FR2613170B1 - Procede de fabrication de structures de circuit multicouche - Google Patents
Procede de fabrication de structures de circuit multicoucheInfo
- Publication number
- FR2613170B1 FR2613170B1 FR888803722A FR8803722A FR2613170B1 FR 2613170 B1 FR2613170 B1 FR 2613170B1 FR 888803722 A FR888803722 A FR 888803722A FR 8803722 A FR8803722 A FR 8803722A FR 2613170 B1 FR2613170 B1 FR 2613170B1
- Authority
- FR
- France
- Prior art keywords
- multilayer circuit
- circuit structures
- manufacturing multilayer
- manufacturing
- structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
- H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/029,112 US4772488A (en) | 1987-03-23 | 1987-03-23 | Organic binder removal using CO2 plasma |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2613170A1 FR2613170A1 (fr) | 1988-09-30 |
FR2613170B1 true FR2613170B1 (fr) | 1991-03-29 |
Family
ID=21847296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR888803722A Expired - Fee Related FR2613170B1 (fr) | 1987-03-23 | 1988-03-22 | Procede de fabrication de structures de circuit multicouche |
Country Status (7)
Country | Link |
---|---|
US (1) | US4772488A (fr) |
JP (1) | JPS63260197A (fr) |
KR (1) | KR880012127A (fr) |
CA (1) | CA1290201C (fr) |
DE (1) | DE3809476A1 (fr) |
FR (1) | FR2613170B1 (fr) |
GB (1) | GB2202676B (fr) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2007199C (fr) * | 1989-02-03 | 1993-05-18 | Satish S. Tamhankar | Atmosphere unique pour la cuisson de materiaux d'une pellicule epaisse, compatibles avec le cuivre |
US5302412A (en) * | 1989-02-03 | 1994-04-12 | The Boc Group, Inc. | Single atmosphere for firing compatible thick film material |
US5408574A (en) * | 1989-12-01 | 1995-04-18 | Philip Morris Incorporated | Flat ceramic heater having discrete heating zones |
US6060175A (en) * | 1990-09-13 | 2000-05-09 | Sheldahl, Inc. | Metal-film laminate resistant to delamination |
US5112462A (en) * | 1990-09-13 | 1992-05-12 | Sheldahl Inc. | Method of making metal-film laminate resistant to delamination |
US5137791A (en) * | 1990-09-13 | 1992-08-11 | Sheldahl Inc. | Metal-film laminate resistant to delamination |
US5405572A (en) * | 1992-03-18 | 1995-04-11 | Printron, Inc. | Reduction of oxides from metal powders wherein the de-oxidized powder is ready to be applied in its de-oxidized state directly from the furnace for fusing to a substrate |
US5468936A (en) * | 1993-03-23 | 1995-11-21 | Philip Morris Incorporated | Heater having a multiple-layer ceramic substrate and method of fabrication |
EP0759950B1 (fr) * | 1994-05-19 | 2000-05-24 | Minnesota Mining And Manufacturing Company | Articles en polymere a hydrophilie amelioree et leur procede de production |
US5820978A (en) * | 1995-11-09 | 1998-10-13 | Minnesota Mining And Manufacturing Company | Durability improved colloidal silica coating |
US6165309A (en) * | 1998-02-04 | 2000-12-26 | General Electric Co. | Method for improving the adhesion of metal films to polyphenylene ether resins |
US6245833B1 (en) | 1998-05-04 | 2001-06-12 | 3M Innovative Properties | Ceramer composition incorporating fluoro/silane component and having abrasion and stain resistant characteristics |
US6132861A (en) * | 1998-05-04 | 2000-10-17 | 3M Innovatives Properties Company | Retroreflective articles including a cured ceramer composite coating having a combination of excellent abrasion, dew and stain resistant characteristics |
US6352758B1 (en) | 1998-05-04 | 2002-03-05 | 3M Innovative Properties Company | Patterned article having alternating hydrophilic and hydrophobic surface regions |
US6265061B1 (en) | 1998-05-04 | 2001-07-24 | 3M Innovative Properties Company | Retroflective articles including a cured ceramer composite coating having abrasion and stain resistant characteristics |
WO2003032334A1 (fr) * | 2001-09-10 | 2003-04-17 | Noritake Co., Limited | Element en pellicule epaisse, son dispositif d'application et ses procedes de fabrication |
US7438829B2 (en) * | 2003-11-13 | 2008-10-21 | E.I. Du Pont De Nemours And Company | Thick film getter paste compositions for use in moisture control |
