IT1241204B - Metodo per fabbricare piastrine per circuiti stampati - Google Patents
Metodo per fabbricare piastrine per circuiti stampatiInfo
- Publication number
- IT1241204B IT1241204B IT67307A IT6730790A IT1241204B IT 1241204 B IT1241204 B IT 1241204B IT 67307 A IT67307 A IT 67307A IT 6730790 A IT6730790 A IT 6730790A IT 1241204 B IT1241204 B IT 1241204B
- Authority
- IT
- Italy
- Prior art keywords
- printed circuits
- manufacturing plates
- plates
- manufacturing
- printed
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34580489A | 1989-05-01 | 1989-05-01 |
Publications (3)
Publication Number | Publication Date |
---|---|
IT9067307A0 IT9067307A0 (it) | 1990-04-24 |
IT9067307A1 IT9067307A1 (it) | 1991-10-24 |
IT1241204B true IT1241204B (it) | 1993-12-29 |
Family
ID=23356553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT67307A IT1241204B (it) | 1989-05-01 | 1990-04-24 | Metodo per fabbricare piastrine per circuiti stampati |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPH0734501B2 (it) |
DE (1) | DE4013094A1 (it) |
FR (1) | FR2646583B1 (it) |
GB (1) | GB2232168B (it) |
HK (1) | HK13395A (it) |
IT (1) | IT1241204B (it) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5358602A (en) * | 1993-12-06 | 1994-10-25 | Enthone-Omi Inc. | Method for manufacture of printed circuit boards |
JP3393190B2 (ja) * | 1999-02-22 | 2003-04-07 | 有限会社関東学院大学表面工学研究所 | 銅パターンの選択的活性化方法およびこれに用いる活性化剤 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
US3698944A (en) * | 1970-06-15 | 1972-10-17 | Texas Instruments Inc | Method of obtaining phased growth of epitaxial layers |
US4662944A (en) * | 1972-07-11 | 1987-05-05 | Kollmorgen Technologies Corporation | Process and composition for sensitizing articles for metallization |
US4748056A (en) * | 1972-07-11 | 1988-05-31 | Kollmorgen Corporation | Process and composition for sensitizing articles for metallization |
US3976816A (en) * | 1973-10-29 | 1976-08-24 | Enthone, Incorporated | Activation of surfaces intended for electroless plating |
AR218223A1 (es) * | 1975-05-05 | 1980-05-30 | Borg Warner | Composicion cataliticamente activa |
DE2538571A1 (de) * | 1975-08-29 | 1977-03-03 | Siemens Ag | Verfahren zur metallisierung von duroplasten, insbesondere phenolharzen |
US4150171A (en) * | 1976-03-30 | 1979-04-17 | Surface Technology, Inc. | Electroless plating |
ZA77897B (en) * | 1976-04-13 | 1977-12-28 | Kollmorgen Corp | Liquid seeders and catalyzation processes for electroless metal deposition |
US4167596A (en) * | 1977-08-01 | 1979-09-11 | Nathan Feldstein | Method of preparation and use of electroless plating catalysts |
GB2013722A (en) * | 1978-01-19 | 1979-08-15 | Canning W Materials Ltd | Plating process |
US4233344A (en) * | 1978-07-20 | 1980-11-11 | Learonal, Inc. | Method of improving the adhesion of electroless metal deposits employing colloidal copper activator |
US4234628A (en) * | 1978-11-28 | 1980-11-18 | The Harshaw Chemical Company | Two-step preplate system for polymeric surfaces |
US4448811A (en) * | 1981-12-30 | 1984-05-15 | Omi International Corporation | Oxidizing agent for acidic accelerator in electroless metal plating process |
ZA843704B (en) * | 1983-07-01 | 1985-09-25 | Macdermid Inc | Oxidizing accelerator |
JPS6036674A (ja) * | 1983-08-08 | 1985-02-25 | Hitachi Chem Co Ltd | 無電解銅めつきに対する活性化法 |
DE3504455A1 (de) * | 1984-02-17 | 1985-08-22 | Omi International Corp. (eine Gesellschaft n.d.Ges.d. Staates Delaware), Warren, Mich. | Verfahren zur behandlung eines elektrisch nicht leitenden substrats vor der stromlosen metallisierung |
US4592852A (en) * | 1984-06-07 | 1986-06-03 | Enthone, Incorporated | Composition and process for treating plastics with alkaline permanganate solutions |
US4684550A (en) * | 1986-04-25 | 1987-08-04 | Mine Safety Appliances Company | Electroless copper plating and bath therefor |
CN87100440B (zh) * | 1987-01-27 | 1988-05-11 | 中国人民解放军装甲兵工程学院 | 在不导电材料上刷镀铜的方法 |
US4873136A (en) * | 1988-06-16 | 1989-10-10 | General Electric Company | Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom |
-
1990
- 1990-04-23 FR FR909005136A patent/FR2646583B1/fr not_active Expired - Fee Related
- 1990-04-24 JP JP2108576A patent/JPH0734501B2/ja not_active Expired - Lifetime
- 1990-04-24 IT IT67307A patent/IT1241204B/it active IP Right Grant
- 1990-04-25 DE DE4013094A patent/DE4013094A1/de active Granted
- 1990-05-01 GB GB9009796A patent/GB2232168B/en not_active Expired - Fee Related
-
1995
- 1995-02-06 HK HK13395A patent/HK13395A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB2232168B (en) | 1993-06-16 |
GB9009796D0 (en) | 1990-06-20 |
DE4013094C2 (it) | 1993-07-22 |
GB2232168A (en) | 1990-12-05 |
JPH02303181A (ja) | 1990-12-17 |
JPH0734501B2 (ja) | 1995-04-12 |
IT9067307A1 (it) | 1991-10-24 |
IT9067307A0 (it) | 1990-04-24 |
FR2646583A1 (fr) | 1990-11-02 |
FR2646583B1 (fr) | 1992-01-24 |
DE4013094A1 (de) | 1990-11-15 |
HK13395A (en) | 1995-02-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19960424 |