CN203708484U - 麦克风 - Google Patents

麦克风 Download PDF

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Publication number
CN203708484U
CN203708484U CN201320878026.7U CN201320878026U CN203708484U CN 203708484 U CN203708484 U CN 203708484U CN 201320878026 U CN201320878026 U CN 201320878026U CN 203708484 U CN203708484 U CN 203708484U
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Prior art keywords
substrate
mems chip
chip
microphone
groove
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Expired - Fee Related
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CN201320878026.7U
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English (en)
Inventor
王凯
吴志江
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AAC Technologies Pte Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
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Priority to CN201320878026.7U priority Critical patent/CN203708484U/zh
Priority to US14/284,662 priority patent/US20150189443A1/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

本实用新型提供了一种麦克风，其包括基板、与基板盖接形成收容腔的外壳以及置于收容腔中的ASIC芯片和设有背腔的MEMS芯片，所述ASIC芯片与所述MEMS芯片电连接，所述基板设有靠近外壳的上表面和与所述上表面相对的下表面，所述基板设有自上表面向下表面凹陷的凹槽，所述MEMS芯片置于所述凹槽中，所述凹槽的深度大于所述MEMS芯片的高度。本实用新型的麦克风便于产品的微型化。

Description

麦克风
【技术领域】
本实用新型涉及一种麦克风，尤其涉及一种微电机系统麦克风。
【背景技术】
随着无线通讯的发展，全球移动电话用户越来越多，用户对移动电话的要求已不仅满足于通话，而且要能够提供高质量的通话效果，尤其是目前移动多媒体技术的发展，移动电话的通话质量更显重要，移动电话的麦克风作为移动电话的语音拾取装置，其设计好坏直接影响通话质量。
而目前应用较多且性能较好的麦克风是微电机系统麦克风（Micro-Electro-Mechanical-System Microphone，简称MEMS），与本实用新型相关的麦克风其包括基板、与基板盖接形成收容腔的外壳以及置于收容腔中的ASIC芯片和MEMS芯片，所述ASIC芯片与所述MEMS芯片电连接，所述基板为平板状结构，所述ASIC芯片和MEMS芯片分别置于所述基板上，这样不利于所述麦克风的微型化的发展。
因此，有必要提供一种新型的麦克风。
【实用新型内容】
本实用新型的目的在于提供一种便于产品微型化的麦克风。
本实用新型的技术方案如下：一种麦克风，其包括基板、与基板盖接形成收容腔的外壳以及置于收容腔中的ASIC芯片和设有背腔的MEMS芯片，所述ASIC芯片与所述MEMS芯片电连接，所述基板设有靠近外壳的上表面和与所述上表面相对的下表面，所述基板设有自上表面向下表面凹陷的凹槽，所述MEMS芯片置于所述凹槽中，所述凹槽的深度大于所述MEMS芯片的高度。
优选的，所述ASIC芯片置于所述MEMS芯片上。
优选的，所述凹槽设有与MEMS连接的槽底，所述槽底设有与所述MEMS背腔连通的声孔。
优选的，所述MEMS芯片通过绑定金线与所述基板实现电连接。
优选的，所述基板设有贯通上表面和下表面的导通孔，所述基板的下表面贴设有焊盘，所述绑定金线与所述焊盘通过所述导通孔电连接。
优选的，所述外壳为金属材质。
优选的，所述基板为线路板或陶瓷。
优选的，所述外壳设有连通所述收容腔中的声孔。
本实用新型的有益效果在于：由于所述基板设有容置所述MEMS芯片的凹槽，所述ASIC芯片置于所述MEMS芯片上，由此使得ASIC芯片与MEMS芯片通过堆叠的方式容置在收容腔中，有效缩小了麦克风的整体面积，便于麦克风的微型化。
【附图说明】
图1为本实用新型麦克风的剖视图。
【具体实施方式】
下面结合附图和实施方式对本实用新型作进一步说明。
如图1所示，为本实用新型的麦克风100，该麦克风100包括基板20、与所述基板20盖接形成收容腔11的外壳10以及置于所述收容腔11中的ASIC芯片30和设有背腔41的MEMS芯片40。
所述基板20设有靠近所述外壳10的上表面21和与所述上表面21相对的下表面22，所述基板20设有自上表面21向下表面22凹陷的凹槽200，所述MEMS芯片40置于所述凹槽200中，所述ASIC芯片30通过倒装结合的方式贴装在所述MEMS芯片40上，由此，MEMS芯片40和ASIC芯片30通过堆叠的方式置于基板20的凹槽200中，可以减小所述麦克风100的体积。另外，凹槽的深度可以根据需要进行设置，在本实施方式中，所述凹槽200的深度（即槽底到所述基板20上表面21的高度）大于或等于所述MEMS芯片40的高度。
在本实用新型中，所述ASIC芯片30是通过锡膏60与所述MEMS芯片40电连接的，MEMS芯片40是通过绑定金线70与所述基板20连接的，所述基板20设有贯通上表面21和下表面22的导通孔24，所述基板20的下表面22贴设有与外界电路连接的焊盘50，由此，所述绑定金线70与所述焊盘50通过所述导通孔24实现电连接，从而使得MEMS芯片40与外界电路的电连接。
另外，所述外壳10为金属材质，可以达到电磁屏蔽的效果。所述基板20为线路板或者是陶瓷。所述槽底设有连通MEMS芯片40的背腔41的声孔23，在其它实施方式中，所述声孔也可以位于所述外壳。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (8)

