KR880012127A - 다층 회로 구조물 제조방법 - Google Patents

다층 회로 구조물 제조방법 Download PDF

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Publication number
KR880012127A
KR880012127A KR1019880003100A KR880003100A KR880012127A KR 880012127 A KR880012127 A KR 880012127A KR 1019880003100 A KR1019880003100 A KR 1019880003100A KR 880003100 A KR880003100 A KR 880003100A KR 880012127 A KR880012127 A KR 880012127A
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KR
South Korea
Prior art keywords
layer
plasma
temperature
glass frit
organic
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Application number
KR1019880003100A
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English (en)
Inventor
루이스 핀치 해리
제이 탈러 배리
Original Assignee
하워드 에프·반덴버그
제네럴 일렉트릭 컴패니
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Application filed by 하워드 에프·반덴버그, 제네럴 일렉트릭 컴패니 filed Critical 하워드 에프·반덴버그
Publication of KR880012127A publication Critical patent/KR880012127A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

내용 없음

Description

다층 회로 구조물 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (6)

  1. 기판상에 후막 유전체 구조물을 제조하는 방법에 있어서, a) 기판상에 적당한 유리 프릿 및 유기 부유물을 포함한 후막 유전체 잉크 패턴을 용착시키는 단계;b) 패턴화된 층을 형성하도록 잉크를 건조시키는 단계;c) 층으로부터 실질적으로 유기 부유물을 제거하기에 충분한 시간동안 유기 부유물의 열분해 온도 이하의 온도에서 층을 플라즈마로 처리하는 단계;d) 유리 프릿이 용융될 때까지 불활성 분위기내에서 유리프릿이 유리 전이온도 또는 그 이상의 온도에서 층을 연소시키는 단계를 포함하며, 상기 플라지마는 이산화탄소 플라즈마인 것을 특징으로 하는 후막 유전체 구조물 제조방법.
  2. 제1항에 있어서, 플라즈마 처리가 100내지 200℃의 온도에서 실시되는 것을 특징으로 하는 방법.
  3. 제1항에 있어서, 플라즈마 처리층이 약 850내지 950℃의 온도에서 연소되는 것을 특징으로 하는 방법.
  4. 제1항에 있어서, 층이 질소에서 연소되는 것을 특징으로 하는 방법.
  5. 제1항에 있어서, 건조된 잉크가 이산화탄소 플라즈마로 처리되기 이전에, 유기 부유물 중량의 약 75%내지 99%가 제거되기에 충분한 시간동안 산소 플라즈마로 처리되는 것을 특징으로 하는 방법.
  6. 기판상에 후막 구리 전도체를 제조하는 방법에 있어서, a) 가판상에 적당한 유리 프릿 및 유기 부유물을 포함한 후막 유전체 잉크 패턴을 용착시키는 단계;b)패턴화된 층을 형성하도록 잉크를 건조시키는 단계;c) 층으로부터 실질적으로 유기 부유물을 제거하기에 충분한 시간동안 유기부유물의 열 분해 온도 이하의 온도에서 층을 플라즈마로 처리하는 단계;d) 유리 프릿이 용융될 때까지 불활성 분위기내에서 유리 프릿이 유리 전이온도 또는 그 이상의 온도에서 층을 연소시키는 단계를 포함하며, 상기 플라즈마는 이산화 탄소 플라즈마인 것을 특징으로 하는 후막 구리 전도체 제조방법.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019880003100A 1987-03-23 1988-03-23 다층 회로 구조물 제조방법 KR880012127A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/029,112 US4772488A (en) 1987-03-23 1987-03-23 Organic binder removal using CO2 plasma
US029112 1993-03-10

Publications (1)

Publication Number Publication Date
KR880012127A true KR880012127A (ko) 1988-11-03

Family

ID=21847296

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880003100A KR880012127A (ko) 1987-03-23 1988-03-23 다층 회로 구조물 제조방법

Country Status (7)

