ITMI20020393A1 - Sistema di memoria aumentabile in capacita' con interconnessione riconfigurabile - Google Patents
Sistema di memoria aumentabile in capacita' con interconnessione riconfigurabileInfo
- Publication number
- ITMI20020393A1 ITMI20020393A1 IT2002MI000393A ITMI20020393A ITMI20020393A1 IT MI20020393 A1 ITMI20020393 A1 IT MI20020393A1 IT 2002MI000393 A IT2002MI000393 A IT 2002MI000393A IT MI20020393 A ITMI20020393 A IT MI20020393A IT MI20020393 A1 ITMI20020393 A1 IT MI20020393A1
- Authority
- IT
- Italy
- Prior art keywords
- increasable
- capacity
- memory system
- reconfigurable interconnection
- reconfigurable
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/409—Mechanical coupling
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2207/00—Indexing scheme relating to arrangements for writing information into, or reading information out from, a digital store
- G11C2207/10—Aspects relating to interfaces of memory device to external buses
- G11C2207/105—Aspects related to pads, pins or terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Logic Circuits (AREA)
- Dram (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/797,099 US7610447B2 (en) | 2001-02-28 | 2001-02-28 | Upgradable memory system with reconfigurable interconnect |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI20020393A0 ITMI20020393A0 (it) | 2002-02-27 |
ITMI20020393A1 true ITMI20020393A1 (it) | 2003-08-27 |
Family
ID=25169903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT2002MI000393A ITMI20020393A1 (it) | 2001-02-28 | 2002-02-27 | Sistema di memoria aumentabile in capacita' con interconnessione riconfigurabile |
Country Status (5)
Country | Link |
---|---|
US (3) | US7610447B2 (it) |
DE (1) | DE10208726B4 (it) |
FR (1) | FR2824157B1 (it) |
GB (1) | GB2374693B (it) |
IT (1) | ITMI20020393A1 (it) |
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US7610447B2 (en) * | 2001-02-28 | 2009-10-27 | Rambus Inc. | Upgradable memory system with reconfigurable interconnect |
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US7282790B2 (en) * | 2005-06-06 | 2007-10-16 | International Business Machines Corporation | Planar array contact memory cards |
US7464225B2 (en) | 2005-09-26 | 2008-12-09 | Rambus Inc. | Memory module including a plurality of integrated circuit memory devices and a plurality of buffer devices in a matrix topology |
US7562271B2 (en) | 2005-09-26 | 2009-07-14 | Rambus Inc. | Memory system topologies including a buffer device and an integrated circuit memory device |
US11328764B2 (en) | 2005-09-26 | 2022-05-10 | Rambus Inc. | Memory system topologies including a memory die stack |
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US8131903B2 (en) * | 2007-04-30 | 2012-03-06 | Hewlett-Packard Development Company, L.P. | Multi-channel memory connection system and method |
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US20110119425A1 (en) * | 2007-08-28 | 2011-05-19 | Rambus Inc. | Detachable interconnect for configurable width memory system |
US8868873B2 (en) * | 2007-09-27 | 2014-10-21 | Rambus Inc. | Reconfigurable memory system data strobes |
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CN112687304B (zh) | 2014-12-19 | 2024-09-06 | 拉姆伯斯公司 | 用于存储器模块的动态随机存取存储器(dram)部件 |
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-
2001
- 2001-02-28 US US09/797,099 patent/US7610447B2/en not_active Expired - Fee Related
-
2002
- 2002-02-05 GB GB0202644A patent/GB2374693B/en not_active Expired - Lifetime
- 2002-02-26 FR FR0202402A patent/FR2824157B1/fr not_active Expired - Fee Related
- 2002-02-27 IT IT2002MI000393A patent/ITMI20020393A1/it unknown
- 2002-02-28 DE DE10208726A patent/DE10208726B4/de not_active Expired - Fee Related
-
2006
- 2006-03-24 US US11/388,449 patent/US7577789B2/en not_active Expired - Fee Related
-
2009
- 2009-08-10 US US12/538,613 patent/US8380927B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2824157A1 (fr) | 2002-10-31 |
FR2824157B1 (fr) | 2008-10-10 |
GB2374693A (en) | 2002-10-23 |
GB0202644D0 (en) | 2002-03-20 |
ITMI20020393A0 (it) | 2002-02-27 |
US7577789B2 (en) | 2009-08-18 |
US20100061047A1 (en) | 2010-03-11 |
US20060236031A1 (en) | 2006-10-19 |
US8380927B2 (en) | 2013-02-19 |
DE10208726A1 (de) | 2002-09-05 |
GB2374693B (en) | 2003-09-03 |
DE10208726B4 (de) | 2010-04-08 |
US7610447B2 (en) | 2009-10-27 |
US20040221106A1 (en) | 2004-11-04 |
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ATE281673T1 (de) | Multiportkarte | |
FI20002804A0 (fi) | Maksujärjestelmä | |
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DE60012162D1 (de) | Verbinder |