1.一种麦克风，其包括基板、与基板盖接形成收容腔的外壳以及置于收容腔中的ASIC芯片和设有背腔的MEMS芯片，所述ASIC芯片与所述MEMS芯片电连接，所述基板设有靠近外壳的上表面和与所述上表面相对的下表面，其特征在于：所述基板设有自上表面向下表面凹陷的凹槽，所述MEMS芯片置于所述凹槽中，所述凹槽的深度大于所述MEMS芯片的高度。 
2.根据权利要求1所述的麦克风，其特征在于：所述ASIC芯片置于所述MEMS芯片上。 
3.根据权利要求2所述的麦克风，其特征在于：所述凹槽设有与MEMS连接的槽底，所述槽底设有与所述MEMS背腔连通的声孔。 
4.根据权利要求1所述的麦克风，其特征在于：所述MEMS芯片通过绑定金线与所述基板实现电连接。 
5.根据权利要求4所述的麦克风，其特征在于：所述基板设有贯通上表面和下表面的导通孔，所述基板的下表面贴设有焊盘，所述绑定金线与所述焊盘通过所述导通孔电连接。 
6.根据权利要求1所述的麦克风，其特征在于：所述外壳为金属材质。 
7.根据权利要求1所述的麦克风，其特征在于：所述基板为线路板或陶瓷。 
8.根据权利要求1所述的麦克风，其特征在于：所述外壳设有连通所述收容腔中的声孔。 
CN201320878026.7U 2013-12-30 2013-12-30 麦克风 Expired - Fee Related CN203708484U (zh)

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US14/284,662 US20150189443A1 (en) 2013-12-30 2014-05-22 Silicon Condenser Microphone

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017012250A1 (zh) * 2015-07-21 2017-01-26 歌尔声学股份有限公司 一种环境传感器
CN108249383A (zh) * 2016-12-28 2018-07-06 深迪半导体(上海)有限公司 一种mems传感器、麦克风及压力传感器
CN111314830A (zh) * 2019-12-07 2020-06-19 朝阳聚声泰（信丰）科技有限公司 一种信噪比高的mems麦克风及其生产方法
CN111510836A (zh) * 2020-03-31 2020-08-07 歌尔微电子有限公司 Mems封装结构及mems麦克风
CN114339560A (zh) * 2021-12-23 2022-04-12 歌尔微电子股份有限公司 微型麦克风和电子设备

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US10291973B2 (en) * 2015-05-14 2019-05-14 Knowles Electronics, Llc Sensor device with ingress protection
FR3056978B1 (fr) * 2016-10-05 2019-08-16 Commissariat A L'energie Atomique Et Aux Energies Alternatives Capteur de pression, en particulier microphone a agencement ameliore
US20200115224A1 (en) 2018-10-12 2020-04-16 Stmicroelectronics S.R.L. Mems device having a rugged package and fabrication process thereof

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017012250A1 (zh) * 2015-07-21 2017-01-26 歌尔声学股份有限公司 一种环境传感器
CN108249383A (zh) * 2016-12-28 2018-07-06 深迪半导体(上海)有限公司 一种mems传感器、麦克风及压力传感器
CN111314830A (zh) * 2019-12-07 2020-06-19 朝阳聚声泰（信丰）科技有限公司 一种信噪比高的mems麦克风及其生产方法
CN111510836A (zh) * 2020-03-31 2020-08-07 歌尔微电子有限公司 Mems封装结构及mems麦克风
CN111510836B (zh) * 2020-03-31 2022-08-16 歌尔微电子有限公司 Mems封装结构及mems麦克风
CN114339560A (zh) * 2021-12-23 2022-04-12 歌尔微电子股份有限公司 微型麦克风和电子设备
CN114339560B (zh) * 2021-12-23 2024-03-19 歌尔微电子股份有限公司 微型麦克风和电子设备

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Effective date of registration: 20170424

Address after: Singapore Ang Mo Kio 65 Street No. 10 techpoint Building 1 floor, No. 8

Patentee after: AAC TECHNOLOGIES Pte. Ltd.

Address before: 518057 Guangdong Province, Shenzhen City Southern District of Nanshan District high tech Zone Three Road No. 6 Shenzhen Yuexing Nanjing University research building block A

Patentee before: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) Co.,Ltd.

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