Country Link
US (1) US4772488A (ko)
JP (1) JPS63260197A (ko)
KR (1) KR880012127A (ko)
CA (1) CA1290201C (ko)
DE (1) DE3809476A1 (ko)
FR (1) FR2613170B1 (ko)
GB (1) GB2202676B (ko)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2007199C (en) * 1989-02-03 1993-05-18 Satish S. Tamhankar Single atmosphere for firing copper compatible thick film materials
US5302412A (en) * 1989-02-03 1994-04-12 The Boc Group, Inc. Single atmosphere for firing compatible thick film material
US5408574A (en) * 1989-12-01 1995-04-18 Philip Morris Incorporated Flat ceramic heater having discrete heating zones
US5137791A (en) * 1990-09-13 1992-08-11 Sheldahl Inc. Metal-film laminate resistant to delamination
US5112462A (en) * 1990-09-13 1992-05-12 Sheldahl Inc. Method of making metal-film laminate resistant to delamination
US6060175A (en) * 1990-09-13 2000-05-09 Sheldahl, Inc. Metal-film laminate resistant to delamination
US5405572A (en) * 1992-03-18 1995-04-11 Printron, Inc. Reduction of oxides from metal powders wherein the de-oxidized powder is ready to be applied in its de-oxidized state directly from the furnace for fusing to a substrate
US5468936A (en) * 1993-03-23 1995-11-21 Philip Morris Incorporated Heater having a multiple-layer ceramic substrate and method of fabrication
ATE193311T1 (de) * 1994-05-19 2000-06-15 Minnesota Mining & Mfg Polymergegenstand mit verbesserter hydrophiler eigenschaft und verfahren zu seiner herstellung
US5820978A (en) * 1995-11-09 1998-10-13 Minnesota Mining And Manufacturing Company Durability improved colloidal silica coating
US6165309A (en) * 1998-02-04 2000-12-26 General Electric Co. Method for improving the adhesion of metal films to polyphenylene ether resins
US6352758B1 (en) 1998-05-04 2002-03-05 3M Innovative Properties Company Patterned article having alternating hydrophilic and hydrophobic surface regions
US6245833B1 (en) 1998-05-04 2001-06-12 3M Innovative Properties Ceramer composition incorporating fluoro/silane component and having abrasion and stain resistant characteristics
US6132861A (en) * 1998-05-04 2000-10-17 3M Innovatives Properties Company Retroreflective articles including a cured ceramer composite coating having a combination of excellent abrasion, dew and stain resistant characteristics
US6265061B1 (en) 1998-05-04 2001-07-24 3M Innovative Properties Company Retroflective articles including a cured ceramer composite coating having abrasion and stain resistant characteristics
US7105200B2 (en) * 2001-09-10 2006-09-12 Noritake Co., Limited Method of producing thick-film sheet member
US7438829B2 (en) * 2003-11-13 2008-10-21 E.I. Du Pont De Nemours And Company Thick film getter paste compositions for use in moisture control
US20070154634A1 (en) * 2005-12-15 2007-07-05 Optomec Design Company Method and Apparatus for Low-Temperature Plasma Sintering
US20070138405A1 (en) * 2005-12-16 2007-06-21 3M Innovative Properties Company Corona etching
US8124516B2 (en) * 2006-08-21 2012-02-28 Lam Research Corporation Trilayer resist organic layer etch
TW201118059A (en) * 2009-11-20 2011-06-01 Holy Stone Entpr Co Ltd Manufacturing process for high precision ceramic substrate
DE102011056186A1 (de) * 2011-12-08 2013-06-13 SÜDDEKOR GmbH Verfahren zur Herstellung einer Schichtanordnung, Schichtanordnung sowie deren Verwendung
JP6157751B2 (ja) 2013-12-19 2017-07-05 スリーエム イノベイティブ プロパティズ カンパニー 微生物除去及び低圧力低下の濾過を行うための積層物品、その製造方法、並びに使用方法
US10427131B2 (en) 2015-03-19 2019-10-01 3M Innovative Properties Company Guanidine-functionalized perlite particles, articles containing the particles, and methods of using the particles and articles

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4619836A (en) * 1985-12-31 1986-10-28 Rca Corporation Method of fabricating thick film electrical components

Also Published As

Publication number Publication date
DE3809476A1 (de) 1988-10-06
FR2613170A1 (fr) 1988-09-30
CA1290201C (en) 1991-10-08
GB2202676A (en) 1988-09-28
US4772488A (en) 1988-09-20
GB2202676B (en) 1991-01-09
JPS63260197A (ja) 1988-10-27
GB8806797D0 (en) 1988-04-20
FR2613170B1 (fr) 1991-03-29

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