IT9067307A0 - Metodo per fabbricare piastrine per circuiti stampati - Google Patents

Metodo per fabbricare piastrine per circuiti stampati

Info

Publication number
IT9067307A0
IT9067307A0 IT9067307A IT6730790A IT9067307A0 IT 9067307 A0 IT9067307 A0 IT 9067307A0 IT 9067307 A IT9067307 A IT 9067307A IT 6730790 A IT6730790 A IT 6730790A IT 9067307 A0 IT9067307 A0 IT 9067307A0
Authority
IT
Italy
Prior art keywords
printed circuits
manufacturing diagram
manufacturing
diagram
printed
Prior art date
Application number
IT9067307A
Other languages
English (en)
Other versions
IT1241204B (it
IT9067307A1 (it
Inventor
Martin Bayes
Original Assignee
Enthone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone filed Critical Enthone
Publication of IT9067307A0 publication Critical patent/IT9067307A0/it
Publication of IT9067307A1 publication Critical patent/IT9067307A1/it
Application granted granted Critical
Publication of IT1241204B publication Critical patent/IT1241204B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
IT67307A 1989-05-01 1990-04-24 Metodo per fabbricare piastrine per circuiti stampati IT1241204B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34580489A 1989-05-01 1989-05-01

Publications (3)

Publication Number Publication Date
IT9067307A0 true IT9067307A0 (it) 1990-04-24
IT9067307A1 IT9067307A1 (it) 1991-10-24
IT1241204B IT1241204B (it) 1993-12-29

Family

ID=23356553

Family Applications (1)

Application Number Title Priority Date Filing Date
IT67307A IT1241204B (it) 1989-05-01 1990-04-24 Metodo per fabbricare piastrine per circuiti stampati

Country Status (6)

Country Link
JP (1) JPH0734501B2 (it)
DE (1) DE4013094A1 (it)
FR (1) FR2646583B1 (it)
GB (1) GB2232168B (it)
HK (1) HK13395A (it)
IT (1) IT1241204B (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5358602A (en) * 1993-12-06 1994-10-25 Enthone-Omi Inc. Method for manufacture of printed circuit boards
JP3393190B2 (ja) * 1999-02-22 2003-04-07 有限会社関東学院大学表面工学研究所 銅パターンの選択的活性化方法およびこれに用いる活性化剤

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3698944A (en) * 1970-06-15 1972-10-17 Texas Instruments Inc Method of obtaining phased growth of epitaxial layers
US4662944A (en) * 1972-07-11 1987-05-05 Kollmorgen Technologies Corporation Process and composition for sensitizing articles for metallization
US4748056A (en) * 1972-07-11 1988-05-31 Kollmorgen Corporation Process and composition for sensitizing articles for metallization
US3976816A (en) * 1973-10-29 1976-08-24 Enthone, Incorporated Activation of surfaces intended for electroless plating
AR218223A1 (es) * 1975-05-05 1980-05-30 Borg Warner Composicion cataliticamente activa
DE2538571A1 (de) * 1975-08-29 1977-03-03 Siemens Ag Verfahren zur metallisierung von duroplasten, insbesondere phenolharzen
US4150171A (en) * 1976-03-30 1979-04-17 Surface Technology, Inc. Electroless plating
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
US4167596A (en) * 1977-08-01 1979-09-11 Nathan Feldstein Method of preparation and use of electroless plating catalysts
GB2013722A (en) * 1978-01-19 1979-08-15 Canning W Materials Ltd Plating process
US4233344A (en) * 1978-07-20 1980-11-11 Learonal, Inc. Method of improving the adhesion of electroless metal deposits employing colloidal copper activator
US4234628A (en) * 1978-11-28 1980-11-18 The Harshaw Chemical Company Two-step preplate system for polymeric surfaces
US4448811A (en) * 1981-12-30 1984-05-15 Omi International Corporation Oxidizing agent for acidic accelerator in electroless metal plating process
ZA843704B (en) * 1983-07-01 1985-09-25 Macdermid Inc Oxidizing accelerator
JPS6036674A (ja) * 1983-08-08 1985-02-25 Hitachi Chem Co Ltd 無電解銅めつきに対する活性化法
DE3504455A1 (de) * 1984-02-17 1985-08-22 Omi International Corp. (eine Gesellschaft n.d.Ges.d. Staates Delaware), Warren, Mich. Verfahren zur behandlung eines elektrisch nicht leitenden substrats vor der stromlosen metallisierung
US4592852A (en) * 1984-06-07 1986-06-03 Enthone, Incorporated Composition and process for treating plastics with alkaline permanganate solutions
US4684550A (en) * 1986-04-25 1987-08-04 Mine Safety Appliances Company Electroless copper plating and bath therefor
CN87100440B (zh) * 1987-01-27 1988-05-11 中国人民解放军装甲兵工程学院 在不导电材料上刷镀铜的方法
US4873136A (en) * 1988-06-16 1989-10-10 General Electric Company Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom

Also Published As

Publication number Publication date
FR2646583A1 (fr) 1990-11-02
DE4013094C2 (it) 1993-07-22
GB2232168B (en) 1993-06-16
HK13395A (en) 1995-02-10
DE4013094A1 (de) 1990-11-15
JPH0734501B2 (ja) 1995-04-12
IT1241204B (it) 1993-12-29
JPH02303181A (ja) 1990-12-17
FR2646583B1 (fr) 1992-01-24
GB9009796D0 (en) 1990-06-20
GB2232168A (en) 1990-12-05
IT9067307A1 (it) 1991-10-24

Similar Documents

Publication Publication Date Title
DE69033522D1 (de) Gedruckte Schaltung
DE69218344D1 (de) Herstellungsverfahren für eine gedruckte Schaltung
DE69033993T2 (de) Mehrschicht-Hybridschaltkreis
DE69028311D1 (de) Mehrlagenleiterrahmen für integrierte schaltungspackungen
FR2613170B1 (fr) Procede de fabrication de structures de circuit multicouche
KR910010653A (ko) 전자 장치의 리드 세정 방법
IT1195963B (it) Procedimento di fabbricazione di circuiti stampati
IT1221754B (it) Armadietto per circuiti stampati
KR880700457A (ko) 집적 회로 장치 제조 방법
DK144288D0 (da) Maskine til rensning af elektroniske kredsloeb
IT8422489A0 (it) Dispositivo per intercollegare circuiti stampati.
DE69209358D1 (de) Schaltung für äquivalente Induktivität
DE69207442T2 (de) Verfahren zum Herstellen von integrierten Schaltstrukturen
IT9067307A0 (it) Metodo per fabbricare piastrine per circuiti stampati
IT1137014B (it) Procedimento di fabbricazione di circuiti stampati
DE69023234T2 (de) Gedruckte schaltungsplatten.
IT1232863B (it) Procedimento a ciclo ridotto per la fabbricazione di circuiti stampati, e composizione per la sua attuazione
ITMI920259A0 (it) Processo selettivo per la produzione di piastre a circuiti stampati
DE69221455T2 (de) Zentrierschaltung
KR920021906U (ko) 회로기판 회로 검사 지그
DE69218035T2 (de) Verfahren zum Herstellen einer integrierten Schaltung
FR2648943B1 (fr) Circuit echantillonneur-bloqueur
FR2627328B1 (fr) Circuit microelectronique
IT8821476A0 (it) Metodo per la realizzazione di circuiti stampati multistrato.
KR860008515U (ko) 전자회로 교습기

Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19960424