US20070154634A1 (en) * | 2005-12-15 | 2007-07-05 | Optomec Design Company | Method and Apparatus for Low-Temperature Plasma Sintering |
US20070138405A1 (en) * | 2005-12-16 | 2007-06-21 | 3M Innovative Properties Company | Corona etching |
US8124516B2 (en) * | 2006-08-21 | 2012-02-28 | Lam Research Corporation | Trilayer resist organic layer etch |
TW201118059A (en) * | 2009-11-20 | 2011-06-01 | Holy Stone Entpr Co Ltd | Manufacturing process for high precision ceramic substrate |
DE102011056186A1 (de) * | 2011-12-08 | 2013-06-13 | SÜDDEKOR GmbH | Verfahren zur Herstellung einer Schichtanordnung, Schichtanordnung sowie deren Verwendung |
CN105899720B (zh) | 2013-12-19 | 2017-12-08 | 3M创新有限公司 | 用于微生物除去和低压降过滤的层合制品及其制备方法和使用方法 |
EP3271067B1 (fr) | 2015-03-19 | 2020-10-21 | 3M Innovative Properties Company | Particules de perlite fonctionnalisées par des guanidines, articles contenant les particules, et procédés d'utilisation des particules et des articles |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4619836A (en) * | 1985-12-31 | 1986-10-28 | Rca Corporation | Method of fabricating thick film electrical components |
-
1987
- 1987-03-23 US US07/029,112 patent/US4772488A/en not_active Expired - Fee Related
-
1988
- 1988-03-17 CA CA000561726A patent/CA1290201C/fr not_active Expired - Fee Related
- 1988-03-22 DE DE3809476A patent/DE3809476A1/de not_active Withdrawn
- 1988-03-22 GB GB8806797A patent/GB2202676B/en not_active Expired - Fee Related
- 1988-03-22 FR FR888803722A patent/FR2613170B1/fr not_active Expired - Fee Related
- 1988-03-23 JP JP63067501A patent/JPS63260197A/ja active Pending
- 1988-03-23 KR KR1019880003100A patent/KR880012127A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR880012127A (ko) | 1988-11-03 |
US4772488A (en) | 1988-09-20 |
GB8806797D0 (en) | 1988-04-20 |
DE3809476A1 (de) | 1988-10-06 |
FR2613170A1 (fr) | 1988-09-30 |
CA1290201C (fr) | 1991-10-08 |
GB2202676A (en) | 1988-09-28 |
GB2202676B (en) | 1991-01-09 |
JPS63260197A (ja) | 1988-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2613170B1 (fr) | Procede de fabrication de structures de circuit multicouche | |
FR2584886B1 (fr) | Stratifie flexible pour circuit et procede de fabrication | |
FR2482818B1 (fr) | Circuit integre ceramique multicouche et son procede de fabrication | |
FR2543741B1 (fr) | Procede de fabrication de supraconducteurs | |
EP0074605A3 (en) | Method for manufacturing multilayer circuit substrate | |
FR2518863B1 (fr) | Procede de fabrication de plaquettes de circuits pour montages electroniques | |
FR2525388B1 (fr) | Procede de fabrication d'un circuit integre planaire | |
EP0631303A3 (fr) | Procédé de fabrication de circuits multicouches. | |
AU1625588A (en) | Process for fabricating multilayer circuit boards | |
FR2624654B1 (fr) | Circuit integre monolithique micro-ondes et procede de fabrication | |
FR2531010B1 (fr) | Stratifie decoratif et son procede de fabrication | |
BE890772A (fr) | Procede de fabrication d'un circuit integre | |
FR2526012B1 (fr) | Procede de fabrication d'un panneau feuillete | |
FR2490403B1 (fr) | Nouveau procede de fabrication de circuits integres | |
FR2625368B1 (fr) | Circuit integre monolithique micro-onde et procede de fabrication correspondant | |
FR2640254B1 (fr) | Procede de fabrication de trichloromonosilane | |
FR2531009B1 (fr) | Stratifie decoratif et son procede de fabrication | |
FR2536945B1 (fr) | Procede de fabrication d'une plaquette de circuit imprime | |
FR2582197B1 (fr) | Procede de fabrication de casques de | |
FR2609910B1 (fr) | Procede de fabrication de profiles metalliques alleges | |
BE888971A (fr) | Procede de fabrication de panneaux de construction | |
FR2643667B1 (fr) | Bloc de maconnerie isolant et porteur et procede de fabrication du bloc | |
FR2630617B1 (fr) | Procede de fabrication d'un substrat conducteur multicouche | |
IT8322002A0 (it) | Pannelli circuitali per microonde e procedimento per la loro fabbricazione. | |
DE3568359D1 (en) | Method for manufacturing multilayer board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |