデンサマイクロホン |
JP5174673B2 (ja) * | 2005-10-14 | 2013-04-03 | エスティーマイクロエレクトロニクス エス.アール.エル. | 基板レベル・アセンブリを具えた電子装置及びその製造処理方法 |
DE102005050398A1 (de) * | 2005-10-20 | 2007-04-26 | Epcos Ag | Gehäuse mit Hohlraum für ein mechanisch empfindliches elektronisches Bauelement und Verfahren zur Herstellung |
DE102005055950A1 (de) * | 2005-11-24 | 2007-05-31 | Robert Bosch Gmbh | Vorrichtung zur Passivierung wenigstens eines Bauelements durch ein Gehäuse und Verfahren zur Herstellung einer Vorrichtung |
KR100868593B1 (ko) * | 2005-12-06 | 2008-11-13 | 야마하 가부시키가이샤 | 반도체 장치 및 그 제조 방법과 반도체 장치에 사용되는 덮개 부재와 반도체 장치를 제조하기 위한 반도체 유닛 |
US20070158826A1 (en) * | 2005-12-27 | 2007-07-12 | Yamaha Corporation | Semiconductor device |
US7436054B2 (en) * | 2006-03-03 | 2008-10-14 | Silicon Matrix, Pte. Ltd. | MEMS microphone with a stacked PCB package and method of producing the same |
TW200847827A (en) * | 2006-11-30 | 2008-12-01 | Analog Devices Inc | Microphone system with silicon microphone secured to package lid |
US8306252B2 (en) * | 2007-01-05 | 2012-11-06 | Apple Inc. | Integrated microphone assembly for personal media device |
TWI327357B (en) * | 2007-01-10 | 2010-07-11 | Advanced Semiconductor Eng | Mems microphone package and method thereof |
TWI370101B (en) * | 2007-05-15 | 2012-08-11 | Ind Tech Res Inst | Package and packaging assembly of microelectromechanical sysyem microphone |
US8767983B2 (en) | 2007-06-01 | 2014-07-01 | Infineon Technologies Ag | Module including a micro-electro-mechanical microphone |
KR20080110497A (ko) * | 2007-06-14 | 2008-12-18 | 야마하 가부시키가이샤 | 마이크로폰 패키지, 반도체 장치 및 그 제조 방법 |
JP5137059B2 (ja) * | 2007-06-20 | 2013-02-06 | 新光電気工業株式会社 | 電子部品用パッケージ及びその製造方法と電子部品装置 |
CN101346014B (zh) * | 2007-07-13 | 2012-06-20 | 清华大学 | 微机电系统麦克风及其制备方法 |
US20090175477A1 (en) * | 2007-08-20 | 2009-07-09 | Yamaha Corporation | Vibration transducer |
EP2043385A2 (en) * | 2007-09-28 | 2009-04-01 | Yamaha Corporation | Vibration transducer and manufacturing method therefor |
CN201204694Y (zh) * | 2008-02-29 | 2009-03-04 | 深圳市豪恩电声科技有限公司 | 一种电容式麦克风 |
CN101282594B (zh) * | 2008-04-10 | 2013-06-05 | 苏州敏芯微电子技术有限公司 | 具有双面贴装电极的微机电传声器的封装结构 |
US8309388B2 (en) * | 2008-04-25 | 2012-11-13 | Texas Instruments Incorporated | MEMS package having formed metal lid |
US20100224880A1 (en) * | 2009-03-05 | 2010-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP4947169B2 (ja) * | 2010-03-10 | 2012-06-06 | オムロン株式会社 | 半導体装置及びマイクロフォン |
JP4947191B2 (ja) * | 2010-06-01 | 2012-06-06 | オムロン株式会社 | マイクロフォン |
-
2011
- 2011-02-23 DE DE102011004577.5A patent/DE102011004577B4/de active Active
-
2012
- 2012-02-07 IT IT000164A patent/ITMI20120164A1/it unknown
- 2012-02-22 CN CN201210041782.4A patent/CN102649535B/zh active Active
- 2012-02-22 US US13/402,321 patent/US8902604B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE102011004577B4 (de) | 2023-07-27 |
CN102649535B (zh) | 2017-11-24 |
DE102011004577A1 (de) | 2012-08-23 |
CN102649535A (zh) | 2012-08-29 |
US8902604B2 (en) | 2014-12-02 |
US20120212925A1 (en) | 2012-08-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ITMI20120164A1 (it) | Supporto di componente e parte costruttiva con un componente mems su un tale supporto di componente | |
BR112012025434A2 (pt) | mola e conjunto | |
BR112013031708A2 (pt) | elemento extensível, e, métodos para fabricar um elemento extensível, para estender elemento extensível, e para fornecer um conduto | |
BR112013006293A2 (pt) | arilpirrolidinas pesticidas | |
ITMI20101578A1 (it) | Componente micromeccanico | |
BR112013018379A2 (pt) | levedura recombinante e método de produção de substância usando a mesma | |
UA22448S (uk) | Печиво | |
FI20115223A0 (fi) | Jousirakenne, resonaattori, resonaattorimatriisi ja anturi | |
BR302012006665S1 (pt) | Configuração aplicada a pneumático | |
FR2957590B1 (fr) | Diffuseur a gachette | |
FI20116089L (fi) | Järjestely ja laite | |
FI20100220A0 (fi) | Menetelmä hissikokoonpanon kuormituksen rajoittamiseksi sekä hissikokoonpano | |
FR2982023B1 (fr) | Structure micromecanique a membrane deformable et a protection contre de fortes deformations | |
IT1398735B1 (it) | Cerniera a posizioni di arresto definite perfezionata | |
IT1394975B1 (it) | Superlega a base di nichel, componente meccanico realizzato con detta superlega, turbomacchina comprendente tale componente e metodi relativi | |
BR112015015607A2 (pt) | suporte de componentes e componente transportador | |
BR112015005883A2 (pt) | montagem de conduto de uma peça para um conjunto sensor de vibração, conjunto sensor de vibração, e método para formar o mesmo. | |
IT1399873B1 (it) | Dispositivo a cerniera | |
BR302012003665S1 (pt) | Configuração aplicada a notebook | |
LU91876B1 (de) | Selbstauswuchtender reifen | |
FR2964837B1 (fr) | Bonnet de soutien-gorge a support ameliore. | |
ITMI20131692A1 (it) | Procedimento di produzione per un componente micromeccanico e componente micromeccanico | |
BR112013010724A2 (pt) | pneumático com frisos assimétricos | |
FR2964687B1 (fr) | Article repliable a structure en arceaux | |
IT1402812B1 (it) | Arbalete a pistoncino con tenditore meccanico. |